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Date: Monday, March 14, 2016
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

Ever-increasing expectations for mobile device performance are driving the need for more versatile mobile memory solutions and enhanced mobile infrastructure. The Forum will focus on JEDEC standards, including those for low power DRAMs, and the importance of ultra-low power devices in the mobile and IOT markets.

Organizer:

SEMI
JEDEC

09:00-09:20 Registration
09:20-09:25

Welcome Remarks

Allen Lu, Ph.D
President, SEMI China

09:25-09:30

Welcome Remarks

Mian Quddus
Chairman, JEDEC Board of Directors

09:30-10:00

Embracing the Next Wave: Moving from Convergence to Divergence

Min Jeung Cho,
Principal Engineer, Samsung

PPT Download

10:00-10:30

Advanced Package Solutions & Its Challenges for Mobile and IoT/Wearable Devices

Albert Lan
Senior Director, SPIL

PPT Download

10:30-11:00

Mobile Market Low-Power Trends From Smartphone to Health, Wearable, IoT, and Automotive

Hung Vuong
Director of Standard Lead, Qualcomm

PPT Download

11:00-11:30

New Era 3D-Interconnection in SiP Technology

CP Hung
Vice President, Corporate R&D, ASE Group

11:30-12:00

Mobile & IOT Market Trends and Memory Requirement

Mikeson Wang
ARM

PPT Download

12:00 -13:00 Break
13:00-13:30

Introducing the Next Generation of Mobile Storage: eUFS and the UFS Card

HeeChang Cho
SW Architect/Principal Engineer, Samsung

PPT Download

13:30-14:00

Low Power DRAM Evolution

Dean Gans
Mobile Systems Architect, Micron

PPT Download

14:00-14:15

Low Power and High Bandwidth Memory Trend

Sungmin(Sam) Park
Director, SK Hynix

PPT Download

14:15-14:30

3D NAND in Mobile

Sang Don Lee
Senior Manager, K Hynix

PPT Download

14:30-15:00

Caching Mechanisms for Mobile and IOT Devices

Masafumi Takahashi
Senior Manager of Memory System Development Dep,
Toshiba

PPT Download

15:00-15:30

Assuring Customer Satisfaction and Competitive Advantage with the UFS Logo

Perry Keller
Digital Applications and Standards Program Lead, Keysight

PPT Download

15:30-16:00

Get it right the first time!  How to test for compliance to the LPDDR4 JEDEC Standard.

Barbara Aichinger
Vice President, Future Plus Systems

PPT Download

16:00-16:30

Architectural Options for LPDDR4 Implementation in Your Next Chip Design

Marc Greenberg
Director of Product Marketing for DDR Controller IP, Synopsys

PPT Download

16:30-17:00

Present and future packaging solutions for the Mobile/IoT Industry

Andrew Peng
Chief Strategy Officer, Vice President of North American & European Business Development, Nantong Fujitsu Microelectronics

PPT Download

  *Agenda is subject to change

Type Before Feb.20 with Advanced Payment(Early Bird) After Feb.20 and On-site
Attendees RMB 800 per person RMB 1,000 per person
Speakers Free Free
  * Lunch excluded

 Sponsor :         


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Louisa Li | 李兰霞 Jesse Zhang | 张文达
Tel: 86.21.6027.8566 Tel: 86.21.6027.8558
Email: [email protected] Email: [email protected]