|
Dr. Yuchun Wang Anji Microelectronics, China |
|
Dr. Yuchun Wang obtained his PhD degree from University of California at Berkeley in materials science and engineering in 1998. Yuchun is currently vice president of research and development at Anji Microelectronics (Shanghai) focusing on CMP slurries and photo resist cleaning products. His prior jobs include various management and technical positions in Applied Materials and Cabot Microelectronics in the US. Yuchun has successful track record in leading new product development and world wide penetration in CMP equipment, process, and slurries in wafer front end(HKMG), back end (Cu and barrier), and advanced packaging (TSV) applications. He holds over 35 US patents and has published numerous technical papers mainly in the field of CMP. He is the author of a book chapter of Chemical Mechanical Polishing for TSV Applications in “3D IC stacking Technology” by McGraw-Hill in 2011. Yuchun has served the CMP community in California and continued this active role in China. He has helped organizing China Semiconductor Technology International Conference (CSTIC) CMP seminars and electronics materials activities since 2011. In addition to CMP, Yuchun has expertise and research interests in surface modification, membrane separation, and particle technology for MEMS and biomedical applications. |
|
