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March 14-16,2018
Shanghai New International Expo Centre

Dr. Sebastian Engelmann

Dr. Sebastian Engelmann
IBM T.J .Watson Research Center, USA

Sebastian Engelmann is currently working in the Reactive Ion Etching group in the IBM Research Division at the T.J. Watson Research Center in Yorktown Heights, N.Y. He received his Ph.D. in Materials Science at the University of Maryland, College Park in 2008. After studying plasma - photoresist interactions, he has been working on developing plasma etching processes to support current and future device generations for exploratory CMOS device research and devices beyond the CMOS era.