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March 20-22, 2019
Shanghai New International Expo Centre

Dr. Ying ZHANG

Dr. Ying ZHANG
VP, Applied Materials, USA

Dr. Ying Zhang is a vice president of Patterning Integration at Semiconductor Products Group (SPG), Applied Materials, Inc. His responsibilities include path-finding, developing and implementing next-generation plasma source, chambers, and systems for etching and key integrated solutions into high volume manufacturing at advanced technology nodes. Prior to joining Applied, Dr. Zhang was a director with TSMC where he managed plasma etching and wet clean for 28 nanometer development and ramp-up to high volume manufacturing. He previously was at IBM’s T.J. Watson Research Center and led the development of dry etch and metallization technologies for multiple advanced nodes and exploratory novel device prototyping beyond the CMOS era. Dr. Zhang received a Ph.D. in physics. He has been recognized with various corporate awards, participated in more than 40 presentations and 100 publications, and holds over 100 issued patents.