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+86.21.6027.8500
English
March 14-16,2018
Shanghai New International Expo Centre

3DIC Training 2013

SEMICON China - SESSIONS / EVENTS - China Equipment Market Forum

3DIC Training                                                   
Date and Venue

08:30-17:00        March 19, 2013

Pudong Ballroom 3, Kerry Hotel Pudong (Shangri-la Group), Shanghai, China

INSTRUCTOR:Dr. Yuan Xie

Abstract

This 3D tutorial will give an introduction on emerging 3D IC technology,discuss design automation algorithm/methodology for 3D IC design,present various architectural innovations for 3D microprocessor/SOC designs and discuss thecost implication for 3D ICs.

Who Should Attend?

undergraduate and graduate students in EE/CS major,VLSI design engineers, technical managers, and anyone who is interested in design perspective of 3D IC technologies.

Dr. Yuan Xie is Professor in Computer Science and Engineering department at the Pennsylvania State University, and is now on-leave from PSU to lead the AMD Research China Lab in Beijing. He received the B.S. degree in electronic engineering from Tsinghua University, Beijing, and the M.S. and Ph.D. degrees in electrical engineering from Princeton University. He has published more than 100 research papers in journals and refereed conference proceedings, in the areaof EDA, computer architecture, VLSI circuit designs, and embedded systems. His research projects include: three-dimensional integrated circuits (3D ICs) design, EDA, and architecture; emerging memory technologies; low power and thermal-aware design; reliable circuits and architectures; and embedded system synthesis.

Lecture Outlines

1.Overview and challenges for future Microprocessor and IC design

2.3D IC process technologies: SIP, TSV, Silicon interposer, and monolithic 3D ICs

3.Benefits of 3D ICs

4.CAD tools and algorithms for 3D IC design

5.Thermal analysis and thermal-aware design

6.3D Microarchitecture: fine-grained 3D microprocessor design vs. coarse-grained 3D micprocessor design

7.Heterogeneous 3D integration: 3D emerging memory technologies

8.Cost implication for 3D ICs

9.Novel applications for 3D ICs

10.Conclusion

Contact us:

Program Manager:
Mr. Kevin Wu
Tel:86.21.6027.8558
Email:kwu@semi.org

Mr.Xianwei Xin
Tel:86.21.6027.8556
Email:xwxin@semi.org

Customer Service:
Mr. Norman Cheng
Tel:86.21.6027.8557
Email:ncheng@semi.org