Symposium Chair: Dr. Ying Zhang


** to designate keynote talk - 30 min      
* to designate invite talk - 25 min
  to designate regular talk - 15 min

Monday, March 24, 2025 Shanghai International Convention Center

Session I: Lithograpy/Etch joint session (II & III)
Meeting Room:
Session Chair:
13:30-13:35 Opening Remarks
  Leo Pang / Zhongwei Jiang
**13:35-14:05 TBD
   
**14:05-14:35 Challenges and latest developments on photo resisters for advanced logic and memory technology nodes
  Allen Chang, JSR Taiwan, China
**14:35-15:05 The integration and process challenges and solutions for advanced technology nodes
  David Xiao, Qianmo Microelectronics
15:05-15:20 Coffee Break
   

Session II: Advanced Patterning
Meeting Room:
Session Chair:
*15:20-15:45 Patterning challenges and perspectives solutions in advanced DRAM technology nodes
  Hongbo Sun, Beijing Chaoxian Memory Research Institute
*15:45-16:10 The pattern solutions for GAAFET
  Min Xu, Fudan University
16:10-16:25 A STUDY OF MININUM ISO-DENSE ETCHING CD BIAS LOADING PERFORMANCE ON ADVANCED LOGIC TRENCH PROCESS
  Chia Lin Lu, Applied Materials
16:25-16:40 Analysis of Crucial Factors Influencing on Selectivity of SiGe/Si Stack Etching
  Anton Kobelev, Suzhou STR Software Technology Co., Ltd
16:40-16:55 Atomistic simulation of dry etching process: Interactions between high-energy particles and solid surface
  Yang Wang, Southwest Jiaotong University
16:55-17:10 The influence of Mandrel materials on graphic transmission in patterning process
  Jun Luo, Beijing NAURA Technology Group Co., Ltd.
   

Tuesday, March 25, 2025 Shanghai International Convention Center
Meeting Room:

Session III: FEOL/MOL Etching
Session Chair:
08:45-09:00 Vertical and Horizontal Profile Control in STI Etch
  Fansheng Wang, Applied Materials China
*09:00-09:25 Effects of ALE Capabilities and DC Pulsing in Microwave ECR Plasma on Etching Processes for Cutting-Edge Logic LSI
  Masaru Izawa, Hitachi High-Tech Corporation
09:25-09:40 Ultra-high steep Ion Beam Etching by Employing Highly Dynamic Holder
  Baosheng Du, Suzhou Youlun Vacuum Equipment Technology Co., Ltd.
*09:40-10:05 Pulsing Plasma Application for Advanced Dry Etch Process
  Zhongwei Jiang, Beijing NAURA Technology Group Co., Ltd.
10:05-10:20 Coffee Break
   

Session IV: Memory Applications
Session Chair:
*10:20-10:45 Latest new results and developments of TSV for advanced 3DIC applications
  Lv Chao, Beijing NAURA Technology Group Co., Ltd.
10:45-11:00 Study on SiC Trench Etching with High Aspect Ratio
  Shiling Wang, Shanghai BangXin Semi Technology Co., Ltd.
11:00-11:15 Modeling the Charging Effect on the Twisting Defects during High Aspect Ratio Etching of Dielectrics
  Yuxuan Zhai, Institute of Microelectronics, Chinese Academy of Sciences
11:15-11:30 DTI Depth Uniformity Tuning by Ra and Gas Distribution
  Lei Sun, Applied Materials China
11:30-11:45 Cleaning and Assessing Particles from Polymer Materials used in Semiconductor Manufacturing Tool
  Ling Wang, Ferrotec Technology Development (Shanghai) Co. Ltd
11:45-12:00 Study on the optimization of via contact resistance (Rc) by the collocation of gas parameters in AIO etching
  Gui Cong, Nexchip Semiconductor Corporation
12:00-13:30 Lunch Break
   

Session V: BEOL Etching
Session Chair:
*13:30-13:55 Mechanism and Effect of 4-Level RF Pulsing on Etching Process in Advanced Nodes
  Yang Ding, Advanced Micro-Fabrication Equipment Company Inc.
13:55-14:10 Through-pitch CD Control with TIN Metal Hardmask Etch Process for Logic BEOL Patterning
  Litian Xu, Beijing NAURA Technology Group Co., Ltd.
14:10-14:25 Process Window Optimization for Gate Etch Process of 2D NAND
  LiFei Sun, Lam Research
14:25-14:40 Coffee Break
   

