Build China’s IC Ecosystem 2015

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Date：Wednesday, March 18, 2015
Time：13:30-17:10
Venue：Pudong Ballroom 2+3 ,Kerry Hotel ,Pudong, Shanghai



The industrialization of semiconductor started late 70s in the US leading by the IDMs. Driven by the process innovation, specialized equipment and material companies stranded up to the stage. The fabless/foundry model was invented later along with the globalization; Asset-light design houses became primary players in the era of mobile internet leveraging on the speed and flexibility. Industry in China is concentrated in downstream manufacturing, with less connection among one and each. Beneficial from the application market, the growth of domestic fabless annual revenue exceeds 30% recently, to certain extend it mobilizes the development of Foundry, A/T, equipment and material industry. However, due to the limitation on process capability, experience, IP and core material etc., it is unlikely to get everything done within the region therefore cost and time to market are becoming increasing concerns. How to enhance the ecosystem in China, make the chain from design to manufacturing faster, cheaper and more reliable?

In conjunction with the SEMICON China 2015, SEMI China will organize the “Build China's IC Ecosystem Forum". Industry experts from the entire supply chain will come together, discuss about how to enhance and integrate the IC ecosystem in China.

Moderator	魏少军教授
13:30~13:50	SiPaaS – Silicon Platform as a Service
	Wayne  Dai Chairman, President and CEO, VeriSilicon
13:50~14:10	Building a New Era for China Semiconductor Industry
	Sunny Hui Senior Vice President, Marketing, SMIC
14:10~14:30	发力高端装备，迎接集成电路国产化大时代
	Jinrong Zhao 北方微电子总裁
14:30~14:50	Collaboration for the Sustainable Supply Chain of Semiconductor Industry in China
	Jim White VP, Supply Chain Operations, Central Procurement Office, Applied Materials
14:50~15:10	Exploration of New Business Model for China’s IC Industry
	Michael Chen EVP, XMC PPT Download
15:10~15:30	顺应市场需求，发展先进特色工艺
	Andy Liu Marketing Director, ASMC   PPT Download
15:30~15:50	3D MIS Packaging Technology
	Lin YB MIS Packaging Director/ Marketing VP, JCET
15:50~16:10	Collaborative Innovation to Build a Brilliant Future
	Tony Chen Vice President of Sales，HHGrace PPT Download
16:10~17:10	Panel Discussion
	Shaojun Wei , Wayne  Dai，Sunny Hui，Jinrong Zhao，Lin YB，Ningling Wang，Tony Chen
	Shaojun Wei Director, Institute of Microelectronics, Tsinghua University
	Ningling Wang Managing partner, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP Shanghai office

Mr. Jesse Zhang
Tel: +86-21-60278558
Email: [email protected]