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Dr. Wei Yao Scientific Associate, Henkel Adhesive Technologies – Electronics |
Biography 2003-2012, Ph.D. degree from Nanjing University Major in Polymer Chemistry and Physics. Research about the self-assembly of macromolecule. 2012, Joined Henkel Adhesive Technologies – Electronics – Semiconductor. Focus on Semi-sintering, Silicone system. Abstract Henkel provides different solutions for Power & RF applications • Developing semi-sintering die attach paste for Higher power and high reliability package. • Upgrading existing die attach paste to enable higher reliability. • Developing new CDF to enable high reliability and Miniaturization. |