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March 14-16,2018
Shanghai New International Expo Centre

Prof. Kuan-Neng Chen

Prof. Kuan-Neng Chen

National Chiao Tung University




Dr. Kuan-Neng Chen received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). Currently he is Professor of Department of Electronics Engineering and Vice Dean of International College of Semiconductor Technology in National Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.

Dr. Chen holds NCTU Distinguished Faculty Award since 2011, and received NCTU Outstanding Industry-Academia Cooperation Achievement Award for 4 times, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, EDMA Outstanding Service Award, Adventech Young Professor Award, CIEE Outstanding Youth Engineer Award, and EDMA Outstanding Youth Award. He also received several IBM Awards, including five IBM Invention Plateau Invention Achievement Awards and two Awards from Exploratory Technology Group. Dr. Chen is the editor of the book "3D Integration for VLSI Systems". He has authored more than 260 publications in book chapters, journals and international conferences. He holds 80 patents and has given more than 70 invited talks in industries, research institutes, and universities worldwide. He served the co-chairman of technical program committee of IEEE IPFA 2015, and currently is committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, IEEE EDSSC, IMPACT, IMAPS 3D Packaging, and DPS. Dr. Chen is a member of Phi Tau Phi Scholastic Honor Society and Senior Member of the IEEE.

Dr. Chen was the Deputy Director of ASE-NCTU R&D Center, and Guest Editor of MRS Bulletin. His current research interests are three-dimensional integrated circuits (3D IC), heterogeneous integration, and advanced packaging technology.