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+86.21.6027.8500
English
March 14-16,2018
Shanghai New International Expo Centre

Rich Wise

Rich Wise
Technical Managing Director, Global Product Group, Lam Research Corporation

Biography

Rich Wise joined in the CTO office of Lam Research in 2014, where he is responsible for strategic patterning product development. Prior to Lam Research, Dr. Wise led plasma process development for the International Business Machines corporation memory and logic alliances. He holds over 75 patents in the field of plasma processing and associated semiconductor technologies.

Rich earned his PhD in Chemical Engineering in 1996 from the University of Houston Plasma Processing Laboratory for experimental and simulation studies on inductively coupled plasmas.

Abstract

3D NAND technology has been widely adopted for memory storage and is in high volume manufacturing worldwide. We discuss the various etch and deposition challenges and related solutions in the manufacture of these devices within the fab environment. Solutions to overcome the most critical challenges are being developed in multiple areas such as advanced process control, new materials, platform architecture, wafer edge optimization, etc. This talk will touch on some of the key solutions required to enable higher productivity and performance in future generations of 3D NAND to support the industry’s bit cost scaling roadmap.