LED China Conference 2013 |
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Lucky Draw for “LED China Conference 2013” Attendee Survey | |||||||||||||||
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The Global LED industry had been experienced a challenge in 2012, even more severe in China LED industry. However, China is keep growing to be the largest LED manufacturing base in the world. On the other hand, China also spares no pains to develop key equipment like MOCVD, materials such as sapphire substrates, MO precursor as well. The key issue China LED manufacturing industry is facing is how to upgrade the technology and reduce cost to improve core competence.
SEMI will organize the top conference in LED industry—“LED China Conference 2013” on Mar.20,2013 in Shanghai Pudong Kerry Hotel during the SEMICON China 2013 which is the largest semiconductor exhibition in the world. This conference is to build up a communication platform across LED manufacturing chain, the topics will cover hot topics like China MOCVD localization, GaN-on-Si LED mass manufacturing technology, PSS, investment plan of new LED Fabs, Solid State Lighting market, etc. We would be very pleased to invite you to attend the conference and looking forward to seeing you soon. |
LED Manufacturing Pavilion
LED China 论坛 2013 日程安排 |
8:30—9:00am
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Registration(注册)
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Moderator (A.M.)
上午场主持人 |
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9:00—9:30am
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Opening Keynote/开幕演讲(TBD)
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9:30—10:00am
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Trend and Challenge of LED Epitaxial and Chip Manufacturing Technology
LED外延技術發展與芯片所需具備的趨勢與挑戰 |
10:00—10:30am
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A Novel MOCVD for reducing cost of LED Manufacturing
为半导体照明高速发展提供新的活力的一种新型MOCVD技术 |
10:30—11:00am
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LED Production Yield improvement Using Advanced In-Situ Metrology Systems
先进现场检测系统提升LED制造良率 Thieme Tom, Director Marketing & Sales, LayTec AG slides download |
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11:00—11:30am |
Large Batch Etching within HBLED for maximizing throughput and yield in order to minimize Cost of Ownership
有助于降低拥有成本、提高良率用于高亮度LED制造中的刻蚀技术 |
11:30—12:00am
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LED Fab Investment & Materials Market Outlook
LED制造业投资与材料市场展望 Clark Tseng, Sr. Research Manager,SEMI 曾瑞榆, 资深研究经理,SEMI(国际半导体设备及材料协会) |
11:50—13:30pm
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Lunch Time(午餐)
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Moderator PM-1
下午第一场主持人 |
David Xiao, Managing Director, Advanced Photoelectronic Technology LTD. |
13:30—14:00pm
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LED Chip Development for Illumination Applications
照明应用LED芯片技术发展趋势 Yun-Li LI,CTO, Genesis Photonics Inc. 李允立,技术副总裁,新世紀光电股份有限公司 |
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14:00—14:30pm
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NOVEL HIGH-PERFORMANCE GaN MOCVD PLATFORM FOR LED PRODUCTION
新型高性能用于LED制造的GaN MOCVD 平台 Yingbin Liu,Technical Director,Advanced Micro-Fabrication Equipment Inc. 刘英斌,技术总监,中微半导体设备(上海)有限公司 |
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14:30—15:00pm
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Phosphor Solutions for Solid State Lighting
用于固态照明的荧光材料技术方案研究 Yi-Qun LI,CTO, Intematix Corporation Yi-Qun LI,首席技术执行官, 英特美公司 |
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15:00—15:15pm
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Tea Break(茶歇)
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Moderator PM-2
下午第二场主持人 |
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15:15—15:45pm
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Toward Mass Production of GaN-on-Si LED
用于大规模制造的硅基氮化镓LED技术 Long Yang ,Vice President of Research and Development, Bridgelux, Inc. Inc. Long Yang ,研发中心副总裁,普瑞光电 slides download |
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15:45—16:10pm
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Trend of Sapphire Substrate Technology and Market Overview
蓝宝石衬底技术趋势及市场概况 David Tuo, Director, Chongqing Silian Optoelectronics Science & Technology Co.,Ltd. 庹云川, 总监, 重庆四联光电科技有限公司 slides download |
16 :10—16:35pm
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The development and inspection solution to PSS in Taiwan
台湾PSS制造及检测技术发展 SHAOK-KANG HUNG,General Manager, Force Precision Instrument Co., Ltd. 洪绍刚, 总经理, 原力精密仪器股份有限公司 slides download |
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16 :35—17:00pm
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Trend of LED package manufacturing for illumination and display
照明及背光应用的LED封装制造技术趋势 Jay LIU, Executive Vice President, ShineOn 刘国旭,执行副总裁,易美芯光(北京)科技有限公司 slides download |
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17 :00—17:20pm
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Closing Remark and Lucky Draw
会议总结及抽奖 |
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* Agenda is subject to change 议程变化恕不另行通知
Type | Before Mar.1 with Advanced Payment(Early Bird) | After Mar.1 and On-site |
Attendees | RMB 600 per person | RMB 800 per person |
Speakers | Free | Free |
*The fee above is for conference and lunch.
The Best Platform for Your Business Contact Us for Marketing Promotion Opportunities |
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Daniel Qi | |||||
SEMI China
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Tel:
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+86.21.6027.8576
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Fax:
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158-0193-5068
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Mob:
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+86.21.6027.8511
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Email:
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