Session VI: Wet Etch and other etching
Session Chair:
*14:40-15:05 Ion Beam Etching as a Patterning Solution for Memory Applications
  Yuxing Yang, Jiangsu Leuven Instruments Co., Ltd.
15:05-15:20 Study on Wet Alkaline Chemicals Etching of Hole Dummy Polysilicon in 3D Multi-Layer Structure
  Jiao Jin, Beijing Superstring Academy of Memory Technology
15:20-15:35 Novel IPA filtration technology for Advanced Wet Clean
  Jun Lu, Hangzhou Cobetter Filtration Equipment Co., Ltd
15:35-15:50 Investigating the Etch Performance of Zirconium-Based Photoresist for Direct Silicon Oxide Etching
  Ahmad Hassan Siddique, Tsinghua University
15:50-16:05 SiO2 etch rate drift investigation and mitigation in an ICP Al etch chamber
  Chenming Xu, Jiangsu Leuven Instruments Co., Ltd.
16:05-16:20 Numerical Modelling on FFU Arrangements Optimization within Cleanroom during Preventive Maintenance
  Chengxi Yao, Sungkyunkwan University
16:20-16:35 Etching surface and dimension control for IGZO TFT in 3D memory device
  Zehua Hei, Beijing Superstring Academy of Memory Technology
16:35-16:50 SiC Etch with Inductively Coupled Plasma for Power Device Applications
  Haiyang Lv, Advanced Micro-Fabrication Equipment Company Inc.
16:50-17:05 The PMOS Silicon Recess Process Control With Evolution of Trench Morphology
  Fan Yu, Beijing NAURA Technology Group Co., Ltd.


