New Technology Release Conference
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Date:
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Wednesday, March 17, 2021
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Time:
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10:00-16:05
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Venue:
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New Tech Stage, Hall E7, Shanghai New International Expo Centre
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Attendee Registration Previous Review
Regarding the global semiconductor industry trend in 2021, SMEI predicts that global semiconductors will continue to grow in 2021. The global semiconductor manufacturing equipment market will reach 71.9 billion U.S. dollars in 2021 and will reach 76.1 billion U.S. dollars in 2022. In the era of globalization, the supply chain needs strong support from all countries. With the slowdown of Moore's Law, domestic equipment companies are catching up sharply, and packaging and testing are blooming. Foreign companies have also launched highly competitive products. On March 17, the SEMICON New Technology Release Conference will show the latest products and technologies.
SPONSORS
合作媒体
Agenda / 议程
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09:55-10:00
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Registration 来宾登记
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session1
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10:00-12:10
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Moderator / 主持人
Qiang Yu 俞强
爱发科真空技术（苏州）有限公司，董事&总经理
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10:00-10:25
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Addressing Technology Challenges Through Supercritical Drying Technology
超临界技术因应技术挑战
Richard Qian 钱立群
东电电子（上海）有限公司，战略市场总监
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10:25-10:50
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From Semiconductor Material to Equipment, FerroTec & CCMC Brand New One-stop Solution
从半导体材料到设备的一站式解决方案—FerroTec集团暨中欣晶圆新品介绍
Jianyue Guo 郭建岳
GM, Ferro Tec
杭州中欣晶圆半导体股份有限公司, 总经理
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10:50-11:15
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Apply RPA (Robotic Process Automation) in Semiconductor Smart Manufacturing
运用RPA协同迈向半导体厂内无人化
Andong Li 李安东
Founder & GM, AI Empowerment Tech. Inc.
昆山润石智能科技，创始人&总经理
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11:15-11:40
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Application of 3D measurement laser microscope in semiconductor / electronic component industry
3D测量激光显微镜在半导体/电子元件行业的应用
Jian Deng 邓健
Product specialist，Olympus (Beijing) sales Service Co., Ltd
奥林巴斯（北京）销售服务有限公司，产品专家
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11:40-12:05
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Evatec Deposition Solution on 3rd Generation Semiconductor SiC-based device
Evatec基于第三代半导体SiC的镀膜解决方案
Yuan Lu 陆原
Technical Marketing Manager, Evatec China Ltd.
意发薄膜科技（上海）有限公司，技术市场经理
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12:05-12:10
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Lucky Draw, Sponsored by Olympus
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12:10-13:30
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Break 休息（午餐自理）
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session2
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13:30-16:05
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Moderator / 主持人
Fei Li 李飞
星平电子国际有限公司，创始人
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13:30-13:55
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Development of New Low Dk/Df Material for 5G application
5G应用的新型低Dk/Df材料
Zhen Han 韩政
Project manager, Electronic Materials Division , JSR (Shanghai) CO., Ltd
捷时雅（上海）商贸有限公司, 电子材料事业部，项目经理
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13:55-14:20
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Package Challenges on SiP & FHEC Solutions
SiP封装集成技术趋势&甬矽解决方案
Yupeng Xu 徐玉鹏
CTO, Forehope Electronic (Ningbo) Co., Ltd
甬矽电子(宁波)股份有限公司，副总经理
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14:20-14:45
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Applications for Equipment Automation with IoT Technology in Semiconductor
物联网技术在半导体设备自动化中的应用
Ada Zhang 张影
Automation Division GM, SEMI-TECH
苏州赛美特科技有限公司, 自动化事业部 总经理
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14:45-15:10
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康耐视深度学习赋能半导体制造
Jane Wang 王洁
Application manager, Cognex China
康耐视中国区，应用技术总监
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15:10-15:35
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Applications of abrasive process machine in semiconductor
全磨料加工机在半导体中的应用
Qi Wu 吴琦
Deputy General Manager of China Region, Nippon Pulse Motor Trading(Taiwan)Co., Ltd.
台灣日脈貿易股份有限公司，中国区域副总经理
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15:35-16:00
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SEMI S30标准中, 解决工艺排气管道爆炸性危险的方法
Ma Zhen 马震
Application Director ,Edwards China
埃地沃兹贸易（上海）有限公司，应用技术总监
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16:00-16:05
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Lucky Draw, Sponsored by Edwards
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* Agenda and guests may be updated without notice.
关于论坛更多信息及市场推广，烦请联络：
Caroline Zhu
Tel: 86-21-60278556
Email: [email protected]
