为了您获得更好的浏览体验,请将您的浏览器更新到最新版本!
+86.21.6027.8500
English
March 14-16,2018
Shanghai New International Expo Centre

Symposium VII: Packaging and Assembly


(** to designate keynote talk, * to designate invite talk)

Sunday, March 12, 2017 Shanghai International Convention Center
Meeting Room: 5B+5C

Session I:
Session Chair: Dr. Huili Fu


13:30-13:35 Opening Remarks
  Dr. Steve X. Liang, JCET
**13:35-14:00 Recent Development in 3DIC Packaging Technology
  Dr. Shin-Puu Jeng, TSMC
*14:00-14:20 eWLB as an Innovative Integration Platform
  Dr. Scott Sikorski, STATSChipPAC
**14:20-14:45 Role of Advanced Packaging in IC Scaling and Homogeneous and Heterogeneous Integration
  Dr. Hamid Azimi, Intel
**14:45-15:10 EMI Shielding Technologies in RF Front End Modules
  Dr.Yifan Guo, ASE
*15:10-15:30 The Advanced Wafer Level Fan Out Packaging - SWIFTTM and SLIMTM
  Dr.Danny Chang, Amkor Technology China
15:30-15:45 Coffee Break


Session II:
Session Chair: Dr. Yifan Guo


*15:45-16:05 Key technologies and application demonstrations of 3D heterogeneous integration and FOWLP
  Prof. Kuan-Neng Chen, NCTU
*16:05-16:25 New Advances in MIS Technology & Application
  Dr. Lingzhi Chen, MIS
*16:25-16:45 Technology Advancement of Laminate Substrates for Mobile, IoT, and Automotive Applications
  Dr. Ken Lee, SimmTech
 *16:45-17:05 V-DOE Laser Full Cut Dicing of Thin Si IC wafers
  Dr. Peter Dijkstra, ASMPT Laser Separation International B.V.
   
Poster Session: Location: Foyer of Yangtze River Hall
Coffee Break Using DOE to Improve COB Bondability
  Wei Xin, SMIC
  Study of white epoxy molding compound for LED bracket
  Hongjie Liu, Jiangsu HuaHaiChengKe Advanced Materials Co., Ltd


Monday, March 13, 2017 Shanghai International Convention Center
Meeting Room: 5B+5C

Session III:
Session Chair: Prof. Kuan-Neng Chen


**8:30-8:55 Packaging Requirements for Advanced RFIC
  Dr.Christian Hoffmann, Qualcomm Germany RFFE GmbH
*8:55-9:15 The Development of Wafer Level Embedded Si Fan Out Technology for System Integration
  Dr. Daquan Yu, Tianshui Huatian
9:15-9:30 High-Bandwidth IC Interconnects with Silicon Interposers and Bridges for 3D Multi-Chip Integration and Packaging
  Boping Wu, Intel Corp.
9:30-9:45 Novel Leveling Materials for Copper Deposition in Advanced Packaging
  Tao Ma, Shinhao Materials LLC
9:45-10:00 Production-scale Flux-free Bump Reflow Using Electron Attachment
  C. Christine Dong, Air Products and Chemicals, Inc.
10:00-10:15 Underfill Dispensing for Chip-on-wafer
  Akira Morita, Nordosn Asymtek
10:15-10:30 Coffee Break
   

Session IV:
Session Chair: Dr. Mark Huang


**10:30-10:55 Advanced Packaging System in Packaging Solder Materials Solution
  Dr.Chan Li-san, Heraeus Electronics
*10:55-11:15 Fine Feature Solder Paste Printing for SiP Applications
  Lim Sze Pei, Indium Corporation
*11:15-11:40 Advanced Packaging Reliability Challenges and Solutions
  Dr. Richard Rao, Microsemi Corp.
11:40-11:55 Epoxy Molding Compound with High Adhesion on Pd Plated Lead Frames
  Hongjie Liu, Jiangsu HuaHaiChengKe Advanced Materials Co., Ltd
11:55-12:10 INVESTIGATION OF THERMAL INTERFACE MATERIALS REINFORCED WITH MICRO-AND NANOPARTICLES
  Yan Zhang, Shanghai University
12:10-12:25 A FAST AND LOW-COST TSV/TGV FILLING METHOD
  Jiebin Gu, Shanghai Institute of Microsystem and Information Technology
12:25-12:40 Development of Plating Resist for FO-WLP
  Kenji OKAMOTO, JSR Corporation
12:40-14:10 Lunch Break
   

Session V:
Session Chair: Prof. ML Huang


**14:10-14:30 Enable System Integration through Wafer Level Advanced Packaging
  Dr. Sun Peng, NCAP
*14:30-14:50 In-situ TEM Observations of IMC Evolution at Atomic Scale
  Xing Wu, ECNU
14:50-15:05 The Study on the Release Force and Adhesion of Epoxy Molding Compound
  Wei Tan, Jiangsu HHCK advanced Materilas Co., Ltd.
15:05-15:20 High Productivity PVD Solution for an ever-evolving Advanced Packaging Industry
  Dr. Frantisek Balon, Evatec Ltd.
15:20-15:35 Electrostatic Discharge Failure Control of IC Package by Epoxy Molding Compound Modification
  Byung-Seon Kong, KCC Corporation
15:35-15:50 Coffee Break
   

Session VI:
Session chair: Dr. Tim Bao


**15:50-16:15 Process and Equipment Technology for Advanced Packaging
  Dr. Arvind Sundarraja, Applied Materials
*16:15-16:35 Laser Applications in Advanced Chip Packaging
  Dirk Müller, Coherent Inc.
16:35-16:55

3D & MEMS Vertical MEMS Probe Technology For Advanced Packaging

 

Amy Leong, Formfactor

16:55-17:10

Latest Material Technologies for Fan-Out Wafer Level Package

 

Itaru Watanabe, Sumitomo Bakelite Co., LTD.

17:10-17:25 Morphology Control of Copper Nanomaterials for IC Bonding
  Jiayue Wen, Harbin Institute of Technology
17:25-17:40 Next generation coated bonding wires
  Liao Jinzhi, Heraeus Materials Singapore Pte Ltd
17:40-17:55 Wafer Bonding Processes for Wafer-Level Integration of Dissimilar Materials
  V. Dragoi, EV Group E. Thallner GmbH