Poster Session:
  A study of wet cleaning methods for tungsten high aspect ratio dry etch
  Chaoyang Guan, Beijing Superstring Academy of Memory Technology
  Metallic Contamination Control Challenges and VPD System Innovations for Hydrophilic Wafer Substrates
  Qiao Huang, Jiangsu Leuven Instruments Co., Ltd.
  ALE like Post-etch SiC Surface Treatment
  Chunxiang Guo, Jiangsu Leuven Instruments Co., Ltd.
  A Study of Wafer Arcing Issue in Dielectric Via Etching
  Taojun Zhang, Jiangsu Leuven Instruments Co., Ltd.
  Defect engineering in 2D materials via ion beam irradiation
  Yuxin Yang, Advanced Micro-Fabrication Equipment Company Inc.
  Process Engineering for Depth and N/P Loading Control in Polysilicon Gate Etching
  Chun Gao, Lam Research
  Time-Multiplexed Alternating Plasma Etching of Piezoelectric Materials
  Yuanwei Lin, Beijing NAURA Technology Group Co., Ltd.
  Unexpected Enhancement of Aluminum Etching Rate by Increased Nitrogen Concentration in Semiconductor Manufacturing
  Quanzhi Long, Zhejiang University
  The influence of post etch N2 treatment on TM Al line corrosion
  FanShun Meng, CanSemi Technology Inc.
  Study of the Influence of Surface Cleaning Process on SiGe Epitaxy Particle Defects
  Xuan Liu, Semiconductor Manufacturing North China
  The Influence Of Backside Metal Contamination Before Epitaxy On A Kind Of Cluster Cone Defect In Shallow Trench Isolation
  Zhanduo Bai, Semiconductor manufacturing International (Beijing) Corporation
  Improved clean approach of post dual-damascene AIO etch for low-K damage reduction
  Yuying Liu, Lam Research
  Characterization Studies of the sidewall polymer after TIN Etching on Microchip Al Bondpads Using Capacitance Coupled Plasma (CCP) etcher
  Xin Su, Nanchang Zhongwei Semiconductor Equipment Co., Ltd
  Exploration of Boundary Conditions for Capacitor Etching Methods Under the Background of Characteristic Process
  Zhi Yao, Huahong Semiconductor (Wuxi) Co., Ltd.
  The etching of SiO2/Mo-MoN/SiO2/TiN stacks in an inductively coupled plasma system
  Jiahui Sun, Beijing Superstring Academy of Memory Technology
  Undercut Profile Control of STI ETCH
  Jianhang Chen, Nexchip Semiconductor Corportion
  Comparison of 40MHz and 60MHz HF Frequencies in Dual-Frequency CCP for Low-k AIO Process
  Weiming Liu, Advanced Micro-Fabrication Equipment Inc.
  Etching Process Optimization of Deep Silicon Trench Sidewall Damage with High Aspect Ratio
  Yuxin Wang, Huahong Semiconductor (Wuxi) Co., Ltd.
  A Dry Etch Defect Type Comb Particle Exploration and Solution
  Yang Wei, Nexchip Semiconductor Corporation
  The Influence of Surface Cleaning Process on Particle Defects of Selective SiGe Epitaxy
  Xuan Liu, Semiconductor Manufacturing North China
  A Test Method to Evaluate Destructive Removal Efficiency (DRE) Used in Semiconductor Industry
  Yanling Xiong, EDWARDS
  Study on Tungsten (W) Filling Void Improvement with Chamfered Gate Profiles
  Pengfei Lyu, Lam Research
  Study on the mechanism and improvement of top notch profile in deep trench etching
  Yayu Hong, Lam Research
  BEOL Backside Clean Undercut Optimization by ZUC Chuck
  Haibo Liu, Lam Research
  Establishment of active area etching using Lam RAP process in CIS application
  Xi Chen, Lam Research
  Simulation-Driven Optimization of STI Etching: A Systematic Approach to Defect Reduction
  Jianming Guo, Zhejiang University
  Galvanic Corrosion Study in Selective TiN Etch Chemistries
  Chien-Pin Sherman HSU, Avantor
  Evaluation and Improvements of TSV Distortion Characteristics in High Aspect Ratio TSV Etch
  Changhuo Liu, Peking University
  Fluorine Memory Effect Elimination in Cu BEoL Top Via Etching
  Sichao Zeng, Applied Materials China
  High-k Metal Gate Etch on Sym3Y HT Chamber
  Jie Wang, Applied Materials China
  Sym3™ Lid Temperature Control System for Uniformity Improvement
  Tianyuan Liu, Applied Materials China
  Profile Control of 28nm HKMG Poly Etch
  Xipeng Tong, Applied Materials China
  Process challenges of HT Photomask Tuning on Tetra
  Long Men, Applied Materials China
  Taper Profile Control for MOSFET Gate Contact Etch on SuperE
  Wang Miao, Applied Materials China
  Profile control of CIS BMG tungsten etching
  Le Jiang, Applied Materials China
  Deep Si Etch Process Optimization with AppliedPRO
  Fan Zhou, Applied Materials China
  Digital tool AppliedPRO™ For Etch Process Development
  Kai Hu, Applied Materials China
  A Solution to HVCAP VIA Etch Polymer Residue
  Qunfeng Wen, Applied Materials China
  Profile Tuning on VTG Etch Development
  Zhang Weiqiang, Applied Materials China
  Edge Yield Improvement for DRAM Capacitor Middle MESH Layer Punch Process with Sym3Y
  Chunlong Qiu, Applied Materials China
  Hydrogen Bromide Usage in Polysilicon Etching Process
  Songtao Lv, Applied Materials China
  Roughness Improvement of DTI Process by Argon Introduction
  Difan Li, Applied Materials China
  CoSi2 Loss Study of Contact Etch on ProducerTM
  Bao Jing, Applied Materials China
  Digital Tool Applied Crossmatch™ for Chamber matching
  Jianjun Liao, Applied Materials China
  In-Situ Strip to Improve Defects for Al etch
  Kairong Cui, Applied Materials China
  High Open Ratio Al Pad Etch Challenge and Solution
  Fan Chen, Applied Materials China
  SRAM VIA Chain Height Control in Dual Damascene Etch Process
