Symposium Chair: Dr. Linyong (Leo) Pang, D2S Inc., USA
| ** | to designate keynote talk - 30 min | |||
| * | to designate invite talk - 25 min | |||
| to designate regular talk - 15 min |
Monday, March 24, 2025 Shanghai International Convention Center
Meeting Room:
Session I: Joint Session Symp II & III
Session Chairs: Leo Pang / Zhongwei Jiang
| 13:30-13:35 | Opening Remarks |
| Leo Pang / Zhongwei Jiang | |
| **13:35-14:05 | From "Iso-Dense" Biasing to "Inverse Lithography:" Milestones in Optical Proximity Correction Technology |
| Michael Rieger, Synopsys | |
| **14:05-14:35 | Challenges and latest developments on photo resisters for advanced logic and memory technology nodes |
| Allen Chang, JSR Taiwan, China | |
| **14:35-15:05 | The integration and process challenges and solutions for advanced technology nodes |
| David Xiao, Qianmo Microelectronics | |
| 15:05-15:20 | Coffee Break |
Session II: Keynote Session
Session Chairs: Leo Pang / Ken Wu
| **15:20-15:50 | TBD |
| Leo Pang, D2S Inc. | |
| **15:50-16:20 | DTCO and DICO with Practical Physical Lithography Modeling for Advanced Technology Nodes in Times of Xing Interruption |
| Ken Wu, Fudan University | |
| **16:20-16:50 | EUV CAR-NTD for Chemical Stochastic Reduction |
| Hideaki Tsubaki, FUJIFILM Corporation | |
| *16:50-17:15 | TBD |
| Guangyuan Zhao, Hongkong Chinese University | |
| 17:15-17:45 | Coffee Break |
| 17:45-17:55 | Poster Session |
Tuesday, March 25, 2025 Shanghai International Convention Center
Meeting Room:
Session III: DTCO and DICO
Session Chairs: Wenzhan Zhou/ Weiming Gao
| *08:30-08:55 | Different MOL logic layout optimization under 3 nm CFET architecture |
| Yanli Li, Fudan University | |
| *08:55-09:20 | Enhancing Extreme Ultraviolet Lithography Process Metrics in the Cut Layer through Source-Mask Co-Optimization |
| Qi Wang, Fudan University | |
| *09:20-09:45 | Source-Mask Co-Optimization Study for Oblique Direction and Oblique Patterns |
| Ying Li, Fudan University | |
| 09:45-10:00 | OPE Matching in Advanced Logic Processes |
| Haoyong Wang, Fudan University | |
| 10:00-10:15 | Coffee Break |
Session IV: Computational Lithography I
Session Chairs: Yayi Wei / David Wei
| *10:15-10:40 | Inverse lithography with curvilinear mask rule compliance | |
| Yijiang Shen, Guangdong University of Technology | ||
| *10:40-11:05 | Methodology on Adaptive Iterative Step in Inverse Lithography | |
| Fei Ai, University of Chinese Academy of Sciences | ||
| *11:05-11:30 | EUV lithography modeling with high efficiency and accuracy | |
| Jamin Liu, Huazhong University of Science and Technology | ||
| 11:30-13:00 | Lunch Break | |
Session V: OPC
Session Chairs: David Wei / George Wu
| *13:00-13:25 | OPC Thoughts II |
| Jiang Yan, Fudan University | |
| *13:25-13:50 | A Novel OPC Method based on Pattern Density |
| Lei Wang, Shanghai Huahong Grace Semiconductor Manufacturing Corporation | |
| *13:50-14:15 | Evaluation of Hotspots EPE Propagation Through Step-by-Step SEM Contour Analysis |
| Kan Zhou, Shanghai Huali Integrated Circuit Corp | |
| *14:15-14:40 | Discussion on the Calibration Metrics for Accurate Simulation of the M3D Effect |
| Weimei Xie, NICIC | |
| 14:40-14:55 | Coffee Break |
Session VI: Equipment and Material
Session Chairs: Leo Pang /Ken Wu /Xiaomin Ma /Imai
| **14:55-15:25 | The evolving laser mask writer, a cornerstone for the semicon industry |
| Robert Eklund, Mycronic AB | |
| 15:50-16:05 | Molecular Force In Nanoprinting |
| Zhimin Zhu, Brewer Science, Inc | |
| *13:50-14:15 | Evaluating High-Throughput Mask Systems for Mainstream Technology Applications |
| Martin Glimtoft, Mycronic AB | |
| *16:05-16:30 | High-Resolution Patterning of Directed Self-Assembly (DSA) Lithography via Universal Orientation Control Method |
| Xianhe Liu, Fudan University | |
| 16:30-16:45 | Photosensitive polyimide for panel-level RDL insulator |
| Masao Tomikawa, Toray Industries Inc. | |
| 16:45-17:00 | Coffee Break |
Session VII: Computational Lithography II
Session Chairs: Weimin Gao / Ken Wu
| *17:00-17:25 | It Is about Time to Rethink and Reteach Diffraction | |
| David H. Wei, Quantica Computing, LLC | ||
| 17:25-17:40 | Mask3D-Compatible Hopkins Formulation of Full-Vector Lithography Imaging | |
| Shaopeng Guo, Huazhong University of Science and Technology | ||
| 17:40-17:55 | A Neural Network Model for Wafer-Scale Photoresist Thickness Prediction Using Feature-Screened Process Monitoring Data | |
| Liejie Huang, Zhejiang University | ||
| 17:55-18:10 | Investigation of 193 nm Immersion Lithography Process for Cut Layer in Middle End Of Line at 5 nm Node | |
| Zhiwei Ren, Fudan University | ||
| Poster Session: | ||
| SADP Etch Process Development on Al2O3 Thin Film for Memory Device | ||
| Taiyen Peng, Leuven Instruments | ||
| Optimizing Photoresist Coating Processes with Computational Fluid Dynamics and Taguchi Design of Experiments | ||
| Chaoyi Zheng, Zhejiang University | ||
| Symmetry and Anisotropy in Wafer Deformation: Their Effect on Alignment Signal Degradation | ||
| Jibin He, Zhejiang University | ||
| Addressing Missing Die Data in CD-SEM Analysis: A Direction-Weighted K-Nearest Neighbor Approach | ||
| Tianhao Huang, Zhejiang University | ||
| Modeling of NTD resist shrinkage based on spring-mass system | ||
| Delong Yao, EDA Center, Institute of Microelectronics, Chinese Academy of Sciences | ||
| Source optimization based on the partially coherent imaging model | ||
| Jinjie Li, University of Chinese Academy of Sciences | ||
| Study of Photoresist Residue Defect Induced by Develop Condition | ||
| Chao Long, Shanghai Huali Integrated Circuit Corporation | ||
| Effects of Injection Volume and Temperature on Spin Coating Uniformity - An OpenFOAM Simulation Study | ||
| Pan Liu, Zhejiang University | ||
| An Investigation into the Optimization of Photolithography Process for Silicon Nitride Devices on the fab's 12-inch Production Line | ||
| Huiyun Jiang, Zhejiang University | ||
| The Method of OPC Correction for Narrow Neck Structures in LDD Layer | ||
| Qing Li, Shanghai Huali Integrated Circuit Manufacturing Corporation | ||
| Research on methods to improve the server usage efficiency | ||
| Li Xiao, Shanghai Huali Integrated Circuit Corporation | ||