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March 14-16,2018
Shanghai New International Expo Centre

Symposium VII: Packaging and Assembly


(** to designate keynote talk, * to designate invite talk)

Sunday, March 11, 2018 Shanghai International Convention Center
Meeting Room:5B+5C


Session I:
Session Chair: Dr. Huili Fu

13:30-13:35 Opening Remarks
  Dr. Steve Liang, JCET
**13:35-14:05 FAN-OUT WAFER-LEVEL PACKAGING FOR 3D IC HETEROGENEOUS INTEGRATION
  John H Lau, ASM Pacific Technology
**14:05-14:35 TBD
  Scott Sikorski, JCET/STATSChipPAC
**14:35-15:05 TBD
  Willian Chen, ASE Group
*15:05-15:30 TBD
  John Lee, Amkor
15:30-16:15 Coffee Break
 

Session II:
Session Chair: Dr. Yifan Guo

**16:15-16:40 New Developments in Advanced MIS Packaging
  YB Lin, JCET
*16:40-17:00 Emerging fine line panel level fan out technology
  David Fang, PTI
*17:00-17:20 Process Development of five- and six-side (5s/6s) molded WLCSP
  Shuying Ma, Huantian Technology (Kunshan) Electronics Co., Ltd.
*17:20-17:40 The Signal Integrity Study of SIP Package Using TSV Interposer
  Peng Sun, National Center for Advanced Packaging
*17:40-18:00 Effective EMI Shielding for Semiconductor Packages through Novel Conformal Coating Solutions
  Xinpei Cao, Henkel Electronic Materials
   
Poster Session: Location: 5th Floor    
Coffee Break Method to reduce metal filament on die with backside metal
  Bo Peng, NXP semiconductor
  Effects of Encapsulation Glue and Bonding Wire on the Strength of Smart Card Modules
  Hongtao Gao, Shanghai Eternal Information Technology Company
  silane oligomer in epoxy molding compound
  Hongjie Liu, Jiangsu HuaHaiChengKe Advanced Materials Co. Ltd.
  Safeseal for the Plating application
  Zhipeng Huang, AMAT


Monday, March 12, 2018 Shanghai International Convention Center
Meeting Room: 5B+5C

Session III:
Session Chair: Prof. Kuan-Neng Chen

*8:30-8:55 Improvement of Package Warpage through Substrate and EMC Optimization
  Ken Lee, Simmtech, Co., Ltd.
*8:55-9:20 Polyimide applications and development in advanced packaging
  Shian Shen, Taiflex Scientific (/NCTU)
9:20-9:35 Latest developments of molding compound material for power semiconductors
  Yusuke Tanaka, Sumitomo Bakelite (Suzhou) Co., Ltd.
9:35-9:50 Thermal and Mechanical Performance for Different Package Design of Ultra Thin 8 Die Stacked Flash BGA Packages
  Tianhan Wu, Ramaxel
9:50-10:05 Wafer warpage control by epoxy molding compounds for wafer level package
  Ki Hyeok Kwon, Samsung SDI
10:05-10:40 Coffee Break
   

Session IV:
Session Chair: Dr. Mark Huang


*10:40-11:05 Advanced Panel Level Die Attach
  Hugo Pristauz, Besi Austria GmbH
11:05-11:20 Laser Release Technology for Wafer Level Packaging
  Dongshun Bai, Brewer Science, Inc.
11:20-11:35 Chain Wedge Bonding Technology for Stacked Die Packages
  Maopeng Zhou, Ramaxel
11:35-11:50 Study On The High Reliability Performance And High Thermal Conductivity Epoxy Molding Compound
  Wei Tan, Jiangsu HuaHaiChengKe Advanced Materials Co. Ltd.
11:50-12:05 Highly Functionalized EMC Package Materials for Fingerprint Sensors
  Junghwa Kim, Samsung SDI
12:05-13:40 Lunch Break
   

Session V:
Session Chair: Dr. Shin-Puu Jeng


*13:40-14:00 STRUCTURING REDISTRIBUTION LAYERS DOWN TO 2 MICRON LINE SPACING WITH LASER DIRECT ABLATION
  Dirk Müller, Coherent
*14:00-14:15 TBD
  Fan Chun Ho, ASM Pacific
14:15-14:30 New Application Method for Package Level EMI Shield Coating
  Stuart Erickson, Ultrasonic Systems, Inc.
14:30-14:45 Thin Die Stacking Technologies for 3D Memory Packages
  Wu Jie, Kulicke & Soffa Pte. Ltd.
14:45-15:00 Electroplated Nanotwin Copper for Fine Line RDL
  Stream Chung, Chemleader Corporation

Session VI:
Session Chair:


15:00-15:15 Low Temperature Flip-Chip Technology for Flexible Hybrid Electronics
  Hiroshi Komatsu, CONNECTEC JAPAN Corporation