Advanced IC Manufacturing Forum
| Date: | Sunday, June 28, 2020 |
| Time: | 09:20 – 11:50 |
| Venue: | Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai |
Attendee Registration Previous Review
It has been 61 years since the invention of integrated circuits. Driven by Moore's law, the width shrinks every year and the performance keeps improving, the high-end market is occupied by 7nm, 10nm, 14/16nm, 5nm will be mass production in TSMC soon, Intel's 7nm process going well and 5nm is under develop. Finfets have been invented for years, can new technologies like the negative capacitance field effect transistor (NCFET) continue to drive the industry? In this forum, we will invite TSMC, EDA, Researching institution, analisys institution, domestic and foreign equipment manufacturers to discuss together.SPONSORS
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| 09:20 – 11:50 |
Moderator / 主持人 Richard Jiang, VP, PNCS 蒋庭明，副总裁，至纯科技 |
09:20 – 09:45
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3D Characterization and Analysis Workflows: Accelerating Insights, TtD & TtM Kong Tjien Lim, Director, Semiconductor, Thermo Fisher Scientific 林光健，赛默飞世尔科技，半导体事业部中国区业务总监 |
09:45 – 10:10
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A New Era of Supply Chain Collaboration: Driving Socially Responsible Semiconductor Jeff Cheng, Head of TSMC Nanjing Quality & Reliability organization 郑吉峰，台积电（南京）有限公司品质暨可靠性组织负责人 |
10:10 – 10:35
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Opportunity of China's 300mm Wafer Supply 中国制造300毫米大硅片的机遇 Dr. Wei Li, Chairman, Zing Semiconductor Corporation 李炜 博士，上海新昇半导体科技有限公司董事长 |
10:35 – 11:00
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Accurate etch modeling with high-volume metrology and deep-learning technology Wei Yuan 袁伟 |
11:00 – 11:25
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THE BRIDGE of Fab & Fabless Actel Niu，Mentor, A Siemens Business，Account Technical Manager 牛风举，明导电子，资深技术经理 |
11:25 – 11:50
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Materials for Emerging Device Applications Jiaqi Tian, Market Analyst, TECHCET LLC 田嘉齐，市场分析师，TECHCET LLC |