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June 27-29, 2020
Shanghai New International Expo Centre

何军 / Jun He

Dr. Jun He 何军 博士
VP, TSMC
副总裁,台积电

个人简介 / Biography

Dr. Jun He currently is the head of TSMC's Corporate Quality & Reliability organization. He is responsible for end-to-end coverage from incoming materials quality, IP/new technology reliability and qualification as well as manufacturing excellence. Prior to joining TSMC, he served as the senior director at Intel Corporation in charge of overall quality & reliability of Technology Development and Manufacturing including Intel’s fab, assembly and test R&D and worldwide manufacturing operation.

Dr. He has over 25 years industry experience directly engaged in technology development on Si, assembly and test process. He has 40 technical publications and holds more than 30 U.S. /Foreign patents range from Reliability DR, test patterns for defect screen, Si process innovations and circuit designs. His key contribution to the semiconductor industry includes laser assisted die singulation enabling low-k dielectric; die edge damage monitor; ultra-high density metal fuse technology; advanced passivation process for Redistribution Interconnects and tamper resistant fuse design/architecture for information security.

Dr. He received his B. S. degree in Physics and Ph.D. in Material Science from the University of California, Santa Barbara.