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March 14-16,2018
Shanghai New International Expo Centre

Dr. Jing Shi

Dr. Jing Shi
Oracle, USA

Dr. Jing Shi currently is a senior hardware engineer in Oracle Corporation- Microelectronics Division. He was a senior researcher at Sun Laboratory prior Sun Microsystems was acquired by Oracle Corporation. He obtained his BEng, MEng, and Ph .D. from EE departments of Tsinghua University, National University of Singapore, and University of Nebraska-Lincoln respectively. He has published more than 40 journal and conference papers and authored one book chapter in semiconductor, laser processing, advanced packaging areas and filed 6 US patents. Before joining Sun Microsystems, he worked at Micron Technology focusing on TSV process development for stacked memory and imager sensor products. His current interest at Oracle Corp. is advanced MCM packaging and proximity communication I/O links.