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Chinese
2018年3月14-16日
上海新国际博览中心

专家委员会介绍

Committee Members

International Advisory Committee Members

Dr. T. C. Chen
Chairman
IBM Fellow and VP, IBM T.J. Watson Research Center, USA
   
Dr. Minhwa Chi
Co-Chair
Senior VP, SMIC
   
Dr. Philip Wong
Co-Chair
Stanford University, USA
   
  Dr. Swami Mathad
Co-Chair
Tech Consulting, USA
   
Dr. Georg Bednorz
Member
IBM Fellow, Nobel Laureate, Switzerland
   
Dr. Qingyuan Han
Member
Hans Consulting International, USA
   
Dr. Kinam KIM
Member
President and CEO, Samsung Institute of Advanced Technology, Korea
   
Mrs. Ying Shi
Member
ICMTIA, China
   
Dr. Hsing-Huang Tseng
Member
Texas State University
   
Dr. Hailing Tu
Member
GRINM, China
   
Dr. Shichang Zou
Member
Chinese Academy of Sciences, China
   
Dr. Edward Y. Chang
Member
National Chiao Tung University, Taiwan, China
   

Steering Committee Advisors
Mr. Lung Chu
President,SEMI China
Vice President,SEMI


   
Dr. Hiroshi IWai
Member
Tokyo Institute of Technology, Japan
   
Dr. Tomi T. Li
Member
National Taiwan Central University
   
Dr. David Huang
Member
Pall Inc. USA


Conference Chair and Co- Chairs
Dr. Ru Huang
Chairman
Peking University, China
   
Dr. Cor Claeys
Co-Chair
IMEC, Belgium
   
Dr. Hanming Wu
Co-Chair
SMIC, China
   
Dr. Qinghuang Lin
Co-Chair
IBM, USA
   
Dr. Steve Liang
Co-Chair
Jiangsu Changjiang Electronic Technology Co., Ltd, China
   
Dr. Peilin Song
Co-Chair Publicity
IBM, USA
   
Mr. Zhen Guo
Co-Chair
Intel, USA
   


Symposium Chair:
Dr. Ru Huang
Chairman
Peking University, China
   
Dr. Kafai Lai
Chairman
IBM, USA
   
Dr. Ying ZHANG
Chairman
Applied Materials, USA
   
Mr. Zhen Guo
Chairman
Intel, USA
   
Dr. Yuchun Wang
Chairman
Anji Microelectronics, China
   
Dr. Peilin Song
Chairman
IBM, USA
   
Dr. Steve Liang
Chairman
Jiangsu Changjiang Electronics Technology Co., Ltd, China
   
Dr. Qinghuang Lin
Chairman
IBM, USA
   
Dr. Yiyu Shi
Chairman
Missouri University of Science and Technolog, USA
   
Dr. Hsiang-Lang Lung
Poster Chairman
Macronix International Ltd., Hsinchu, Taiwan
   


Symposium I: Device Engineering and Technology
Dr. Ru Huang
Chairman
Peking University, China
   
Dr. Cor Claeys
Co-Chair
IMEC, Belgium
   
Dr. Minhwa Chi
Co-Chair
Senior VP, SMIC
   
Dr. Chung Lam
Co-Chair
Principle Engineer, IBM, USA
   
Dr. Jong-Ho Lee
Co-Chair
Seoul National University, Korea
   
Dr. Ming Liu
Co-Chair
IME, CAS, China
   
Dr. Yimao Cai
Member
Peking University, China
   
Dr. Shaoning Mei
Member
Wuhan Xinxin Semiconductor Manufacturing Corp
   
  Dr. Wensheng Qian
Member
Director, HHGrace
   
Dr. Huiling Shang
Member
TSMC
   
Dr. Zhiqiang Wei
Member
Panasonic, Japan
   
Dr. Hong Wu
Member
SMIC, China
   
Dr. Huaqiang Wu
Member
Microelectronics, Tsinghua University, Beijing, China
   
Dr. Frank Bin Yang
Member
Qualcomm, USA
   
Dr. Huilong Zhu
Member
IME, CAS, China
   
Dr. Mario Lanza
Member
Soochow University, China
   


Symposium II: Lithography and Patterning
Dr. Kafai Lai
Chairman
IBM, USA
   
Dr. Linyong (Leo) Pang
Co-Chair
VP. D2S Inc.
   
