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Agenda / 议程
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09:00-09:30
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Registration 来宾登记
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09:30-09:40
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Moderator 主持人
Feng Ling, Founder and CEO, Xpeedic Co. Ltd
凌峰，芯和半导体科技（上海）股份有限公司，创始人及CEO
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09:40-10:00
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Welcome speech 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁，中国区总裁
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Keynote Session：Heterogeneous integration and Chiplet technology
主旨演讲：异构集成和Chiplet技术
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10:00-10:30
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Multi-Chiplet Heterogeneous Integration Packaging for AI and High Performance Computing
面向人工智能与高性能计算的多芯粒异构集成封装
Dr. Surya Bhattacharya, Director, System in Package (SiP) A*Star Institute of Microelectronics (IME)
Dr. Surya Bhattacharya，新加坡科技研究局微电子研究院，系统封装部主任
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10:30-11:00
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Heterogeneous Integration technology and Package solution
异构整合技术与封装解决方案
Scott Chen, Sr. VP of Central Developing Engineering, ASE Group, ChungLi
陈光雄，日月光中坜厂，工程发展中心资深副总
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11:00-11:30
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Development of Advanced Packaging and Heterogeneous Integration
先进封装和异构集成的发展
Li Yao, Head of Packaging Design Engineering Department, Unisoc
姚力，封装设计工程部部长，紫光展锐
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11:30-12:00
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UCIe 2.0 : Innovation for an Open Chiplet Ecosystem
UCIe 2.0: 推动开放芯粒生态创新
Jian Chen, Chief Architect of Cloud Server Infrastructure, Senior Director of Engineering, Alibaba Cloud
陈健，阿里云智能首席云服务器架构师，高级工程总监
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13:30-13:40
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Moderator 主持人
Jerry Wu, General Manager, Assembly & Test Business Group, China Resources Microelectronics Limited
吴建忠，华润微电子有限公司，封测事业群总经理
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Session 1：Challenges and Solutions in processes
专题1：工艺的挑战及解决方案
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13:40-14:00
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Advanced Packaging Equipment: Enabling the Future of Heterogeneous Integration
芯之所向，器之所成：先进封装设备赋能异构集成新生态
Lin Jiang, Vice President of Marketing and General Manager of Advanced Packaging Industry, Beijing NAURA Microelectronics Equipment Co., Ltd.
姜琳，北京北方华创微电子装备有限公司，营销副总裁，先进封装行业总经理
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14:00-14:20
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Enable endless possibilities of Heterogenous Integration by exploring PLP (Panel Level Packaging)
探索 PLP（面板级封装）实现异构集成的无限可能
Frank Su, Sr. Director, Business Development, Panel product line WETS, Lam Research
苏泳桦，泛林集团，全球湿法制程面板产品线业务开发资深总监
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14:20-14:40
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Precision × Efficiency × Reliability: Empowering semiconduct R&D and Failure Analysis with Electron Microscopy
精度×效率×可靠性——电子显微镜在半导体研发与失效分析中的应用
Erwan Sourty, Global Application Director, Thermo Fisher Scientific
Erwan Sourty，赛默飞世尔科技，全球应用总监
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14:40-15:00
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PVD Systems Applied to 3D Packaging
应用于三维封装的PVD系统
Dr. Xiaojun Zhang, Chairman and founding partner, Arrayed Materials
张晓军，深圳市矩阵多元科技有限公司，董事长、创始合伙人
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15:00-15:20
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Global Semiconductor and Packaging Market Trend
全球半导体市场与封装趋势
Dr. Shiuh-Kao Chiang, MANAGING PARTNE, Prismark LCC
姜旭高，Prismark合伙人
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Session 2：Ecosystem adapts to AI development
专题2：AI发展下的产业生态
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15:20-15:40
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Multi-physics Co-simulation Accelerates AI Hardware System Design
多物理场协同仿真加速AI硬件集成系统设计
Wenliang Dai, Founder&CEO, Xpeedic Co. Ltd
代文亮，芯和半导体科技（上海）股份有限公司，创始人&总裁
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15:40-16:00
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Advanced Packaging for Future Computing Systems
面向未来计算系统的先进封装
Dr. Terry Wu, Deputy General Manager, Payton Technology
吴政达，沛顿科技，副总经理
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16:00-16:20
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Advanced Bonding Integration Technology in Semiconductors: Application Breakthroughs and Industrial Upgrades Driven by Innovation
半导体先进键合集成技术：创新驱动下的应用突破与产业升级
Fengwen Mu, Chairman& CEO, iSABers Group Co., Ltd.
母凤文，青禾晶元半导体科技(集团)有限责任公司，董事长兼总经理
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16:20-16:40
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Solutions for wafer edge problems——Bevel Polish
晶圆边缘问题的解决方案—Bevel Polish
Dr. Guo Lei, VP of Product, Hwatsing Technology Co., Ltd.
郭垒，华海清科股份有限公司，产品副总
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16:40-17:00
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Markets and Applications for Chiplets: Enabling High Performance Packaging
Chiplet的市场与应用：赋能高性能封装
E. Jan Vardaman, President of TechSearch International, Inc.
E. Jan Vardaman, TechSearch International, Inc. 总裁
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17:00-17:10
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Closing remark
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* 议程以最终版为准
* Please refer to the final version of Agenda.
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