Green High-Tech Facility International Innovation Forum


Date: Friday, March 28, 2025
Time: 09:30-12:35
Venue: Grand Shanghai Ballroom 3, Kerry Hotel Pudong, Shanghai
Simultaneous Interpretation will be provided.

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The report 《300mm Fab Outlook Report to 2027》released from SEMI points out，from 2025 to 2027, global spending on 300mm wafer fab equipment is expected to reach a record $400 billion, this is mainly benefit from the strong demand for artificial intelligence and related semiconductor components. In the course of this year, witnessed the wide application of silicon carbide (SiC) power devices in electric vehicles、innovative application of Chiplet technology in high-performance AI chip design、and the rapid rise of RISC-V architecture in automotive electronics and other fields. Besides, fourth generation semiconductor materials------ such as gallium oxide (Ga2O3) and aluminum nitride (AlN) are also beginning to emerge, shows great potential. According to SEMI's report, it will grow a further 24% by 2025, it exceeded $100 billion for the first time, achieve $123.2 billion. This growth is particularly significant, driven by the field of artificial intelligence, demand for Gpus and high bandwidth memory (HBM), further promote the prosperity of the semiconductor market.

Semiconductor production processes typically have high energy consumption、high water consumption、characteristics of high frequency production and discharge of toxic and harmful pollutants. It mainly includes cleanroom system、mechanical system、specialty gas and bulk gas、water treatment system、exhaust system、vacuum system、power supply& automation system、construction、EHS system control and energy saving. This forum provides a exchange experience for global semiconductor companies、explore a platform for strategy resolution. Hope that through the holding of this forum to strengthen the semiconductor industry chain upstream and downstream synergy development, addressing environmental pollution (waste water, waste gas, waste) during semiconductor production, to realize the green and sustainable operation of semiconductor companies, and jointly promote the green transformation and upgrading of the industry.

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Agenda / 议程
   
09:00-09:30 Registration 会议登记注册
   
09:30-09:35
Opening Remarks/开幕致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁、中国区总裁
   
09:35-09:40
Welcome Remarks/欢迎致辞
Ron R.T.Horng 洪荣聪
Vice President/Chief Environment Office,Foxconn Technology Group
富士康（鸿海）科技集团，环保长/副总经理
   
09:40-10:05
汉轩微电子制造（江苏）有限公司（拟邀请）
   
10:05-10:30
深圳市亿天净化技术有限公司
   
10:30-10:55
Yang Liu 刘阳
Deputy Director Design Devision 2 Senior Engineer,
The Electronics Eleventg Design&Research Institute Scientific and Technological Engineering Corporation Limited Suzhou Branch
信息产业电子第十一设计研究院科技工程股份有限公司苏州分公司，正高级副总工
   
10:55-11:20
数智化高效环控解决方案助力半导体行业节能降碳实践
宋应乾，美的楼宇科技，资深解决方案架构师
   
11:20-11:45
上海野村水処理工程有限公司
   
11:45-12:10
艾思洁净科技（江苏）有限公司
   
12:10-12:35
以 AI赋能半导体厂务能源管理
Linlin Cao 曹琳琳
施耐德电气（中国）有限公司，施耐德电气全球爱迪生专家，电子行业数字化软件解决方案首席架构师
   
* 议程以最终版为准
* Please refer to the final version of Agenda.
   

CONTACT US:
Heidi Chen 021-60278561 heidichen@semi.org