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Prof. Mingliang Huang Dalian University of Technology, China |
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Dr. M.L. Huang received his Ph.D. degree from Dalian University of Technology in 2001. From 1998 to 2000, he worked at Electronic Packaging Center, City University of Hong Kong, as a Research Associate. From 2003-2004, he worked at Center for Electronic Packaging Materials, Korea Advanced Institute of Science and Technology, as a Research Fellow. From 2004 to 2006, he worked at Fraunhofer IZM, Germany, as a Humboldt Research Fellow. Since 2006, he has been a professor, and also the director of Electronic Packaging Materials Lab at Dalian University of Technology. Now his research work is focused on interfacial reaction, electromigration, and reliability of fine-pitch lead-free solder interconnects, as well as co-deposition of eutectic Au-Sn alloys for LED packaging. |
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