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Zhiwei Liu is an Associate Professor in the School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China. He received the B.S. and M.S. degrees in electrical engineering from Huazhong University of Science and Technology, Wuhan, China, in 2001 and 2003, respectively, and the Ph.D. degree in electrical engineering from the University of Central Florida, Orlando, in 2010. From July 2003 to December 2004, he joined the Department of High Speed Converter, ADI Beijing Design Center, Beijing, China, as an Integrated Circuits Design Engineer. His research interests include electrostatic discharge protection devices design, technology computer-aided design simulation and advanced semiconductor devices modeling.
Dr. Liu holds 2 U.S. patents and edited one book published by Springer, 2017, and he has also published more than 40 papers, including 20 peer reviewed journal papers. In addition, Dr. Liu has organized several IEEE international conference and served as General Chair or Technical Program Committee Chair, including IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA2019, IPFA2017), IEEE Nanoelectronics Conference (INEC2016), IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC 2014). Dr. Liu has served as the vice-Chair of IEEE EDS Chengdu Chapter and organized several Mini Colloquium for Chengdu Chapter (2012, 2015, 2017).
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