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Conference Plenary Speakers (2025)
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Heterogeneous Computing Solutions for Power-Performance Efficient On-Device AI
Dr. Giri Nallapati, Vice President of Technology, Qualcomm Inc., USA
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From the Nanometer Scale to Light Years
Dr. Edmundo A. Gutiérrez D., General Director, INAOE, Mexico
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Advancing Embodied AI via Model-Hardware Co-Design and Edge-Cloud Collaborative Systems
Dr. Tim Kwang-Ting Cheng, Vice-President for Research and Development, The Hong Kong University of Science and Technology, China
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Materials Engineering Innovations to Address Next-Gen Electronics Packaging Challenges
Mr. Terrance Lee, Corporate Vice President, GM, Applied Materials, USA
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Partial List of Confirmed Distinguished CSTIC 2025 Keynote & Invited Speakers
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Cryogenic CMOS: A New Era for Power-Saving Computing
Qing-Tai Zhao, Forschungszentrum Jülich
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RRAM
Zongwei Wang, Peking University
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The Intergration of SRAM-based Computing in Memory and DRAM-based Prcessing in Memory by 3D Stacking Techniques for AI Large Model Utilization
Hongjie Liu, Reexen Technology Co., Ltd.
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Neuromorphic X-perception
Hongwei Tan, Aalto University
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Bioinspired Nanoelectronics
Damien Querlioz, CNRS, Université Paris-Saclay
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TBD
Heng Wu, Peking University
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Novel Low-Dimensional Material-Based Hot Carrier Transistors
Chi Liu, Institute of Metal Research, Chinese Academy of Sciences
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Optoelectronic devices
Vincenzo Pecunia, Simon Fraser University, Canada
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Hafnium-based Ferroelectric Memory and its Neuromorphic Computing Application
Lin Chen, Fudan University
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Ferroelectric Materials, Devices, and Chip Technologies for Enhanced Computational and Storage Capabilities
Genquan Han, Xidian University
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Heterogeneous 3D CFET with Hybrid Channel Configuration
SangHyeon Kim, KAIST
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Low-Frequency Noise of Vertical Gate-All-Around IGZO FETs
Ying Wu, Huawei Technologies
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Defects Characterization and Their Impact on the Stability of Oxide Semiconductor Devices and 2T0C DRAM Cell
Mengwei Si, Shanghai Jiao Tong University
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TBD
Mike Rigeer , TBD
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TBD
Leo Pang, D2S
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EUV CAR-NTD for Chemical Stochastic Reduction
TORU FUJIMORI, FUJIFILM Corporation
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TBD
Ken Wu, Fudan University
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TBD
Shiyuan Liu, Huazhong University
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TBD
Guangyuan Zhao, Hongkong Chinese University
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Methodology on Adaptive Iterative Step in Inverse Lithography
Fei Ai,University of Chinese Academy of Sciences
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The evolving laser mask writer, a cornerstone for the semicon industry
Robert Eklund, Mycronic AB
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It Is about Time to Rethink and Reteach Diffraction
David H. Wei, Quantica Computing, LLC
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The integration and process challenges and solutions for advanced technology nodes
David Xiao
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Challenges and latest developments on photo resisters for advanced logic and memory technology nodes
Allen Chang, JSR Taiwan
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Pulsing Plasma Application for Advanced Dry Etch Process
Zhongwei Jiang, Beijing NAURA Technology Group Co., Ltd.
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Patterning challenges and perspectives solutions in advanced DRAM technology nodes
Hongbo Sun, Beijing Chaoxian Memory Research Institute
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The pattern solutions for GAAFET
Min Xu, Fudan University
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Mechanism and Effect of 4-Level RF Pulsing on Etching Process in Advanced Node
Yang Ding, Advanced Micro-Fabrication Equipment Company Inc.
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Latest new results and developments of TSV for advanced 3DIC applications
Chao Lv, Beijing NAURA Technology Group Co., Ltd.
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Ion Beam Etching as a Patterning Solution for Memory Applications
Yuxin Yang, Jiangsu Leuven Instruments Co., Ltd.