  Dr. Ken Wu
Co-Chair
SMIC, China
   
Mr. Xiaoming Ma
Member
Dow Chemical
   
  Dr. Zhimin Zhu
Member
Brewer Science, USA
   
  Dr. Zhibiao Mao
Member
Huali Semiconductor Manufacturing Company, China
   
  Dr. Yayi Wei
Member
Chinese Academy of Science
   
Mr. Motokatsu.Imai
Member
SEAJ (Semiconductor Equipment Association of Japan)
   
  Dr. Hai Deng
Member
Fudan University, China
   
Dr. Wang Yueh
Member
Intel, USA
   
Dr. Shiyuan Liu
Member
Huazhong University of Science and Technology , China
   
Dr. Yuyang Sun
Member
Mentor Graphics,USA
   


Symposium III: Dry &Wet Etch and Cleaning
Dr. Ying ZHANG
Chairman
VP, Applied Material, USA
   
Dr. Maxime Darnon
Co-Chair
French Institute for Scientific Research (CNRS), France
   
Dr. Yue Kuo
Co-Chair
Texas A&M University, USA
   
  Dr. Tom Ni
Member
AMEC, China
   
Mr. Jinrong Zhao
Member
North Microelectronics, China
   
Dr. Sebastian Engelmann
Member
IBM T.J.Watson Research Center, USA
   
Dr. George Totir
Member
IBM T.J.Watson Research Center, USA
   
Dr. Masahiro Sumiya
Member
Hitachi High-Technologies Corp., Japan
   
Dr. Denis Shamiryan
Member
Global Foundries, USA
   
Dr. Steven Zhang
Member
SMIC, China
   
Dr. Kaidong Xu
Member
IMEC, Belgium
   


Symposium IV: Thin film, Plating and Process Integration
Dr. Zhen Guo
Chairman
Intel, China
   
Dr. Beichao Zhang
Co-Chair
SMIC, China
   
  Mr. Xiaoping Shi
Co-Chair
IMEC, Belgium
   
Dr. Chao Zhao
Co-Chair
IME, CAS, China
   
Dr. Huang Liu
Co-Chair
Global Foundries, USA
   
Dr. Jiang Yan
Co-Chair
Institute of Microelectronics, CAS
   
Dr. Ran Liu
Co-Chair
Fudan University, China
   
Dr. Sowmya Krishnan
Co-Chair
SEMITRAC, USA
   

Dr. Ning Cheng
Member
Intel, USA
   
Dr. Jon REID
Member
Novellus, USA
   
Prof. Yu-Long Jiang
Member
Fudan University, Shanghai
   
Dr. Li-Qun Xia
Member
AMAT, USA
   
Dr. Julian Hsieh
Member
ASM, Taiwan
   
Dr. Chih-Chao Yang
Member
IBM Research
   
Dr. Jianhua Ju
Member
Assistant Director, SMIC Tech R&D
   
Dr. Massayasu Tanjyo
Member
Nissin Ion Equipment, Japan
   
  Dr. Ganming Zhao
Member
Applied Materials
   
Dr. Zheyao Wang
Member
Tsinghua University, China
   
Dr. Da Zhang
Member
Higon, USA
   
Dr. Larry Zhao
Member
Lam Research, USA
   
Dr. Jiaxiang Nie
Member
Lam Research, China
   

Symposium V: CMP and Post-Polish Cleaning
Dr. Yuchun Wang
Chairman
Anji Microelectronics, China
   
Dr. Jingxun Fang
Co-Chair
Huali Microelectronics Corporation, China
   
Dr. Kuochun Wu
Co-Chair
Cabot Microelectronics, Asia
   
Dr. Paul-Chang Lin
Member
SMIC, China
   
Dr. David Huang
Member
Pall Corporation, USA
   
Dr. Jin-Goo Park
Member
Hanyang University, Korea
   
Dr. Kailiang Zhang
Member
Tanjin University of Science & Technology, China
   
Dr. Mahadevaiyer Krishnan
Member
IBM, USA
   
Dr. Shoutian Li
Member
Anji Microelectronics, China
   
Dr. XinChun Lu
Member
Professor,Tsinghua University , China
   
  Dr. Wen-Chiang Tu
Member
Applied Materials, USA
   

Symposium VI: Metrology, Reliability and Testing
Dr. Peilin Song
Chairman
IBM, USA
   
Dr. Baozhen Li
Co-Chair
IBM System and Technology Group, USA
   
Dr. Frank Feng
Member
Mentor Graphics Corporation, America
   
Dr. Yiping Xu
Member
Sr.Vice President ahd CTO,Raintree Technologies Corp
   
Dr. Yuhua Cheng
Member
Peking University, China
   
Dr. Francis Jen
Member
KLA Tencor, China
   
Dr. Kelvin Xia
Member
Advantest, China
   
Dr. Srinivas Raghvendra
Member
Synopsys, USA
   
Dr. Xiaowei Li
Member
Chinese Academy of Sciences
   
Dr. Yu Huang
Member
Mentor Graphics, USA
   
Dr. Jian-fu Zhang
Member
Liverpool John Moores University, England
   
Dr. Houken Tseng
Member
Teradyne, Greater China,China
   
  Dr. Huaguo Liang
Member
Hefei University of Technology, China
   

Symposium VII: Packaging and Assembly
Dr. Steve Liang
Chairman
Jiangsu Changjiang Electronics Technology Co., Ltd, China
   
