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March 20-22, 2019
Shanghai New International Expo Centre

Advanced Manufacturing Forum

Advanced Manufacturing Forum

Date: Thursday, March 21, 2019
Venue: Kerry Hotel Pudong, Shanghai

Attendee Registration   Previous Review

Catalyzed by the market outlook, policy and the national fund, heat on Semiconductor industry continuously accumulate. There are many 12inch Fabs planned for the next 5 years, OSAT is expending accordingly. It is easy to build factory but difficult to make it strong and profitable. How the China Semiconductor manufacturing industry is going to enhance the core competency? How to prioritize resource, re-visit the business model, and cooperate within the ecosystem?

The high-end market is occupied by 7nm, 10nm, 14/16nm, however, 28/40nm provide most revenue to TSMC. Meanwhile, UMC and GF has abandoned the 14nm and above process development. So for Fabless, FAB, Equipment and material companies, how to make balance between the cost and performance to countinue their owner advance manufacturing development.

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Agenda / 议程
   
Moderator  
   
09:30-12:05 Advanced Technology 先进制造
   
09:30-09:35 Welcome speech 欢迎致辞
   
09:35-10:00
Peijun Ding 丁培军
President, NAURA
北方华创,总裁
   
10:00-10:25 Haibo Lei 雷海波
President, HLMC
上海华力微电子,总裁
   
10:25-10:50
Dr. David Haynes
CSBG Strategic Marketing, Lam research
   
10:50-11:15
Jim Ma 马进武
Director, Qualcomm
美国高通公司,总监
   
11:15-11:40 TEL
   
11:40-12:05 Closing Keynote
Weiran Kong 孔蔚然
HHGrace, EVP
华虹宏力,执行副总裁
   
* Agenda and guests may be updated without notice.
* 议程变化恕不另行通知

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Mortal Li
Tel: 86-21-60278569
Email: mli@semi.org