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March 14-16,2018
Shanghai New International Expo Centre

Prof. Mingliang Huang

Prof. Mingliang Huang
Dalian University of Technology, China

Dr. M.L. Huang received his Ph.D. degree from Dalian University of Technology in 2001. From 1998 to 2000, he worked at Electronic Packaging Center, City University of Hong Kong, as a Research Associate. From 2003-2004, he worked at Center for Electronic Packaging Materials, Korea Advanced Institute of Science and Technology, as a Research Fellow. From 2004 to 2006, he worked at Fraunhofer IZM, Germany, as a Humboldt Research Fellow. Since 2006, he has been a professor, and also the director of Electronic Packaging Materials Lab at Dalian University of Technology. Now his research work is focused on interfacial reaction, electromigration, and reliability of fine-pitch lead-free solder interconnects, as well as co-deposition of eutectic Au-Sn alloys for LED packaging.