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June 27-29, 2020
Shanghai New International Expo Centre

Symposium VII: Packaging and Assembly


** to designate keynote talk - 30 min
* to designate invite talk - 25 min
  to designate regular talk - 15 min

Parallel Symposium Oral Sessions: June 29-July 17, 2020

Session I:
* Developments in Packaging Technologies for Al Systems and Applications

Yifan Guo, ASE
* 3D Heterogeneous Advanced Packaging and Manufacturing

Drink Wang, TSMC

Challenges and Opportunities in the Heterogeneous Integration

Fan Chun Ho, Nelson, ASM Pacific Technology Ltd

DESIGN AND DEVELOPMENT OF 3D WLCSP FOR CMOS IMAGE SENSOR USING VERTICAL VIA TECHNOLOGY

Tianshen Zhou, HuaTian Technology (Kunshan) Electronics Co., Ltd.

Soldering Material Evolution for Heterogeneous Integration Assembly

Lim Sze Pei, Indium Corporation
Session II:
* Commercialization of through glass via (TGV) technology for 3D packaging

Daquan Yu, Xiamen University
* Control of graphene structure to achieve thermal conductivity for electronics packaging and cooling applications

Johan Liu, Shanghai University and Chalmers University of Technology

Laser Based Full Cut Dicing Evaluation for Thin Si wafers

Kees-Jan Leliveld, ASM Pacific Technology

A Single-Layer Solution with Laser Debonding Technology for Temporary Bond/Debonding Applications in Wafer-Level Packaging

Xiao Liu, Brewer Science

Etching Type Polymer Technology for Large Number of Small Via

Ica Han, Simmtech
Session III:
* High Temperature Packaging of IGBT and Modules

Zhu Wenhui, Central South University

Hybrid Sintering Paste Formulation Workaround on ENIG Surface

Kevin Tan, Henkel

Improvement of heat dissipation in IPM packaging structure

Wenjie Xia, Huangshan University

Silver sintering for high reliability power electronics

Ding Jia Pei, ASM Pacific Technology Co., Ltd.
Session IV: 3D Heterogeneous Integration Joint session ( VII & VIII)
** Diversity, Interconnect and Phase change: Semiconductor heterogenous integration and supper intelligence in the post Moore's Law era

Hu Chuan, Guangdong Academy of Sciences
** 3D Heterogeneous Integration
  Bill Bottoms, 3MTS
** Recent Achievements and New Technologies for High Performance Mems Sensors and Actuators
  Philippe Robert, CEA-LET
** 3D Packaging Development for HPC and 5G Applications

Chiang Shiuh-Kao, Prismark
Session V:
* Packaging Impacts on Cell Reliabilityes in 3D NAND Flash Memories

Chen Jiezhi, Shandong University

Low Cost Manufacturing for Through Glass Via and Wafer Level Packaging Technology

Feng Jiang, Xiamen Sky Semiconductor Technology Co., Ltd.

Finite element analysis of high power press-pack insulated gate bipolar transistors packaging model

Wang Zhao, CRRC Yongji Electric Co., Ltd.

Thermal properties of multi-scale nanosilver paste with SiC particles

Ziwei Jiang, Shanghai University
Session VI:
* Development and Commercialization of 5G NanoComposites

Huang Mark

Investigation of bond pad crystal defect for different cover transmission rate

Chengyang Sun, HLMC

Effect of Bonded Ball Shape on Gold Wire Bonding Quality based on ANSYS/LS-DYNA Simulation

Weidong Huang, Wei Wu, Jacky Wu, Grass Dong, CF Oo, Diodes Shanghai Co., LTD.

Reliability simulation and life prediction of Sn63Pb37 BGA solder joint under thermal cycling load

Liu Jiahao, School of Advanced Materials and Nanotechnology, Xidian University

Effects of Intermetallic Compounds on Reliability of CuNiSn Microbumps

Yitong Xie, Shanghai Jiao Tong University

Yield Improvement and Cost of Test Reduction via Automated Socket Cleaning

Jerry Broz, International Test Solutions

Conference Poster Session: June 26-July 17, 2020

  A New CIS Packaging Process and Structure to Improve Die Chipping
  Yuan Hu, SMIC
  Experimental and Simulation Study of Thermal Conductivity of 3D Graphene Network Filled Polymer Composites
  Yong Zhang, Shanghai University
  A Novel Die Sorter Based on Micro Tweezer for Terahertz Schottky Barrier Diodes
  Li He, Microsystem & Terahertz Research Center, China Academy of Engineering Physics (CAEP)
  A Novel dispensing head fabrication method for precise epoxy dispensing
  Zhang Jie, Microsystem & Terahertz Research Center, China Academy of Engineering Physics (CAEP)
  volume resistance of epoxy molding compound
  Hongjie Liu, Jiangsu HHCK Advance Materials Co., Ltd.
  A PROMISING EMBEDDED SILICON FAN-OUT WAFER LEVEL PACKAGE WITH LASER RELEASABLE TEMPORARY BONDING TECHNOLOGY
  Chengqian Wang, The 58th Research Institute of China Electronics Technology Group Corporation
  Warpage control method in epoxy molding compound
  Wei Tan, Jiangsu HHCK Advance Materials Co., Ltd.