Committee Members

International Advisory Committee Members

Dr. T. C. Chen
Chairman
IBM Fellow and VP, IBM T.J. Watson Research Center, USA
   
Dr. Minhwa Chi
Co-Chair
Senior VP, SMIC
   
Dr. Philip Wong
Co-Chair
Stanford University, USA
   
  Dr. Swami Mathad
Co-Chair
Tech Consulting, USA
   
Dr. Georg Bednorz
Member
IBM Fellow, Nobel Laureate, Switzerland
   
Dr. Qingyuan Han
Member
Hans Consulting International, USA
   
Dr. Kinam KIM
Member
President and CEO, Samsung Institute of Advanced Technology, Korea
   
Mrs. Ying Shi
Member
ICMTIA, China
   
Dr. Hsing-Huang Tseng
Member
Texas State University
   
Dr. Hailing Tu
Member
GRINM, China
   
Dr. Shichang Zou
Member
Chinese Academy of Sciences, China
   
Dr. Edward Y. Chang
Member
National Chiao Tung University, Taiwan, China
   

Steering Committee Advisors
Mr.Lung Chu
President,SEMI China
Vice President,SEMI


   
Dr. Hiroshi IWai
Member
Tokyo Institute of Technology, Japan
   
Dr. Tomi T. Li
Member
National Taiwan Central University
   
Dr.David Huang
Member
Pall Inc. USA


Conference Chair and Co- Chairs
Dr. Ru Huang
Chairwoman
Peking University, China
   
Dr. Cor Claeys
Co-Chair
IMEC, Belgium
   
Dr. Hanming Wu
Co-Chair
SMIC, China
   
Dr. Qinghuang Lin
Co-Chair
IBM, USA
   
Dr. Steve Liang
Co-Chair
Jiangsu Changjiang Electronic Technology Co., Ltd, China
   
Dr. Peilin Song
Co-Chair Publicity
IBM, USA
   
Mr. Zhen Guo
Co-chair
Intel, USA
   


Symposium Chair:
Dr. Ru Huang
Chairman
Peking University, China
   
Dr. Kafai Lai
Chairman
IBM, USA
   
Dr. Ying ZHANG
Chairman
Applied Materials, USA
   
Mr. Zhen Guo
Chairman
Intel, USA
   
Dr. Yuchun Wang
Chairman
Anji Microelectronics, China
   
Dr. Peilin Song
Chairman
IBM, USA
   
Dr. Steve Liang
Chairman
Jiangsu Changjiang Electronics Technology Co., Ltd, China
   
Dr. Qinghuang Lin
Chairman
IBM, USA
   
Dr. Yiyu Shi
Chairman
Missouri University of Science and Technolog, USA
   
Dr. Hsiang-Lang Lung
Poster Chairman
Macronix International Ltd., Hsinchu, Taiwan
   


Symposium I: Device Engineering and Technology
Dr. Ru Huang
Chairwoman
Peking University, China
   
Dr. Cor Claeys
Co-Chair
IMEC, Belgium
   
Dr. Minhwa Chi
Co-Chair
Senior VP, SMIC
   
Dr. Chung Lam
Co-Chair
Principle Engineer, IBM, USA
   
  Prof. Jong-Ho Lee
Member
Seoul National University, Korea
   
Dr. Ming Liu
Co-Chair
IME, CAS, China
   
  Dr. Yimao Cai
Member
Peking University, China
   
Dr. Shaoning Mei
Member
Wuhan Xinxin Semiconductor Manufacturing Corp
   
  Wensheng Qian
Member
Director, HHGrace
   
Dr. Huiling Shang
Member
TSMC
   
  Dr. Zhiqiang Wei
Member
Panasonic, Japan
   
Dr. Hong Wu
Member
SMIC, China
   
Dr. Huaqiang Wu
Member
Microelectronics, Tsinghua University, Beijing, China
   
Dr. Frank Bin Yang
Member
Qualcomm, USA
   
Dr. Huilong Zhu
Member
IME, CAS, China
   


Symposium II: Lithography and Patterning
Dr. Kafai Lai
Chairman
IBM, USA
   
  Dr. Ken Wu
Co-Chair
SMIC, China
   
Dr. Linyong (Leo) Pang
Co-Chair
VP. D2S Inc.
   
