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March 14-16,2018
Shanghai New International Expo Centre

Dr. Shin-Puu Jeng

Dr. Shin-Puu Jeng

Director, TSMC






Dr. Shin-Puu Jeng is a Director of the Backend Technology Service Division in TSMC, focusing on advanced packaging technology. He was the recipient of the second National Industrial Innovation Award from the Ministry of Economic Affairs, the Outstanding Engineer Award from the Chinese Institute of Engineers, as well as the Prolific Inventor Award and Best Disclosure Award from TSMC.

He has served as General Chair of IEEE's Internation Interconnect Technology Conference (IITC) as well as Executive Co-Chair of the International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

He received his Ph.D from the University of Florida and conducted his postdoctoral studies at Yale University.