IC Manufacturing International Forum


Date: Thursday, March 21, 2024
Time: 09:00-12:15
Venue: Pudong Ballroom 5, Kerry Hotel Pudong, Shanghai
Simultaneous Interpretation will be provided.

Attendee Registration   Previous Review   Previous Review: Advanced Manufacturing

As the semiconductor industry looks forward to reaching $1T by 2030. Global semiconductor market will reach $624 billion in 2024, an increase of 16.8%, and the equipment market will grow to more than $100 billion by 2026. From 2000 to 2023, China's IC manufacturing capacity increased from 2% to 20% in the global, and China's production capacity ushered in a period of rapid growth in the future, With an average annual growth of more than 10%. IC manufacturing technology innovation will continue to advance, and new products and applications will stimulate demand.

The IC Manufacturing International Forum will invite international and domestic enterprises of FAB, equipment and components. Based on a global perspective, to understand the industry dynamics together, share the full process solutions of IC manufacturing, innovative breakthroughs, expert leaders' views and opinions to promote international cooperation and development of IC manufacturing chain.

SPONSORS

         
         

Agenda / 议程
   
09:00-09:25 Registration 来宾登记
   
09:25-09:30
 Welcome Remark / 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁，中国区总裁
   
Moderator / 主持人:
 秦宏志博士
中芯国际深圳厂前厂长，北京大学集成电路学院，广东省纳米研究院运营副总
   
09:30-09:55
薄膜技术与集成电路装备：挑战、机遇与解决方案
Thin film technology and semiconductor equipments: Challenges, Opportunities, and Solutions
Dong Boyu 董博宇
President, Beijing NAURA Microelectronics Equipment Co., Ltd.
总裁, 北京北方华创微电子装备有限公司
   
0‍9:55-10:20
汽车模拟芯片制造的机遇与挑战
Opportunities and challenges in automotive analog chip manufacturing
WEI Heming
Technical Marketing Manager，X-FAB
   
10:20-10:40
离子注入设备赋能新一代集成电路制造产业
Enabling Next-Generation IC Manufacturing Industry Through Ion Implant Solutions
Chen Xianglong 陈祥龙
VP，Qingdao Sifang SRI Intellectual Technology Co. Ltd
副总 青岛四方思锐智能技术有限公司
   
10:40-11:05
晶圆减薄装备及工艺解决方案
The Solutions to Wafer Grinding Equipment and Process
Liu Yuanhang 刘远航 博士
General Manager of Grinding Product BU，Hwatsing Technology Co., Ltd.
减薄事业部总经理 华海清科股份有限公司
   
11:05-11:30
打造IC制造关键设备，提供客户导向解决方案
Total Customer-focus Solution by IC Manufacturing Key Supplier
Kaidong Xu 许开东 博士
Chairman & CEO, Jiangsu Leuven Instruments Co., Ltd
董事长兼CEO，江苏鲁汶仪器股份有限公司
   
11:30-11:50
半导体工艺控制的精准检测
Accurate Metrology on Semiconductor Manufacturing Processing Control
Zou Yiliang 邹奕量
General Manager Cameca
中国区总经理 Cameca
   
11:50-12:15
面向集成电路制造的质量流量控制器
Mass flow controller for integrated circuit manufacturing
GuShoudong 顾守东 博士
Deputy General Manager and R&D Director Changzhou Gaokai Electronics Co., LTD
副总经理兼研发总监 常州高凯电子有限公司
   
* 议程以最终版为准
* Please refer to the final version of Agenda.