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March 14-16,2018
Shanghai New International Expo Centre

"More than Moore" Technology Forum 2014

SEMICON China - SESSIONS / EVENTS - "More than Moore" Technology Forum

Concurrent Technology Forums

·More-than-Moore Technology Forum
·China Equipment Market Forum
·IC Applications from Design to Manufacturing Forum
·Advanced Packaging Technology Forum
·LED China Conference 2014 ·Wearable Device Tech Forum
 

There are
00 days 00 hours 00 minutes 00 seconds

Date: Wednsday, March 19, 2014
Time:08:00-12:00
Venue:
Pudong Ball room 2+3, Kerry Hotel Pudong, Shanghai
Language: English 


       
           

Since the early 70’s, the semiconductor industry ability to follow Moore’s law has been the engine of a virtuous cycle: through transistor scaling, one obtains a better performance-to- cost ratio of products, which induces an exponential growth of the semiconductor market. This in turn allows further investments in semiconductor technologies which will fuel further scaling. The industry is now faced with the increasing importance of a new trend, “More than Moore” (MtM), where added value to devices is provided by incorporating functionalities that do not necessarily scale according to "Moore's Law“.

Applications like Sensor, High Power, High voltage, LED driver, Automotive, Internet-of- things, RF, mmWave make developing novel MtM technologies on top of the Moore's Law technologies a more important issue. That's what gave rise to MtM, which is symbiotic with Moore's Law and allows non-digital functionalities to migrate from the system board-level into the package (SiP) or onto the chip (SoC).

In conjunction with SEMICON China 2014, SEMI China will organize “More than Moore Technology Forum”, which focuses on "Internet-of-Things Application driven MtM innovation". This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scientist information, ideas and solutions in the industry. It offers a good opportunity to reach customers of China local IC industry.



MEMS/Sensor Technologies
RF/mmWave Technologies
CMOS image sensors
High voltage, High Power, LED driver
IP Needed in More than Moore world


Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service

Oral Presentation Materials :
SCC 2014 PPT Template


 
Conference Host Dr Yumin LU, VP of technology, SITRI
   
8:00 - 8:20 Registration
   
8:20 - 8:30 Opening Remark
   
8:30 – 9:00 Risks and Strategies for IP Protection in Semiconductors
1 Shaobin Zhu
Attorney-at-Law, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP


Download
   
9:00 – 9:30 The MEMS sensors integration path
1 Leopold Beer
Regional President Asia Pacific, Bosch

Download
   
9:30 – 10:00 Manufacturing Technology of High Voltage Power Devices and its Challenges
1 Dr. Sheng'an Xiao
Senior Director of Advanced Modules, HHGrace


Download
   
10:00 – 10:30 TowerJazz - The Global specialty Foundry Leader
1

Dani Ashkenazi
Vice President of Sales for APAC & Israel, TowerJazz


Download

   
10:30 – 11:00 Altis helps you build the new generation of IoT applications
1 Javen Tan
Director, APAC and Japan, Altis Semiconductor


Download
   
11:00 – 11:30  
 

Qixing Liu
Director, ASMC

   
11:30 – 12:00 Wafer Level SiP Technology - Full 3D Architecture for Future Sensors
  Albert Ou
Director, Corporate R&D, ASE Group
   
12:00 -12:10 Closing and lucky draw (Huawei P6S Smart Phone)




Mr. JY Zhang
Tel: 86-21-60278556
Email: jyzhang@semi.org

Ms. Stacy Zhang
Tel: 86-21-60278552
Email: stacy.zhang@semi.org.cn