Mr. Ma Xiaoming
Member
Dow Chemical
   
  Dr. Zhimin Zhu
Member
Brewer Science, USA
   
  Dr. Zhibiao Mao
Member
Huali Semiconductor Manufacturing Company, China
   
  Dr. Yayi Wei
Member
Chinese Academy of Science
   
Motokatsu.Imai
Member
SEAJ (Semiconductor Equipment Association of Japan)
   
Shiyuan Liu
Member
Huazhong University of Science and Technology , China
   
  Hai Deng
Member
Fudan University, China
   
Dr.Yuyang Sun
Member
Mentor Graphics,USA
   
Wang Yueh
Member
Intel OR, USA
   


Symposium III: Dry &Wet Etch and Cleaning
Dr. Ying ZHANG
Chairman
VP, Applied Material, USA
   
Dr. Maxime Darnon
Co-Chair
French Institute for Scientific Research (CNRS), France
   
Dr. Yue Kuo
Co-Chair
Texas A&M University, USA
   
  Dr. Tom Ni
Member
AMEC, China
   
Mr. Jinrong Zhao
Member
North Microelectronics, China
   
Dr. Sebastian Engelmann
Member
IBM T.J.Watson Research Center, USA
   
Dr. George Totir
Member
IBM T.J.Watson Research Center, USA
   
Dr. Masahiro Sumiya
Member
Hitachi High-Technologies Corp., Japan
   
Dr. Denis Shamiryan
Member
Global Foundries, USA
   
  Dr. Steven Zhang
Member
SMIC, China
   
Dr. Kaidong Xu
Member
IMEC, Belgium
   


Symposium IV: Thin film, Plating and Process Integration
Dr. Zhen Guo
Chairman
Intel, China
   
Dr. Beichao Zhang
Co-Chair
SMIC, China
   
  Mr. Xiaoping Shi
Co-Chair
IMEC, Belgium
   
Dr. Chao Zhao
Co-Chair
IME, CAS, China
   
Dr. Huang Liu
Co-Chair
Global Foundries, USA
   
Dr. Jiang Yan
Co-Chair
Institute of Microelectronics, CAS
   
Dr. Ran Liu
Co-Chair
Fudan University, China
   
Dr. Sowmya Krishnan
Co-Chair
SEMITRAC, USA
   
Dr. Jason Tian
Member
Nikon Precision, China
   
Dr. Jon REID
Member
Novellus, USA
   
Prof. Yu-Long Jiang
Member
Fudan University, Shanghai
   
Dr. Li-Qun Xia
Member
AMAT, USA
   
Dr. Julian Hsieh
Member
ASM, Taiwan
   
Dr.Chih-Chao Yang
Member
IBM Research
   
Dr. Jianhua Ju
Member
Assistant Director, SMIC Tech R&D
   
Dr. Massayasu Tanjyo
Member
Nissin Ion Equipment, Japan
   
  Dr. Ganming Zhao
Member
Applied Materials
   
Dr. Zheyao Wang
Member
Tsinghua University, China
   
Dr. Da Zhang
Member
Higon, USA
   
Dr. Larry Zhao
Member
Lam Research, USA
   
Dr. Jiaxiang Nie
Member
Lam Research, China
   

Symposium V: CMP and Post-Polish Cleaning
Dr. Yuchun Wang
Chairman
Anji Microelectronics, China
   
Dr. Jingxun Fang
Co-Chair
Huali Microelectronics Corporation, China
   
Dr. Kuochun Wu
Co-Chair
Cabot Microelectronics, Asia
   
Dr. Paul-Chang Lin
Co-Chair
SMIC, China
   
Dr. David Huang
Member
Pall Corporation, USA
   
Dr. Jin-Goo Park
Member
Hanyang University, Korea
   
Dr. Kailiang Zhang
Member
Tanjin University of Science & Technology, China
   
Dr. Mahadevaiyer Krishnan
Member
IBM, USA
   
  Dr. Shoutian Li
Member
Anji Microelectronics, China
   
Dr. XinChun Lu
Member
Professor,Tsinghua University , China
   
  Dr. Wen-Chiang Tu
Member
Applied Materials, USA
   

Symposium VI: Metrology, Reliability and Testing
Dr. Peilin Song
Chairman
IBM, USA
   
Dr. Baozhen Li
Co-Chair
IBM System and Technology Group, USA
   
Dr. Frank Feng
Member
Mentor Graphics Corporation, America
   
Dr. Yiping Xu
Member
Sr.Vice President ahd CTO,Raintree Technologies Corp
   
Dr. Yuhua Cheng
Member
Peking University, China
   
Dr. Francis Jen
Member
KLA Tencor, China
   
Dr. Kelvin Xia
Member
Advantest, China
   
Dr. Srinivas Raghvendra
Member
Synopsys, USA
   
Dr. Xiaowei Li
Member
Chinese Academy of Sciences
   
Dr. Yu Huang
Member
Mentor Graphics, USA
   
Dr. Jian-fu Zhang
Member
Liverpool John Moores University, England
   
Dr. Houken Tseng
Member
Teradyne, Greater China,China
   
  Dr. Huaguo Liang
Member
Hefei University of Technology, China
   

Symposium VII: Packaging and Assembly
Dr. Steve Liang
Chairman
Jiangsu Changjiang Electronics Technology Co., Ltd, China
   
