SEMICON China - MEMS & Sensors Industry Group Conference Asia 2017

MEMS & Sensors Industry Group Conference Asia 2017: Creating and Capturing Value in the MEMS and Sensors Ecosystem

Date:	Thursday, March 16, 2017
Venue:	Pudong Ballroom 5+6+7, Kerry Hotel Pudong, Shanghai

Attendee Registration

Sponsors:

MEMS and sensors: opportunities and challenges exist together

MEMS and sensors are already ubiquitous. Companies in the MEMS and sensors supply chain are plentiful, competitive, and innovative. As threats of commoditization, consolidation and competition increase, the impetus to gain as much value from MEMS and sensors is increasing. This is even more present in China, where the pace of commercialization is accelerating. Companies are positioning themselves as both hardware and software providers, selling chips along with the algorithms and sensor fusion to enable system integration, maximize value, and remain competitive. Sensor companies are also looking for opportunities to exploit the data analytics of sensor data and participate in that revenue potential. Understanding how to create and capture the value in the MEMS and sensors ecosystem is becoming increasingly important – everywhere in the world – including China.

We will discuss what concerns you

How do companies innovate to make integration easier and create higher revenues? What verticals provide the biggest opportunity for growth? What challenges to value exist across the markets? Which companies are blazing the trail for innovation and revenue generation and how are they doing it? How can traditional semiconductor companies also participate in this explosive growth of MEMS & Sensors, particularly in the Internet of Things? What is unique to the Chinese ecosystem?

Now is the time to increase collaboration, innovation, investment and understanding of MEMS and sensors’ diverse value-add. Speakers at this one-day conference presented by MEMS & Sensors Industry Group at SEMICON China will highlight areas of opportunity for products “on the cusp” of commercialization and provide useful, original and compelling content to the audience. The conference will also address the convergence of MEMS/sensors and semiconductors and will be of particular interest to all SEMICON China attendees.

Distinguished Speakers


Behrooz Abdi	Ben Lee	Becky Oh	Leopold Beer
President and CEO	CEO	President and CEO	Regional President Asia Pacific
InvenSense	mCube	PNI Sensor	Bosch Sensortec

Agenda

Thursday, March 16, 2017

8:30–9:00	Registration

9:00–9:30	Welcome and Introduction Karen Lightman Vice President, MEMS & Sensors Industry Group

9:30–10:15	An IoT startup's perspective on business applications of MEMS and sensor Vivi Zhang Head of Global Strategy, Sensoro

10:15–10:45	Sensor Platform Value, Today, Tomorrow and Beyond... Behrooz Abdi President and CEO, InvenSense

10:45–11:15	Coffee/Tea Break

11:15–11:45	Smart Parking - How sensors and connectivity save money, time and our environment Becky Oh President and CEO, PNI Sensor

11:45–12:15	Translating Flexible Hybrid/Printed Electronics into Innovative Human-Machine Interface (HMI) and IoT Solutions Albert Lu CTO, Interlink Electronics

12:15–13:45	Lunch on own

13:45–14:15	How Entertainment, Automotive, and Voice Will Fuel New Demand for MEMS and Sensors David Allan President, Virtuix Inc.

14:15–14:45	MEMS Sensors and the Supply Chain: Improving Time to Market Roc Blumenthal Senior Director, Applications Marketing, SMIC

14:45–15:15	CMP process stability and tool capacity improvement with Mirra heads Yanghua He Senior Process Development Engineer, Qorvo

15:15–15:45	Coffee / Tea Break

15:45–16:45	Panel “Future of MEMS and Sensors in IoT and Mobile”
	Moderator:
	Sean Ding, Director of Sensing, Chief Scientist, Huawei
	Panelists:
	Leopold Beer, Regional President Asia Pacific, Bosch Sensortec
	Ben Lee, CEO, mCube
	Becky Oh, President and CEO, PNI Sensor
	Claire Peng, Senior Director of Strategy&Business Development, Huawei Hisilicon


16:45–17:00	Session Summary Karen Lightman Vice President, MEMS & Sensors Industry Group

17:00	Evening Reception

Notice: agenda and guests may be updated without notice.

Speaker Selection Committee:

Sean Ding, Huawei
Tomas Bauer, Silex
Ryoshin Imai, ULVAC
Peter Himes, SITRI
Anna-Riikka Vuorikari-Antikainen, Okmetic
Jesse Zhang , SEMI China

	Early Bird （Before February 20, 2017）	Registration Fee （After February 20, 2017）
Attendees	1,000RMB	1,400RMB

Speakers in Conference 2014-2016


Xi Wang	Benedetto Vigna	Xiao Tian Xu	Michael Young	Yang Zhao
Director General of SIMIT, Academician of CAS	Executive Vice President, General Manager of the Analog, MEMS & Sensors Group, STMicroelectronics	Vice President, China Semiconductor Association	Director Electronic Sensing AP, Honeywell	President, MEMSIC Inc.

Angelo Assimakopoulos	Aaron Chang	Dr. Shiuh-Wuu Lee	Qian Guoliang	Ian Chen
Senior Director of New Business Development, Mobile Consumer Electronics, Knowles Corporation	General Manager of MEDIATEK China, MEDIATEK	Executive Vice President, Technology Development, SMIC	Executive Vice President, DATANG TELECOM TECHNOLOGY, LTD	Senior Director MEMS, Freescale

Dr. Xijun Zhang	Tomas Bauer	Matt Crowley	Tomy Runne	Joseph Xie
Chairman and President, Nanopolis Suzhou Co. Ltd.	SVP of Sales & Business Development, Silex Microsystems	CEO, Vesper	Senior Manager, Product Promotion, Sensor Division, Murata Manufacturing Co. Ltd	CEO, QST Corporation