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+86.21.6027.8500
English
March 14-16,2018
Shanghai New International Expo Centre

Build China IC Manufacturing Ecosystem

There are
00 days 00 hours 00 minutes 00 seconds

Date: Wednesday, March 16, 2016
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

Moore's law is continuing, memory and foundry are the engine of investment, and IOT cultivates new market demand for chips. The strategic advantage of "close to market" makes it possible for IC design, application and manufacturing companies to work together like virtual IDMs. SEMI will invite experts from the IC design, manufacturing, equipment and material industry, to discuss about how to enhance and integrate the IC ecosystem in China. Four segments of the forum: Advanced manufacturing, Advanced technology, Advanced packaging.

08:30-09:15 Registration

Moderator:

Haijun Zhao    
COO, SMIC

09:15-09:20

Welcome Remark

叶甜春
中国科学院微电子研究所所长

09:20-09:25

Welcome Remark

Steve Kelley
President & CEO, Amkor Technology

09:25-09:50

把握时代契机,推进国产半导体装备业快速发展

赵晋荣   
北京七星华创总经理

PPT Download

09:50-10:15

The Development Requirements of Semiconductor Equipments for China IC industry

Dr. Shawming Ma
Deputy General Manager, Plasma Product Group of Mattson Technology

PPT Download

Session 1:Advance Manufacturing
10:15-10:40
Collaborate to Win in China Market
 
Sunny Hui
SMIC Senior VP, Worldwide Marketing
10:40-11:05
 
 
PPT Download
11:05-11:30

Towards 10nm and Beyond

Hayakawa Takashi
Senior Manager, Technology Marketing Department, Advanced Semiconductor Technology Division, Tokyo Electron Limited

11:30-11:55

Leading the Industry’s development by building a comprehensive financial service platform

杜洋
芯鑫融资租赁有限责任公司总裁

PPT Download

11:55-13:00 Lunch Break
Session2: Advance technology

Moderator:

Canyuan Wang
Vice president, Tokyo Electron (Shanghai) Limited Chairman

13:00-13:20

Healthy and Strong China IC Ecosystem Needs Critical Materials

Shumin Wang
安集微电子CEO

13:20-13:45

Equipment Technology Development in an Era of More-than-Moore (MTM) and The Internet-of-Things (IoT)

Dr. ZHENG YUAN
Vice president and general manager for 200mm Semi and Subfab Products in the Equipment Product Group (EPG) for Applied Global Services at Applied Materials, Inc.

PPT Download

13:45-14:05
THE INTERNET OF THINGS

Rich Ray
Product Line Director, Honeywell Electronic Materials

14:05-14:30

TEL’s New Approach to Chinese Market Demand

Kenny Sunohara
VP and FS BU GM, TEL

14:30-14:50

Dr. Tom Ni
VP & Etch Product Business Group DGM, Advanced Micro-Fabrication Equipment Inc. (AMEC)

14:50-15:15

Enhancing Capital Efficiency and Fab Productivity Throughout the Fab Lifecycle

Ms. Michelle Bourke
Strategic and Technical Marketing Director 
Customer Support Business Group
LAM

15:15-15:35

Promote the Competition of Local Equipment.

Zong Runfu
CEO, Kingsemi

PPT Download

Session 3:Advance Packaging

Moderator

Dr. Yifan Guo 
Vice President of Engineering, ASE Shanghai

15:35-16:00

Innovations for a strong OSAT supply chain

Dr. Steve Liang
CTO and VP of Jiangsu Changjiang Electronics Technology Co., Ltd, China

16:00-16:25

Wafer Level Fan-out and Embedded Technology

Albert LAN
Senior Director of Engineering Center of SPIL

PPT Download

16:25-16:50

New Generation SiP for Miniaturization

Dr. KK Kuo
Director, R&D, ASE

17:00-17:10 Lucky Draw: SPIL (Apple Watch Sport  and iPad mini 4)

  *Agenda is subject to change

Type Before Feb.20 with Advanced Payment(Early Bird) After Feb.20 and On-site
Attendees RMB 800 per person RMB 1,000 per person
Speakers Free Free

  

Contact Us:  
Mortal Li | 李 钢 Jesse Zhang | 张文达
Tel: 86.21.6027.8569 Tel: 86.21.6027.8558
Email: mli@semi.org Email: wdzhang@semi.org