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Dr. Peng Bai was born in Sichuan, China. He studied at Peking University from 1978 to 1979 majoring in Microelectronics, at University of Bucharest, Romania from 1980 to 1985 receiving a bachelor degree in Physics, and at Rensselaer Polytechnic Institute, New York, US from 1986 to 1991 receiving a PhD degree in Physics.
After obtaining his PhD degree, Dr. Bai joined Intel (US) in 1991 as an TD engineer, left Intel in 2022 as Corporate Vice President in charge of Intel Logic Technology Development. During his 31 years at Intel, Dr. Bai led Intel cutting edge Logic technologies from R&D to mass production, completed development of multiple generations advanced logic technologies, guided development and mass production of multiple generations of SoC, eDRAM and eNVM technologies, managed Intel D1C Fab and Intel Oregon TD Fabs, and took charge of Intel's supply chain management with achieving Intel's global supply chain transformation.
Dr. Bai joined Rong Semiconductor in September 2022 as its Chief Executive Officer. During Dr. Bai's tenure at Rongsemi, he has led the company in forming its technology and business strategy focusing on mature nodes specialty technologies and their market opportunities in China and worldwide, in establishing a world class team in technology development, operations, sales and marketing, and supply chain, and in clearly defining a roadmap for technology advancement and business growth.
Dr. Bai is recognized an industry expert in semiconductor technology and manufacturing with vast experiences in management of large TD development programs and high volume manufacturing fabs. Over his tenure in the industry, Dr. Bai has fostered strong supply chain relationships with key domestic and international equipment and materials
manufacturers. Dr. Bai is a keen observer of semiconductor industry trends, and a leader with strategic vision and strong technical insight.
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