  Ping Zheng, Applied Materials China
  ISO Dense CD loading in STI Etch
  Jimmy Fu, Applied Materials China
  DTC Etch in Packaging Device
  Lijun Shan, Applied Materials China
  Profile Control in PDL Etch
  Tongyao Zhao, Applied Materials China
  MTBC improvement for Producer™ GT Passivation etch
  Jing Cao, Applied Materials China
  Dual Damascus Pattern Depth Loading Challenges and Solutions
  Shuda Xu, Applied Materials China
  Improvement of TiN Hardmask Profile by N2 Gas
  Ziyue Xuan, Applied Materials China
  Ultra-low Bias Power CIS Deep Trench Isolation Etching
  Hanlin Cui, Applied Materials China
  Optimize Deep Trench Isolation Si etching with SF6 O2 Containing Plasma
  Longjie Yu, Applied Materials China
  Novel Approach to Address TiN HMO Top View Challenges
  Caili Lang, Applied Materials China
  O2 plasma descum on residue removal
  Jiajie Li, Applied Materials China
  Abstract_Etch Profile Tuning Study on Small-sized Poly Gate
  Wenyi Tang, Applied Materials China
  Heated SFV Positive Function for Y Pattern Particle Improvement in Etch Tool
  Mengyu Xie, Applied Materials China
  Profile Optimization In Poly Gate Etch
  Lin Luo, Applied Materials China
  Residue reduction in TIN HM ETCH
  Dongjiang Wang, Applied Materials China
  Approaches to remove Ti-residue in TiN HMO process
  Rishuai Zheng, Applied Materials China
  Advanced RF Pulsing in DRAM Bitline Etch Profile Control
  Zheng Ruan, Lam Research
  Application of Pulsing Plasma on DRAM Buried Wordline Microloading Control
  Kevin Yao, Lam Research
  Mandrel Etch Tuning for Imbalance Improvement in Reverse SADP
  Shipeng Gong, Lam Research
  Dry Etch Methods to Simplify Power Devices Top Corner Rounding and Poly Etch Back Process
  Stan Zhang, Lam Research
  Study on CD slot effect in TiN hard mask open etch process
  Haoran Wang, Lam Research
  Etch Profile Control of Alternate Oxide Tungsten stack
  Rui Hu, Applied Materials China
  Tungsten plug etchback process in IGBT manufacturing
  Haoran Song, Beijing NAURA Technology Group Co., Ltd.
  Poly-Si cut process for storage node contact manufacturing in DRAM memory
  Mengjiao Zhu, Beijing NAURA Technology Group Co., Ltd.
  Investigation of silicon oxide thin film utilizing plasma enhanced atomic layer deposition in ICP etcher
  Li Zeng, Beijing NAURA Technology Group Co., Ltd.
  The process of etching high aspect ratio SiB at high temperature
  Xuehua Wang, Beijing NAURA Technology Group Co., Ltd.
  Micro loading issue improvement in poly gate etch
  Yiman Ma, Beijing NAURA Technology Group Co., Ltd.
  Isolation SiN etch strategy for OLED pixel definition layer manufacturing
  Bin Wang, Beijing NAURA Technology Group Co., Ltd.
  LWR improvement in self-aligned patterning process involved in 193nm photoresist treatment
  Guangzhao Yuan, Beijing NAURA Technology Group Co., Ltd.
  the influence of strip step on punch process
  Yu Hao, Beijing NAURA Technology Group Co., Ltd.
  Carbon hardmask etching profile control using cyclic deposition and etching
  Wencong Wei, Beijing NAURA Technology Group Co., Ltd.
  Bridge Defect Issue Solution in Trilayer HM Etch
  Zhe Wang, Beijing NAURA Technology Group Co., Ltd.
  Depth uniformity of silicon and dielectric trenches etching for the burried wordline of novel memory
  Teng Zhang, Beijing NAURA Technology Group Co., Ltd.
  IGZO film etching technique using BCl3 plasma following diluted hydrofluorine solution
  Run Zhang, Beijing NAURA Technology Group Co., Ltd.
  Array center and corner loading improvement in r-SADP
  Shun Yang, Beijing NAURA Technology Group Co., Ltd.
  Si top corner damage-free etch process for shallow trench isolation of beyond the 22nm node
  Yingjie Wang, Beijing NAURA Technology Group Co., Ltd.
  Deep Silicon Etching Process for Optimizing Sidewall Morphology
  Yiming Ma, Beijing NAURA Technology Group Co., Ltd.
  The optimization of depth micro-loading in shallow trench isolation etching for dual-channel structure
  Junsheng Ma, Beijing NAURA Technology Group Co., Ltd.
  Through-Silicon via etch by SF6/O2 chemistry with ICP etcher
  Dong Li, Beijing NAURA Technology Group Co., Ltd.
  Optimization of the profile loading in dummy Poly Gate etch
  Ruiping Zhu, Beijing NAURA Technology Group Co., Ltd.
  Chamber Conditions Control with Waferless Auto Clean Strategy in BEOL Aluminum Metal Etching Process
  Guohui Jia, Beijing NAURA Technology Group Co., Ltd.
  Study of Poly-Si etch rate sensititivity with Pulsing Mode of RF Powers for Soft-landing Step in Gate Patterning Process
  Chao Xu, Beijing NAURA Technology Group Co., Ltd.
  Self-Limited Behavior Study on Dielectric Quasi-Atomic Layer Etching for Selectivity Achievement
  Xiaoxia Meng, Advanced Micro-Fabrication Equipment Company Inc.
  The Investigation on Partial Via Etch Of Low-K In MHM AIO Process
  Ruolan Ma, Advanced Micro-Fabrication Equipment Company Inc.
  Mechanism and Model of Line Wiggling/Asymmetric Trench profile and Effective Solutions
  Mimi Dai, Advanced Micro-Fabrication Equipment Company Inc.
  An Approach to Improve Distortion With High-Aspect-Ratio Cryogenic Etching Using Boron-Containing Gases
  Yue Wei, Advanced Micro-Fabrication Equipment Company Inc.
  The Effects of Power and Chemistry on High-aspect-ratio Contact Profile
  Jianqiu Hou, Advanced Micro-Fabrication Equipment Company Inc.