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March 14-16,2018
Shanghai New International Expo Centre

Dr. Hsing-Huang TSENG

Dr. Hsing-Huang TSENG
Texas State University

Hsing-Huang Tseng He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) and served as a Distinguished Lecturer for the IEEE Electron Devices Society. He received the Ph.D. degree from Princeton University, Princeton, NJ. In 1985, he joined the Advanced Products Research and Development Laboratory (APRDL) of Motorola, where he received a Motorola High Impact Technology Award and a Bravo Award for his technical contributions. He became a Distinguished Member of Technical Staff and a Motorola Master Innovator. He is the holder of 29 U.S. patents. He was the Chief Technologist of the Front End Processes Division, SEMATECH, Inc., Austin, TX (2005-2009) before joining Texas State University as a professor of Electrical Engineering. He is the author or co-author of more than 140 papers for professional journals and conferences in semiconductor area.

Dr. Tseng has served as a Committee Member in international conferences such as the IEEE International Electron Devices Meeting (IEDM, 1998-1999 and 2008-2009) and the IEEE Semiconductor Interface Specialists Conference (SISC, 1992-1995 and 2003-2005). He was the Symposium Chair of the 2007 International Symposium of VLSI-Technology, System, and Applications and the General Chair of the 3rd and 4th International Symposium on Advanced Gate Stack Technology held in 2006 and 2007. He also served as a Member of International Advisory Committee of China Semiconductor Technology International Conference (CSTIC) (2007-), Co-chair of the ITRS Thermal, Thin films, and Doping Technical Working Group (2006-2008), a technical committee member of the 2008 International Conference on Solid State and Integrated Circuit Technology (ICSICT 2008), and a technical committee member of the 8th International Workshop on Junction Technology (IWJT-2008). He was the Guest Editor of Special issue of Journal of Microelectronic Engineering, Volume 85, Issue 1, January 2008 and Volume 86, Issue 3, March 2009.