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Chinese
2020年3月18-20日
上海新国际博览中心

专家委员会介绍

International Advisory Committee Members
       
Dr. T. C. Chen
Chair
IBM Fellow and VP, IBM T.J. Watson Research Center, USA
Dr. Minhwa Chi
Co-Chair
SVP/TD, SiEn (Qingdao) Integrated Circuits Co.
       
Dr. Philip Wong
Co-Chair
Professor, Stanford University, USA
  Dr. Georg Bednorz
Member
IBM Fellow, Nobel Laureate, Switzerland
       
Dr. Qingyuan Han
Member
Hans Consulting International, USA
Dr. Kinam KIM
Member
President and CEO, Samsung Institute of Advanced Technology, Korea

       
Mrs. Ying Shi
Member
ICMTIA, China

Dr. Hailing Tu
Member
GRINM, China
       
Dr. Shichang Zou
Member
Chinese Academy of Sciences, China

Dr. Edward Y. Chang
Member
National Chiao Tung University, Taiwan, China
       
Dr. Shaojun WEI
Member
Professor, Tsinghua Universtiy, China

Dr. Chenming HU
Member
Professor, UC Berkeley, USA

       


   
       
       
Steering Committee Advisors
       
Mr. Lung Chu
President,SEMI China
Vice President,SEMI
Dr. Hiroshi IWai
Member
Tokyo Institute of Technology, Japan
       
Dr. Tomi T. Li
Member
National Taiwan Central University
Dr. David P. Huang
Member
VP, Pall Inc. USA
       
Dr. Lode Lauwers
Member
VP, IMEC, Belgium
   
       
       
Conference Executive Committee Members
       
Dr. Steve X. Liang
Conference Chair, Symp-VII Chair
VP and CTO of Jiangsu Changjiang Electronics Technology
Dr. Qinghuang Lin
Symp-VIII Chair, Conference Executive Co-Chair
Director, ASML, USA
       
Dr. Ru Huang
Symp-I Chair, Conference Co-Chair
Professor and Dean, Peking University, China
Dr. Cor Claeys
Conference Co-Chair and Award Selection Chair
Professor, KU Leuven, Belgium
       
Dr. Hanming Wu
Conference Co-Chair
Etown IP, China
Dr. Kafai Lai
Symp-II Chair
Sr. Engineer, IBM T.J. Watson Research Center, USA
       
Dr. Ying ZHANG
Symp-III Chair
VP, Applied Materials, USA
Dr. Beichao Zhang
Symp-IV Chair
Sr. Director, HFC Semiconductor, China
       
Dr. Xinping Qu
Symp-V Chair
Professor, Fudan University, China
Dr. Peilin Song
Symp-VI Chair, Conference Co-Chair, Publicity Chair
Manager, IBM T.J.Watson Research Center, USA
       
Prof. Wenjian Yu
Symp-IX Chair
Associate Professor, Tsinghua University, China
Dr. Hsiang-Lan Lung
Poster Chair
Director MXIC, Taiwan, China
       
       
Symposium I: Device Engineering and Technology
       
Dr. Ru Huang
Chair
Peking University, China
Dr. Cor Claeys
Co-Chair
KU Leuven, Belgium
       
Dr. Minhwa Chi
Co-Chair
SiEn (Qindao) Integrated Circuits Co.
Dr. Chung Lam
Co-Chair
Jiangsu Advanced Memory Technology Co. Ltd., China
       
Prof. Jong-Ho Lee
Co-Chair
Seoul National University, Korea
Prof. Ming Liu
Co-Chair
IME, CAS, China
       
Prof. Yimao Cai
Member
Peking University, China
Dr. Wensheng Qian
Member
HHGrace
Prof. Mario Lanza
Member
Soochow University, China
       
Dr. Huiling Shang
Member
TSMC
Dr. Zhiqiang Wei
Member
Panasonic, Japan
       
Dr. Hong Wu
Member
Technology R&D, SMIC, China
Prof. Huaqiang Wu
Member
Microelectronics, Tsinghua University, Beijing, China
       
Dr. Frank Bin Yang
Member
Qualcomm, USA
Prof. Mario Lanza
Member
Soochow University, China
       
Prof. Xinran Wang
Member
Nanjing University, China
  Prof. Ming Li
Member
Peking University, China
       
Prof. Peng Zhou
Member
Fudan Univeristy, China
   
       
Symposium II: Lithography and Patterning
       
Dr. Kafai Lai
Chair
IBM T.J. Watson Research Center, USA
Dr. Linyong (Leo) Pang
Co-Chair
D2S Inc.
       
