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March 14-16,2018
Shanghai New International Expo Centre

Dr. Young Do Kweon

Dr. Young Do Kweon
Samsung, Korea

Mr. Youngdo Kweon is currently working for Samsung Electro-Mechanics Co. Ltd., as the Group Leader of Advanced Package Group in Corporate R&D Center. He has been working in Semiconductor, Fiber Optics, Image Sensor, Wireless Component, System Module Packaging since 1988 with hands on experience on design, process, equipments and reliability, particularly between the R&D and mass production ramp-up. Currently, He is developing Mobile 3D System Module Packaging based on wafer level package and printed circuits board process technologies. He had worked for Micron Technology (Memory WLCSP & CMOS Imaging Package), Paracer Inc. (12 Channels Fiber Optic Tx/Rx Module), ChipPac (Flip Chip Processing), Flip Chip Technology (Wafer Bumping & WLCSP) and Samsung Semiconductor (Memory IC Packaging & Module).

Mr. Kweon received his BS degree in Metallurgical Engineering from Hanyang University in 1987, and his MS in Mechanical Engineering from University of Maryland at College Park in1998. He had attended the several projects on CALCE Electronics Packaging Center in University of Maryland at College Park as well. Mr. Kweon holds several patents in new packaging and process, and published papers.