Dr. Yifan Guo
Co-Chair
VP of Engineering, ASE Shanghai
   
Dr. Huili Fu
Co-Chair
Chief Packaging Expert, HiSilicon
   
Dr. Mark Huang
Member
SuZhou Speed Semiconductor, China

 
Prof. Mingliang Huang
Member
Dalian University of Technology, China
   
Prof. Kuan-Neng Chen
Member
Professor, National Chiao Tung University
   
Dr. Shin-Puu Jeng
Member
Director, TSMC
   
  Prof. Xing Wu
Member
Professor, East China Normal University
   
  Prof. Wenhui Zhu
Member
Professor, Central South University
   
  Mr. John Rowland
Member
VP of Engineering,Spreadtrum
   
Dr. John Yuanlin Xie
Member
Altera Corp., San Jose, CA, USA
   
Dr. Roy Yu
Member
IBM, Watson Research Center, USA
   
Dr. Yishao Lai
Member
ASE. Taiwan, China
   
Dr. Jing Shi
Member
Oracle, USA
   
Dr. Young Do Kweon
Member
Samsung, Korea
   

Dr. Renzhe Zhao
Member
Huawei, China
   
Mr. Dan Tracy
Member
SEMI, USA
   
  Dr. Hong SHI
Member
Xilinx
   
Dr. Tim Bao
Member
Air Products and Chemicals, Inc
   
  Dr. Tim Chen
Member
Yantai Darbond Technology Co., Ltd.
   
Dr. Daniel Lu
Member
Henkel
   


Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
Dr. Qinghuang Lin
Chairman
IBM, USA
   
Prof. Hyungjun Kim
Co-Chair
Yonsei University, South Korea
   
Dr. Hsiang-Lang Lung
Co-Chair
Macronix International Ltd., Hsinchu, Taiwan
   
Prof. Jingwei Bai
Member
Tsinghua University, China
   
Prof. Edward Y. Chang
Member
National Chiao Tung University, Taiwan, China
   
Dr. Kangguo Cheng
Member
IBM, USA
   
Prof. Jinn P. Chu
Member
National Taiwan University of Science and Technology, China
   
  Prof. Thomas Otto
Member
Acting Director of the Fraunhofer Institute for Electronic Nano Systems ENAS Chemnitz, Germany
   
Prof. Zheyao Wang
Member
Tsinghua University, China
   
  Prof. Daniele Lelmini
Member
Politecnico Di Milano, Italy
   
Prof. Wei Wang
Member
Peking University, China
   
Prof. Fuhua Yang
Member
Institute of Semiconductor, Chinese Academy of Sciences, China
   
Dr. Wang Yueh
Member
Intel, USA
   


Symposium IX: Design and Automation of Circuits and Systems
Prof. Yiyu Shi
Chair
Associate Professor, University of Notre Dame, USA
   
Prof. Wenjian Yu
Co-Chair
Associate Professor, Department of Computer Science and Technology, Tsinghua University, China
   
Prof. Chen Zhuo
Co-Chair
Professor, Zhejiang University, China
   
Prof. Yu-Guang Chen
Member
Associate Professor, Yuan-Ze University, Taiwan, China
   
Dr. Dong Chen
Member
IBM T.J. Watson Research Center, USA
   
Prof. Baoyong Chi
Member
Tsinghua University, China
   
Prof. Yinhe Han
Member
Professor, Chinese Academy of Science, China
   
  Dr. Guanming Huang
Member,
Synopsys Inc, USA
   
  Dr. Bing Li
Member
Technical University of Munich, Germany
   
Prof. Weikang Qian
Member
Assistant Professor, University of Michigan-Shanghai Jiao Tong University Joint Institute, China
   
Prof. Shaojun Wei
Member
Professor, Tsinghua University, China
   
Dr. Jinjun Xiong
Member,
IBM T.J. Watson Research Center, USA
   
Prof. Le Ye
Member
Peking University, China
   
  Prof. Xiaoyang Zeng
Member
Fudan University
   
  Prof. Pingqiang Zhou
Member
Shanghai Tech University
   


Contact Us

Kelly Zhang, SEMI China
Tel: 86.21.6027.8556
Fax: 86.21.6027.8511
Email:
 kzhang@semi.org
 
Stacy Zhang, SEMI China
Tel: 86.21.6027.8552
Fax: 86.21.6027.8511
Email:
 szhang@semi.org