  Dr. Qiang Wu
Co-Chair
ICRD
Dr. George Lu
Co-Chair
Dow Dupont
       
Prof. Yayi Wei
Member
IMECAS, China
Mr. Xiaoming Ma
Member
Dow Chemical
       
Dr. Zhimin Zhu
Member
Brewer Science, USA
  Dr. Zhibiao Mao
Member
Nata Chemicals
       
Mr. Motokatsu.Imai
Member
今井 基勝, 水戸工業(株)
Dr. Hai Deng
Member
Fudan University, China
       
Dr. Shiyuan Liu
Member
Huazhong University of Science and Technology , China
Dr. Wang Yueh
Member
Intel, USA
       
Dr. Ban-Ching Ho
Member
Nissan Chemicals
Dr. Yuyang Sun
Member
Photronics




Dr. David H. Wei
Member
ASML Brion
Dr. Chris Progler
Member
Photronics




  Dr. Weimin Gao
Member
ASML
   
       
Symposium III: Dry &Wet Etch and Cleaning
       
Dr. Ying ZHANG
Chair
Applied Material, USA
Dr. Maxime Darnon
Co-Chair
French Institute for Scientific Research (CNRS), France
       
Dr. Tom Ni
Co-Chair
AMEC, China
Mr. Jinrong Zhao
Member
North Microelectronics, China
       
Dr. Sebastian Engelmann
Member
IBM T.J.Watson Research Center, USA
Dr. Steven Zhang
Member
SMIC, China
       
Dr. Kaidong Xu
Member
IMEC, Belgium
Dr. Ying Huang
Member
Applied Material, China
       
  Dr. Huiyuan Pei
Member
Lam Research, China
Dr. Wendy Yan
Member
IBM, Thomas J. Watson Center, USA
       
  Dr. Kevin Zhou
Member
Applied Materials, USA
Dr. Ying Xiao
Member
TEL, China
       
Dr. Jianping Zhao
Member
TEL, USA
   
       
Symposium IV: Thin film, Plating and Process Integration
       
Dr. Beichao Zhang
Chair
HFC Semiconductor, China
Dr. Zhen Guo
Co-Chair
Intel, China
       
Mr. Xiaoping Shi
Co-Chair
Beijing Naura Microelectronics, China
Dr. Chao Zhao
Co-Chair
IMECAS, China
       
Dr. Huang Liu
Co-Chair
GLOBALFOUNDRIES, USA
Dr. Jiang Yan
Co-Chair
North China University of Technology, China
       
Dr. Chih-Chao Yang
Co-Chair
IBM Research
Dr. Ran Liu
Member
Fudan University, China
  Dr. Ning Cheng
Member
Intel, USA

Dr. Jon REID
Member
Lam Research, USA
       
Prof. Yu-Long Jiang
Member
Fudan University, Shanghai
Dr. Li-Qun Xia
Member
AMAT, USA
       
Dr. Julian Hsieh
Member
ASM, Taiwan, China
Dr. Jianhua Ju
Member
Assistant Director, SMIC Tech R&D
       

Dr. Ganming Zhao
Member
Applied Materials
Dr. Larry Zhao
Member
Lam Research, USA
     

Dr. Jiaxiang Nie
Member
Lam Research, China


Mr. Allen Liu
Member
IMEC, Belgium
   
       

Dr. Xun Gu
Member
Western Digital
   
       
Symposium V: CMP and Post-Polish Cleaning
       
Dr. Xinping Qu
Chair
Fudan University, China
Dr. Yuchun Wang
Co-Chair
Anji Microelectronics, China
       
Dr. Jingxun Fang
Co-Chair
Huali Microelectronics Corporation, China
Dr. Kuochun Wu
Co-Chair
Cabot Microelectronics, Asia
       
Dr. Paul-Chang Lin
Member
Semiconductor Global Solutions(SGS), China
Dr. David P. Huang
Member
Pall Corporation, USA
       
Dr. Jin-Goo Park
Member
Hanyang University, Korea
Dr. Kailiang Zhang
Member
Tianjin University of Science & Technology, China
       
Dr. Mahadevaiyer Krishnan
Member
IBM, USA
Dr. Shoutian Li
Member
Anji Microelectronics, China
       
Dr. XinChun Lu
Member
Tsinghua University , China
  Dr. Wen-Chiang Tu
Member
Applied Materials, USA
       
Dr. Chao-Chang Arthur Chen
Member
NTUST, Taiwan, China


       
       
Symposium VI: Metrology, Reliability and Testing
       
Dr. Peilin Song
Chair
IBM, USA
Dr. Baozhen Li
Co-Chair
IBM System and Technology Group, USA
       
Dr. Frank Feng
Member
Mentor Graphics Corporation, America
Dr. Yiping Xu
Member
Raintree Technologies Corp
       
Dr. Yuhua Cheng
Member
Peking University, China
Dr. Francis Jen
Member
KLA Tencor, China
       
Dr. Kelvin Xia
Member
Advantest, China
Dr. Srinivas Raghvendra
Member
Synopsys, USA
       
Dr. Xiaowei Li
Member
IMECAS, China
Dr. Yu Huang
Member
Mentor Graphics, USA
       
Dr. Jian-fu Zhang
Member
Liverpool John Moores University, England
Dr. Houken Tseng
Member
Teradyne, Greater China, China
       
