为了您获得更好的浏览体验,请将您的浏览器更新到最新版本!
+86.21.6027.8500
English
March 20-22, 2019
Shanghai New International Expo Centre

Symposium VI: Metrology, Reliability and Testing

(** to designate keynote talk, * to designate invite talk)

Sponsored by:
Monday, March 18, 2019 Shanghai International Convention Center
Meeting Room: 5D+5E

Session I: Test
Session Chair: TBD


13:30–13:35 Chairman Remarks
  TBD
**13:35–14:05 The Hype, Myths, and Realities of Testing 2.5D/3D Integrated Circuits
  Prof. Krishnendu Chakrabarty, Duke University, USA
14:05–14:20 Adjustable Arbiter Physical Unclonable Function with Flexible Response Distribution
  Jing Ye, Xiaowei Li, Huawei Li, Yu Hu, State Key Laboratory of Computer Architecture, Institute of Computing Technology, Chinese Academy of Sciences, University of Chinese Academy of Sciences
14:20–14:35 Fast Development of High Efficiency Trimming Program on Advantest 93K tester
  Jincheng Zhang, Advantest (China) Co., Ltd.
14:35–14:50 Quick Development of High Throughput RF tests on HVM ATE
  Ping. Wang, Goh. Frank, Haocheng. Yuan, Chuansheng. Du, Chenpeng. Huang, Haixia. Guo, Advantest (China) Co., Ltd.
14:50–15:35 Coffee Break


Session II: Test and Measurement
Session Chair: TBD


15:35–15:50 Key Considerations for Automotive Semiconductor Test Strategy
  Anil Bhalla, Astronics Test Systems, USA

15:50–16:05

FPGA Software QoR Benchmarking Methodology Study

Ping Chen, Shixiao Yan, Lattice Semiconductor
16:05–16:20

The Cycle Time of IC Manufacturing and AMHS Variability


George W. Horn, Middlesex Industries SA, Switzerland
16:20–16:35 Terahertz nanometrology for graphene-semiconductor interface characterization

Anis Rahman, Applied Research & Photonics, USA



Tuesday, March 19, 2019 Shanghai International Convention Center
Meeting Room: 5D+5E

Session III: Metrology
Session Chair: TBD


**8:30–9:00 TBD
  Jason Shields, Lam Research, USA
9:00–9:15 The Judgment of the Sensitivity between EDX & EELS and Enhance the Detection Limit via Statistical Method (PCA)
  Chao Jiang, Lilung Lai, Hanxiong Lei,Yamin Su, Semiconductor Manufacturing International Corp.
9:15–9:30 Characterization of Laser Recast Profile and Height for Laser Dicing Process
  Yanghua He, Brian Smith, Will Clinton, Qorvo, Inc, USA
9:30–9:45 Single Particle Inductivley Coupled Plasma Mass Spectrometry Metrology for Advanced Semiconductor Process Development
  Qilin Chan, Waldo Wang, Larry Zazzera, Alex Simpson, Jaimie Stomberg, Majid Entezarian, Daniel Lei, Mark Ellefson, Brian Mader, Jinsheng Zhou, 3M, USA
9:45–10:30 Coffee Break
   

Session IV: Metrology and Inspection
Session Chair: TBD


*10:30–10:55 TBD
  Gary Ditmer, Lam Research, USA
10:55–11:10 Novel Workflow for High-Resolution Imaging of Structures in Advanced 3D and Fan-Out Packages
  Marcus Kaestner, Sascha Mueller, Tom Gregorich, Cheryl Hartfield, Craig Nolen, Ingo Schulmeyer, ZEISS Semiconductor Manufacturing Technology, USA
11:10–11:25 In-depth Investigation of the Mechanism of E-beam Effect for Advanced Device via Nanoprobing I-V & C-V Analysis
  Aibing Xun, LiLung Lai, Semiconductor Manufacturing International Corp.
11:25–11:40 Investigation of Tungsten Rich Residue Defects Induced by Electron Beam Inspection post Contact Tungsten Chemical and Mechanical Polish
  Rongwei Fan, Hunglin Chen, Kai Wang, Yin Long, Qiliang Ni, Xiaofang Gu, Shanghai Huali Microelectronics Corp.
12:00–13:30 Lunch Break
   

Session V: Reliability
Session Chair: TBD


*13:30–13:55 Reliability Challenges for Advanced Interconnect Systems
  Kristof Croes, IMEC
13:55–14:10 Interaction between Random Telegraph Noise and Hot Carrier Ageing
  Jian Fu Zhang, A. B. Manut, Z. Ji, W. Zhang, Liverpool John Moores University, UK
14:10–14:25 Impact of Hot-Carrier Stress on Oxide Trap Switching Activity in Nanoscale FETs
  Xin Ju, D. S. Ang, Nanyang Technological University
14:25–14:40 The Analysis of Vref Trimming on a Zero-temperature Coefficient Bandgap
  Xiuquan Wang, NXP (China) Management Ltd.
14:40–15:30 Coffee Break
   

Session VI: Reliability and Analysis
Session Chair: TBD


*15:30-15:55 Reliability Verification: Why it is complex, important and beneficial?
  Sridhar Srinivasan, Mentor Graphics
15:55-16:10 A New Method for Extraction and Analysis of Au Contamination on Semiconductor Wafer Surface
  Mike Ma, Huaying Research Co., Ltd
16:10-16:25 Devices' Tiny Breakdown Weaken and Hidden by Analog Circuit Design
  Yutian Zhang, Huahong Grace Semiconductor manufacturing Corporation


Poster Session: Location: 5th Floor
Coffee Break Practical exploration of yield prediction model
  Wu yuan, Xu yun, Zhang yuxiang, Shanghai Huahong Grace Semiconductor Manufacturing Corp.
  Highly Sensitive RF device Setup on ATE
  Haocheng Yuan, Ping Wang, Advantest (China) Co., Ltd.
  A Method for Measuring Resistance of Metal Interconnection inside Chip
  Chenjie Zhou, Yutian Zhang, Zhimin Zeng, Yun Xu, Ding Zhou, Xiaotong Ye, Shanghai Huahong Grace Semiconductor Manufacturing Corp.
  The Study of Metal Capacitor Transistor TDDB Failure Mechanism
  Chong Huang, Fangce Sun, Ming Zhang, Aiyan Ji, Shanghai Huahong Grace Semiconductor Manufacturing Corp.
  A Calculation Model Of Throughput For Testing House
  Zhimin Zeng, Yun Xu, Shanghai Huahong Grace Semiconductor Manufacturing Corp.
  Initial analysis of function failure mechanism of deep submicron static random access memory
  Zou Xiao, Shanghai Huahong Grace Semiconductor Manufacturing Corp.
  Measured offset Correction by Shift Focus for Image Based Overlay
  Zhi-Feng Gan, Xiao-Chi Xu, Jing-An Hao, Semiconductor Manufacturing International Corp.
  The total inspection solutions of weakpoint in BEOL advanced semiconductor process
  Xingdi Zhang, Hunglin Chen, Yin Long, Qiliang Ni, Rongwei Fan, Kai Wang, Shanghai Huali Microelectronics Corp.
  High Efficiency and Low Cost Solution on RFID Tag Measurement
  Lei Wang, Shanghai Huahong Grace Semiconductor Manufacturing Corp.
  Overlay Variability Decomposition by Extra Sum of Square and Set Operations
  Fangren Ji, KLA-Tencor Corporation, USA