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+86.21.6027.8500
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March 14-16,2018
Shanghai New International Expo Centre

IC Applications from Design to Manufacturing Forum 2013

SEMICON China - 同期研讨会/活动 - IC设计与制造技术论坛

IC Application from Design to Manufacturing 

Date: Thursday, March 21, 2013  
Time: 08:30 – 15:20
Venue: Function Room 3, Kerry Hotel Pudong, Shanghai(Shangri-La Group)
Note: Chinese and English Simultaneous Interpretation will be provided on-site.

Sponsored by:
                 

 Program Brief

Represented by ASMC, CSMC, SMIC, Hua Hong NEC and Grace, China local IC industry has been growing and expanding rapidly. In recent years, the gap between China and the rest of the world narrows signicantly in terms of technology and design capacity. Volume production has been achieved at 90nm, 65nm, 45nm, and even 32nm process nodes. Meanwhile, IC design occupies nearly 20% market share of the whole industry. Local design and manufacturing supplement each other well and play a key role in the development of China IC Market.

Localization is certainly an irreversible trend, and China local IC industry is set to become a strong power in the future. As an industry association serving the whole supply chain for the microelectronic, display and photovoltaic industries, SEMI China will organize “The China Market: IC Design to Manufacturing” forum in conjunction with SEMICON China 2013.

Prestigious scholars and industry experts will discuss and address on China local IC industry status and future development. This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scientic information, ideas and solutions in the industry. It offers a good opportunity to reach customers from the china local IC industry.

Topics

Advanced Technology in IC Design and Manufacturing
Future IC Development Trend and Challenges
Current IC Manufacturing Technology for Telecom
IC in Wireless System
      ——IC Design in 3G: TD-SCDMA, WCDMA, CDMA2000
      ——IC Design in 4G: LTE, WiMax
      ——Network Processor

IC in Fixed Line System
IP Needed in Communication System
IGBT& Power Management IC
LED Driver
State-of-the-Art of EDA Tools

Who Should Attend

Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service

Agenda
 

Conference Host: TBD
   
8:30-9:00 Registration
   
9:00-9:10 Opening Remark
   
9:10-9:40
Advanced analog manufacturing Service

Weiping Zhou
VP of Advanced Semiconductor Manufacturing Corporation

yu_qing_lin@asmc.com.cn
   
9:40-10:10
Building China IC Manufacture Platform, Partnering for Success

Jyishyang Liu
Senior Vice President, Central Engineering & Services, Central Operations (Acting), SMIC
   
10:10-10:30 Tea Break

10:30-11:00

 Innovation & Partnership to Drive Success

Tony Chen
President of Asia Pacific, Grace

11:00-11:30
Semiconductor Packaging Solutions in the Mobile World

Dr. Yifan Guo
Vice President of Engineering, ASE Shanghai

http://www.aseglobal.com/en/

13:00-13:30

RF Solution for 4G Smart Phones

Jim Bao
Director of Engineering, RFMD, Inc

13:30-14:00

SMAP----Product design and solution for mobile payment applications

Li Wei
Technical Director, Shanghai Fudan Microelectronics Group Co Ltd

liwei@fmsh.com.cn

14:00-14:20 Tea Break
   
14:20-14:50

Advanced Design Requirements in Legacy Processes

Russell Lee
PacRim Technical Director, Mentor Graphics Corporation


slides download

   
14:50-15:20
Recent Trends in U.S. Patent Law  that Affect IC Industry

Ningling Wang
Partner, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP

slides download

Contact us:


 


Program Manager:
Mr. Kevin Wu
Tel:86.21.6027.8558
Email:kwu@semi.org

Mr.Norman Cheng 
Tel:86.21.6027.8557
Email:ncheng@semi.org

Customer Service:
Mr. Norman Cheng
Tel:86.21.6027.8557
Email:ncheng@semi.org