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English
March 14-16,2018
Shanghai New International Expo Centre

Hartmut Schneider

Hartmut Schneider
Vice President, M+W Group GmbH

Abstract

Smart wafer fabs require a strong IT and communications backbone that utilizes ultra-high-speed networks, both connected as well as wireless, and big data analysis and storage capabilities. Data is provided from multiple decentralized sources that are low-cost IoT devices which collect, analyze, consolidate and upload process data in real time.

Furthermore, smart capabilities need to be applied to multiple IT systems in the fab, such as Manufacturing Execution Systems (MES), Enterprise Resource Planning (ERP) and Facility Management Control Systems (FMCS). As an example, the integration of the FMCS with the above systems would provide improved yield loss analyses through interfacing with the MES system or demand driven ordering of facility materials and consumables via the ERP system.

By implementing smart sensors, in-situ measurements and controls, the efficiency, sustainability and stability of facility systems can be improved as well as facilitating remote service and maintenance. This may require the development of future FMCS systems separated into two distinct subsystems, namely core and smart modules. When interfaced to the FMCS system, the Building Information Management (BIM) system could offer an ideal platform for real-time FMCS data reporting, virtual (or augmented reality) walk-through of a wafer fab, data analyses and recommended measures, all in a 3D+ environment.

The introduction of smart manufacturing into wafer fabs will support semiconductor manufacturers become leaner in terms of design efficiency, construction cost and fab operations as well as improved sustainability and environmental health and safety.