Monday, March 16, 2020 Shanghai International Convention Center
Meeting Room: 5B+5C

Joint Session: Symposium VII and Symposium VIII-3D Heterogeneous Integration
Session Chairs: Qinghuang Lin

**10:00–10:30 Diversity, Interconnect and Phase change: Semiconductor heterogenous integration and supper intelligence in the post Moore's Law era
  Hu Chuan, Guangdong Academy of Sciences
**10:30–11:00 3D Heterogeneous Integration
  Bill Bottoms, 3MTS
**11:00–11:30 Recent Achievements and New Technologies for High Performance Mems Sensors and Actuators
  Philippe Robert, CEA-LET
**11:30–12:00 3D Packaging Development for HPC and 5G Applications
  Dr. Chiang Shiuh-Kao, Prismark