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Dr. Zhenqiu Liu
Director of Wet Process Engineering, TEL, USA

 


Dr. Zhen Qiu Liu is the Director of Wet Process Engineering for TEL NEXX Inc. TEL NEXX designs and manufactures innovative high throughput manufacturing systems for advanced WLCSP packaging and 3D integration. Dr. Liu’s activities focus on helping customers bridge key technology gaps by identifying and developing value-added electroplating solutions. He has been instrumental in the creation of many strategic partnerships with R&D teams of leading semiconductor manufacturers and with the sponsors of principal semiconductor industry consortia.

Dr. Liu has devoted his attention to advanced electro-deposition applications including a wide variety of operating conditions utilizing multiple different plating chemistries; high speed Cu plating for pillar, TSV gap filling, and lead-free solder bumping; minibump process for 3D integration, gold bump plating process that optimize bump profile; and low-stress NiFe plating.
 
Dr. Liu lends his expertise to all aspects of the design and development of semi-automatic and fully automatic plating systems, including plating-related processes such as wafer wetting, oxide removal, electrodeposition, reservoir chemistry control, wafer rinsing and drying, photoresist stripping, and seed layer etching. TEL NEXX electroplating tools can implement all of these processes.
 
Prior to joining TEL NEXX, Dr. Liu had a highly successful career in semiconductor wet process research and development that spanned 20 years and culminated in his co-founding a company that developed an early version of the fully automatic 300mm electrodeposition system, known as the Stratus plating tool today.
Educated in China (Baccalaureate and Master’s degrees in chemical engineering from South China University of Technology, Guangzhou, China) and the United States, Dr. Liu holds a doctorate in chemical engineering from the University of New Hampshire, Durham, NH, 1995.

 

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