Dr. Yu Zhu
Member
TSMC
Dr. Ye Feng
Member
Technical Director, Lam Research, USA
       
Dr. Tung-Yang Chen
Member
AIP Technology Corporation, Taiwan, China

 
       
       
Symposium VII: Packaging and Assembly
       
Dr. Steve X. Liang
Chair
Jiangsu Changjiang Electronics Technology Co., Ltd, China
Dr. Yifan Guo
Co-Chair
ASE Shanghai
       
Dr. Huili Fu
Co-Chair
HiSilicon
Dr. Mark Huang
Member
A-kelon (Huizhou) Optronics Ltd, China
       
Prof. Mingliang Huang
Member
Dalian University of Technology, China
Prof. Kuan-Neng Chen
Member
National Chiao Tung University
       
Dr. Shin-Puu Jeng
Member
TSMC
  Prof. Xing Wu
Member
East China Normal University
       
Prof. Wenhui Zhu
Member
Central South University
  Mr. John Rowland
Member
Spreadtrum
       
Dr. John Yuanlin Xie
Member
Altera Corp., CA, USA
Dr. Roy Yu
Member
IBM, Watson Research Center, USA
       
Dr. Yishao Lai
Member
ASE. Taiwan, China
Dr. Jing Shi
Member
Oracle, USA
       
Dr. Young Do Kweon
Member
Samsung, Korea
Dr. Renzhe Zhao
Member
Huawei, China
       
  Dr. Hong SHI
Member
Xilinx
Dr. Tim Bao
Member
Air Products and Chemicals, Inc
       
Dr. Tim Chen
Member
Yantai Darbond Technology Co., Ltd.
Dr. Daniel Lu
Member
Henkel
       
Dr. Wang Su
Member
Shanghai Sinyang Semiconductor Materials Co., Ltd.,
The board of Sinyang Semiconductor (Shanghai)
Technology and Innovation Co., Ltd.
Prof. Horng-Show (Frank) Koo
Member
Minghsin University of Science and Technology(MUST)
       
       
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
       
Dr. Qinghuang Lin
Chair
ASML, USA
Prof. Hyungjun Kim
Co-Chair
Yonsei University, South Korea
       
Dr. Hsiang-Lan Lung
Co-Chair
Macronix International Ltd., Hsinchu, Taiwan, China
Dr. Zhiyong Ma
Co-Chair
Intel
       
Prof. Jingwei Bai
Member
Tsinghua University, China
Prof. Edward Y. Chang
Member
National Chiao Tung University, Taiwan, China
       
Dr. Kangguo Cheng
Member
IBM, USA
Prof. Jinn P. Chu
Member
National Taiwan University of Science and Technology, China
       
Prof. Thomas Otto
Member
Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany
Prof. Zheyao Wang
Member
Tsinghua University, China
       
Prof. Daniele Lelmini
Member
Politecnico Di Milano, Italy
Prof. Wei Wang
Member
Peking University, China
       
Prof. Fuhua Yang
Member
Institute of Semiconductor, Chinese Academy of Sciences, China
Dr. Wang Yueh
Member
Intel, USA
       
Prof. Zhen Zhang
Member
Uppsala University, Sweden
Dr. Chang CHEN
Member
SITRI, China
       

Dr. Huamao LIN
Member
SITRI, China
   
       
Symposium IX: Design and Automation of Circuits and Systems
       
Prof. Wenjian Yu
Chair
Tsinghua University, China
Prof. Cheng Zhuo
Co-Chair
Zhejiang University, China
       
Prof. Weikang Qian
Co-Chair
University of Michigan-Shanghai Jiao Tong University Joint Institute, China
Prof. Yiyu Shi
Member
University of Notre Dame, USA
       
Dr. Jinjun Xiong
Member
IBM T.J. Watson Research Center, USA
Prof. Yu-Guang Chen
Member
Yuan-Ze University, Taiwan, China
       
Prof. Baoyong Chi
Member
Tsinghua University, China
Prof. Yinhe Han
Member
Chinese Academy of Science, China
       
  Dr. Li Li
Member
Synopsys Inc., Shanghai
  Dr. Bing Li
Member
Technical University of Munich, Germany
       
Prof. Shaojun Wei
Member
Tsinghua University, China
Prof. Le Ye
Member
Peking University, China
       
  Prof. Xiaoyang Zeng
Member
Fudan University
Prof. Pingqiang Zhou
Member
Shanghai Tech University
       
  Prof. Chuan Zhang
Member
Southeast University
Prof. Wanyuan Qu
Member
Zhejiang University
       
Dr. Jianli Chen
Member
Fuzhou University
  Dr. Changhao Yan
Member
Fudan University
       
       


Conference Questions   Sponsorship Contact  
       
April Peng, SEMI China Cheryl Qiu, SEMI China June Wu, SEMI China  
Email: apeng@semichina.org Tel: 86.21.6027.8552 Tel: 86.21.6027.8523  
  Fax: 86.21.6027.8511 Fax: 86.21.6027.8511  
  Email: cheryl.qiu@semichina.org Email: jwu@semi.org