Dr. Yifan Guo
Co-Chair
VP of Engineering ,ASE Shanghai
   
Dr. Huili Fu
Co-Chair
Chief Packaging Expert,HiSilicon
   
  Dr. Wenhui Zhu
Member
Professor,Central South University
   
  Dr.John Rowland
Member
VP of Engineering,Spreadtrum
   
Dr. Roy Yu
Member
IBM, Watson Research Center, USA
   
Dr. Yishao Lai
Member
ASE. Taiwan, China
   
Dr. Jing Shi
Member
Oracle, USA
   
Dr. Young Do Kweonbr
Member
Samsung, Korea
   
Prof. Mingliang Huang
Member
Dalian University of Technology, China
   

Dr. Renzhe Zhao
Member
Huawei, China
   
Dr. Mark Huang
Member
SUZHOU SPEED SEMICONDUCTOR, CHINA
   
Dr. Dan Tracy
Member
SEMI, USA
   
Dr. John Yuanlin Xie
Member
Altera Corp., San Jose, CA, USA
   
  Dr. Hong SHI
Member
Xilinx
   
Dr. Tim Bao
Member
Air Products and Chemicals
   
  Dr. Tim Chen
Member
Yantai Darbond Technology Co., Ltd.
   
Dr. Daniel Lu
Member
Henkel
   


Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
Dr. Qinghuang Lin
Chairman
IBM, USA
   
Dr. Hyungjun Kim
Co-Chair
Yonsei University, South Korea
   
Dr. Hsiang-Lang Lung
Co-Chair
Macronix International Ltd., Hsinchu, Taiwan
   
  Dr. Jingwei Bai
Member
Tsinghua University, China
   
Dr. Edward Y. Chang
Member
National Chiao Tung University, Taiwan, China
   
Kangguo Cheng
Member
IBM, USA
   
Dr. Jinn P. Chu
Member
National Taiwan University of Science and Technology, China
   
  Thomas Otto
Member
Acting Director of the Fraunhofer Institute for Electronic Nano Systems ENAS Chemnitz, Germany
   
Dr. Zheyao Wang
Member
Tsinghua University, China
   
  Dr. Daniele Lelmini
Member
Politecnico Di Milano, Italy
   
  Wei Wang
Member
Peking University, China
   
Dr. Fuhua Yang
Member
Institute of Semiconductor, Chinese Academy of Sciences, China
   
Dr. Wang Yueh
Member
Intel, USA
   


Symposium IX: Circuit Design, Systems and Applications
Dr. Yiyu Shi
Chair
Assistant Professor, Electrical and Computer Engineering Department, Missouri University of Science and Technolog, USA
   
Dr. Dong Chen
Co-Chair
IBM T.J. Watson Research Center, USA
   
Dr. Wenjian Yu
Co-Chair
Associate Professor, Department of Computer Science and Technology, Tsinghua University, China
   
Dr. Jinjun Xiong
Member,
IBM T.J. Watson Research Center, USA
   
  Mr. Guanming Huang
Member,
Synopsys Inc, USA
   
  Dr. Pingqiang Zhou
Member
Shanghai Tech University
   
Dr. Masanori Hashimoto
Member
Osaka University, Japan
   
Dr. Tsung-Yi Ho
Member
National Cheng Kung University, Taiwan
   
Dr. Weikang Qian
Member
University of Michigan-Shanghai Jiao Tong University Joint Institute, China
   
Dr.Haizhou Yin
Member
IME, CAS, China
   
Dr. Guangyu Sun
Member
Peking University, China
   
  Dr. Zhiru Zhang
Member
Assistant Professor, School of Electrical and Computer Engineering, Cornell University, USA
   


Symposium X: Si Materials and Photovoltaic Technology
Prof. Frank Liu
Chair
Shanxi Normal University, China
   
Dr. David Huang
Co-Chair
Pall Inc,USA
   
Dr. Qi Wang
Co-Chair
GCL SI
   
  Dr. Qiang John
Co-Chair
GCL Executive,China
   
Dr. Yuepeng Wan
Member
LDK Solar, China
   
Dr. Liang Wu
Member
GCL Applied Industrial Research Institute Ltd
   
  Dr. Ray Lian
Member
Solabuzz, China
   
Prof. Meng Tao
Member
Arizona State University, USA
   
Dr. Zhigang Rick Li
Member
Researcher, DuPont, USA
   
Prof. Paul R. Berger
Member
Ohio State University, USA
   
  Dr. Chris Lv
Member
Trina Solar, China
   

Contact Us

Kelly Zhang, SEMI China
Tel: 86.21.6027.8556
Fax: 86.21.6027.8511
Email:
 kzhang@semi.org
 
Stacy Zhang, SEMI China
Tel: 86.21.6027.8552
Fax: 86.21.6027.8511
Email:
 szhang@semi.org