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Effects of ALE Capabilities and DC Pulsing in Microwave ECR Plasma on Etching Processes for Cutting-Edge Logic LSI
Masaru Izawa, Hitachi High-Tech Corporation
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Enabling Material and Process Technology Capabilities for Emerging Memory Innovation in the AI Era
Jerry Chen, Zhejiang Jingsheng M&E Co., Ltd.
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Basic Principle and Recent Tango of Reactive Sputter Process
Qintong Zhang, Beijing NAURA Technology Group Co., Ltd.
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TBD
Yukihiro Shimogaki, Tokyo University
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A structural perspective of ALD precursors' physical and chemical properties
Xiabing Lou, Suzhou Origin Materials Technology Co,. Ltd.
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Progress and outlook in GaN devices and its system implementation
Hongyu Yu, Southen University of Science & Technology
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PVD related
Xinfeng Zhang, Semiconshop
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Diamond based heterjunction devices: the future of diamond electronics
Haitao Ye, University of Leicester, UK
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Synthesis and optical properties of two-dimensional materials and their applications in optoelectronics
Chunxiao Cong, Fudan University
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Process solution for multiple Vt engineering beyond 3nm technology node
Xiaona Zhu, Fudan University
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Implant Applications and Products to Enable Advanced Power Device Scaling and Revolution
David(Wei) Zou, Applied Materials
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Inline Non-contacting Measurement of Effective Work Function
Zheng Zou, GHS Semiconductor Co. Ltd.
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Material and Process Advances in Extending BEOL Cu Metallization and Beyond
George Wu, GHS Semiconductor Co. Ltd.
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Innovative Pathways: Exploring New Frontiers with Established Chip Manufacturing Techniques
Yunlong Li, Zhejiang University
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Interconnect Technology Evolution to Enhance Device Performance
Hongxiu(Libbert) Peng, Anji Microelectronics Technology (Shanghai) Co. Ltd
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The Challenges And Solutions of Damascus Copper Process
Zhaoqin Zeng, Shanghai Huali Integrated Circuit Corporation
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TBD
Di Geng, IMECAS
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Grinding and Chemical Mechanical Polishing Applications in Advanced Packaging
Xinchun Lu, Hwatsing Technology Co.,Ltd
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Post Metal CMP Cleaning Technology Processes and Materials
Guanghong Luo, Yantai Xianhua Polymer Materials Ltd.
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TBD
Zhiyong Xie, Beijing NAURA Technology Group Co., Ltd.
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TBD
Shu Yang, ACM
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Application of ultra-low SG hard pad in CMP
Yijie Luo, HUBEI DINGLONG CO.LTD.
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Improvement of W CMP Erosion Defect and Planarization Performance
Yu Yao, Semiconductor Technology Innovation Center (Beijing) Corporation, Beijing, China
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Retaining Ring Waer Study with Ceria Slurry for Chemical Mechanical Planarization
Jialiang Hua, Anji Microelectronics Technology (Shanghai) Co., Ltd.
