为了您获得更好的浏览体验,请将您的浏览器更新到最新版本!
+86.21.6027.8500
English
March 14-16,2018
Shanghai New International Expo Centre

Advanced Packaging 2015

SEMICON China - SESSIONS / EVENTS - History-SEMICON China 2015 - Advanced Packaging

There are
00 days 00 hours 00 minutes 00 seconds

Date:Tuesday, March 17, 2015
Time:13:30-17:30
Venue: Pudong Ballroom 2+3 ,Kerry Hotel ,Pudong, Shanghai



It has become the Era of Mobile Internet to the Semiconductor industry since smart phone replaced PC to be the market driving force. Human to human, human to device and device to device computing and communication are everywhere. Handset, the wearable, automobile and IOT, one after another, step into our vision and rebuild our life style. SEMI China will organize the "Advanced Packaging Forum", where industry elites sit together to discuss the technology and solution for the Era of Mobile Internet.

From the market trend to product application, in conjunction with various assembly and test technology, creative equipment and material, together we map a new blueprint of the industry.

 

Moderator  
 

Huili Fu, chief IC packaging expert and department director of Packaging Engineering Dept, Huawei (Hisilicon Semiconductor)

   
13:30~13:55 IoT Related Packaging Solutions - 2.5D / 3DIC enabling New Wave SiPs
Walter Jau, Director,  Corporate R&D, ASE Group
   
13:55~14:20 JCET Low Cost Packaging Solution

Anderson Bao,
Director of Technology, Engineering and R&D Center, JCET


PPT Download

   
14:20~14:45 Next generation package solutions for mobile and IoT devices
  Chang-Yi (Albert) Lan
Senior Director, Engineering Center  Siliconware Precision Industries Co., Ltd. (SPIL)
   
14:45~15:10 A temporary bonding and debonding technology for TSV fabrication
 

MASAHIRO YAMAMOTO, Manager of TEL 3DI DEPT 
Xiaowei Cheng, Account manager of TEL China

PPT Download

   
15:10~15:35 磁控溅射物理气相沉积在先进封装中的应用
丁培军
北方微电子副总裁
   
15:35~16:00 晶圆级封装的优势及劣势

万里兮
华天昆山总工程师

   
16:00~16:25 Enabling Multi-Die Integration Through Advanced Packaging
Sesh Ramaswami
Managing Director, Packaging Technologies, Silicon Systems Group, Applied Materials
   
16:25~17:25 Panel Discussion
The Advanced Packaging Technology Demand and Challenge of Mobile Communication and IoT
 

符会利, Jim Xu, Walter Jau, 包旭升, 藍章益, 丁培军

Jim Xu
Chief Technical Officer, Zeta Instruments

 
   
17:25~17:30 Lucky draw for five gifts 

 

Mr. Jesse Zhang
Tel: +86-21-60278558
Email:
wdzhang@semi.org

Type Early Bird
(Before Mar.2, 2015)
Registration Fee
(After Mar.2, 2015)
RMB 600/位 RMB 800/位
Speaker Free Free