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March 20-22, 2019
Shanghai New International Expo Centre

Prof. Wenhui Zhu

Prof. Wenhui Zhu
Central South University, China

Dr. Wenhui Zhu is professor of Central South University, China. He is the Chief Scientist of “Fundamental Research on Wafer-Level 3D Integration for 20/14nm ICs” which is the 1st National Basic Research Program (973) in 3D IC integration. He was elected as Specially invited “1000 Elite Plan Expert (2011)” under top class Talent plan of China. Previously he was Chief Technology Officer of Tian Shui Hua Tian Technology Co. Ltd, CEO of Kun Shan Q Technology Limited Co. He has been working in TSV packaging, DFR (design for reliability), DFM (design for manufacturability) and DFP (design for performance), packaging materials and 3D nano-/micro-electronics packaging in leading semiconductor and packaging companies including Infineon,UTAC and TSHT. Dr. Zhu chaired many key projects in advanced packaging and structural integration such as national 863 project, Chinese natural science fund, and state key technology projects and made great achievements in technology innovation and cost-saving. He is a key player of international conferences, e.g. IEEE ICEPT(2008-now) and EPTC (2006-2009), as organization committee or technical committee chairman / co-chairman. Dr. Zhu is also reviewer of a few international journals in packaging areas. He has been invited to give keynote talks and short courses in international forums and conferences. Dr. Zhu has published more than 160 technical papers,owns 46 patents and won 4 times of best paper awards.