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March 14-16,2018
Shanghai New International Expo Centre

Dr. Roy YU

Dr. Roy YU
IBM, Watson Research Center, USA

Dr. Roy Yu received his B.S. from the Fudan University in Shanghai in and his Ph.D. from the University of Pennsylvania. He joined IBM in 1991 and is currently a senior engineer with IBM Watson Research. Dr. Yu has developed the fundamental methodology in wafer bonding, thinning and joining that form the backbone of 3DI activities within IBM and is currently focusing on various aspects of 3DI for post-CMOS era. He has more than 40 publications and more than 40 issued patents.