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Retaining Ring Waer Study with Ceria Slurry for Chemical Mechanical Planarization
Shoutian Li, Eastern Institute for Advanced Study (EIAS), China
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Analysis of thermal effects in chemical mechanical planarization (CMP)
Taesung Kim, Sungkyunkwan University
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FPGA-based Test Platform for 56-Gbps NRZ Digital ICs and Systems
Dave Keezer, Eastern Institute for Advanced Study (EIAS), China
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High-throughput Metrology Solution Driven by Advanced AI
Jiang Xinheng, Hitachi High-Tech
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TBD
Gang Qu, University of Maryland
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Trends and Inflections in wafer metrology and inspection
Siqun Xiao，Applied Materials China
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Wearable ultrasound technology for deep-tissue monitoring
Hongjie Hu, Peking University
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Advancing material innovations to seamlessly integrate flexible sensors with rigid chips
Yuqing Zheng, Peking University
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Nanoelectromechanical Switches for Energy-Efficient Logic
Jinchi Han, Peking University
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Integration of 2D semiconductor based transistors for advanced logic nodes
Yuanyuan Shi, University of Science and Technology of China
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Smart Micro-Electromechanical and Nano-Photonic Devices Enabled by a Phase Transition
Kaichen Dong, Tsinghua Shenzhen International Graduate School, Tsinghua University
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Neuromorphic vision sensor
Shi-Jun Liang, Nanjing University
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2D semiconductors and devices
Yeesin Ang, Singapore University of Technology Design
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Energy Intelligent Computing Devices Based on 2D Materials
Heejun Yang, Korea Advanced Institute of Science and Technology
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Neuromorphic computing
Suting Han, Hong Kong Polytechnic
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3D micro-/nano-fabrication for high performance nanophotonics and sensors
Faheng Zang, Shanghai Jiao Tong University
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Hybrid Laser Manufacturing of Flexible and Conformal Electronics
Kaichen Xu, Zhejiang University
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Metal Oxide Based Heterostructured Nanomaterials Prepared by ALD for Effective Gas Sensors
Hong-Liang LU, Fudan University
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Integrated Fabrication and Applications of MEMS Devices on Ultra-thin Cylindrical Substrate
Zhuoqing Yang, Shanghai Jiao Tong University
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Chip tech for life science and medicine
Chang Chen, Shanghai Jiao Tong University
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VC-MTJ Applications
Albert Lee, Inston Tech.
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Embedded MRAM and Support Circuitry Design Considerations
Hao Cai, Southeast University, China
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IC and MEMS application in gas sensors
Anbo Guo, Semeatech Technology Co., Ltd. and Promisense Electronic Co., Ltd.
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Multi-dimensional mateirals integration for smart sensor chips
Chen Wang, Tsinghua University
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Highly Reliable RRAM Technology Development for Advanced Tech Node
Xiangchao Ma, Beijing InnoMem Technologies Co., Ltd
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Sensing and reliability design in commercial airspace industry
Zhikang Lan, Nanjing Gova Technology Co.,Ltd
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How 3D-IC speed-up High Memory Bandwidth AI Chip
Miao Liu, Cadence (Shanghai)
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AI Empowered Radio-Frequency Power Amplifier Design and Modelling
Jianguo Ma, Zhejiang University, Zhongyuan University of Technology
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TBD
Rongjian Liang, NVIDIA, USA
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TBD
Yang Chai, Hong Kong Polytechnic University
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Open Source Chip: Achievement and Challenges
Yungang Bao, Chinese Academy of Science, Institute of Computing Technology
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LLM Enhancement for Secure RTL Generation
Yier Jin, University of Science and Technology of China
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The Multi-physics Simulation and Optimization for AI Hardware Systems
Wenliang Dai, Xpeedic
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Machine Learning for the Design of MEMS Devices
Michael Kraft, University of Leuveny
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Reliability-Aware DTCO: A Key Strategy for Post-Moore Semiconductor Scaling
Zhigang Ji, Shanghai Jiao Tong University
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Thin film transistor for temporal self-adaptive reservoir computing with closed-loop architecture
Peng Huang, Peking University
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FabGPT for Smart IC Manufacturing: Overcoming Challenges in Data, Multimodality, and Deployment
Qi Sun, Zhejiang University
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Innovative Deep Learning Algorithm for Improving Defect Inspection Performance of E-Beam Inspection Equipment
Chunying Han, Dongfang Jingyuan Electron Co., Ltd.
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Pioneering Decision Systems in Semiconductor Manufacturing: Harnessing Mixture- of - Agents Networks with Multi-Modal LLMs to Integrate Engineering Expertise
Andrew Guan, Shenzhen FutureFab.AI Software Inc.
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TBD
Xinjun Wang, Peking University
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TBD
Hao Geng, Shanghai Tech University
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Accelerating Power Signoff for 3DIC Design
Zhuo Xie, Hangzhou Xinspector Electronic Technology Co., Ltd.
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