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March 14-16,2018
Shanghai New International Expo Centre

Dr. Chih-Chao Yang

Dr. Chih-Chao Yang
Senior Scientist and Engineer and Master Inventor, IBM Research

Dr. Chih-Chao Yang is a Senior Scientist/Engineer and Master Inventor with IBM Research working in the area of Exploratory Material and Process Integration. He received his Ph.D. degree in Materials Science and Engineering from Carnegie Mellon University, Pittsburgh, Pennsylvania, USA. He has been a key IBM researcher/ integrator in 6 successful and consecutive CMOS technology nodes: 90, 65, 45, 32, 22 and 14nm. His current research includes advanced material integration and process development for IBM 7nm BEOL technology node developments with special focus on interconnect performance (RC reduction) and reliability enhancements. His accomplishments with IBM Research have been recognized by multiple awards, including an Extraordinary Technical Achievement (recognition of contributions to “Low-k SiCOH/Cu BEOL Innovation and Implementation in Manufacturing- 90nm and 65nm technology nodes), three Outstanding Technical Achievement (recognitions of contributions to Innovations Enabling Cu/Low-k BEOL for Advanced 45nm and 32nm Technology Development, demonstration of the world's smallest SRAM, and introduction and qualification of Low-k Dielectric Technology) as well as numerous High Value Patent Awards. He holds over 320 US granted patents and has authored over 60 technical publications. Many of his patents have been implemented in manufactured semiconductor high-end technology products, for example selective CVD metal cap process and via gouging feature for advanced Cu interconnect related applications.