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March 18-20, 2020
Shanghai New International Expo Centre

Dr. Huili Fu

Dr. Huili Fu
senior technical advisor, Huawei

Biography

Dr Fu is the senior technical advisor of Huawei. Previously, he was the department director of IC Packaging Engineering, established the team and was in charge of all Huawei IC packaging activities. He led the team and developed packaging solutions for Huawei Kirin chipsets, networking chipsets, and all other consumable chipsets, including Cu pillar technology, PoP, HBPoP, Fan-out, TSV 2.5D, super performance heterogeneous packaging technology and other advanced IC packaging technologies. Before he joined Huawei, Dr Fu worked in universities and national research Institutes. Dr Fu obtained his PhD degree in Mechanical Engineering from HongKong University of Science and Technology.