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June 27-29, 2020
Shanghai New International Expo Centre

New technology release conference

New technology release conference

Date: Saturday, June 27, 2020
Time: 10:30-16:00
Venue: New Tech Stage, Hall E7, Shanghai New International Expo Centre

Attendee Registration   Previous Review

As the world's fastest-growing and most dynamic microelectronics market, SEMICON China attracts more than 1,100 exhibitors including major equipment and materials companies, packaging and testing companies. It also gathers technology elites and business leaders from all over the world to discuss hot spots and trends of industry and find partners.

Due to non-market factors such as memory market adjustments and trade wars, the entire industry lacks sustainable momentum and experiences a slight recession. On the other hand, emerging industry has found new paths for enterprise development, such as 5G+AI, IoT, New Energy, etc. Domestic and foreign manufacturers are unanimously making conservative investments and accelerating technological innovation.

“New Technology Release Conference” provides exhibitors with the latest product launch platform, extending from the forum to the booth, from online to offline, from the first release to the introduction of market. So, it is a highlight of SEMICON China.

The key to development of integrated circuit industry lies in innovation, talents, technology, capital and market. Leading technology is the key to business success. In this forum that gathers world's first technology, you can deal with people from different countries, different cultural backgrounds, different modes of thinking and generate a new industry perspective. At the same time, “New Technology Release Conference” forum is seamlessly connected with media. In forum, speakers can get best opportunity form media to promote new products. Media can also get first-hand information of new products and push them in time. Excellent products will also attract capital.

Sponsors:  

Media Partners:  

Agenda / 议程
   
10:00-10:30 Registration 来宾登记
   
Theme: packaging and test technology
主题:封装测试技术
   
Moderator / 主持人
Michael Chen 陈少民
Managing Director, Hina Group
汉能投资董事总经理
   
10:30-10:45 面向物联网的SIP和MEMS Sensor 封装发展
Lei Zhong 钟磊
RD Engineering Director, Forehope Electronic (Ningbo) Co., Ltd
甬矽电子(宁波)股份有限公司,RD工程总监
   
10:45-11:00
High Speed Mixed Signal Automatic Test System
高速数模混合信号测试系统

GEORGE D' ARBELOFF
Vice Chairman, Shenzhen Hans Semi Equipment Technology Co., Ltd
深圳市大族半导体测试技术有限公司,副董事长
   
11:00-11:15
TBD
Jun Ma 马骏
General Manager, Shanghai Precision Measurement Semiconductor Technology, Inc
上海精测半导体技术有限公司,总经理
   
11:15-11:30 TBD
   
11:30-13:00 Break 休息(午餐自理)
   
Theme:wafer manufacturing and materials technology
主题:晶圆制造及材料技术
   
Moderator / 主持人
Richard Qian 钱立群
东电电子(上海)有限公司,战略市场总监
   
13:00-13:15 Mitsubishi Electric Automation (China) Ltd. ( to be confirmed )
   
13:15-13:30 PCC Machine Module Intelligent Production Solution
PCC机台模组智慧生产解决方案

Haijun Chen 陈海俊
Industry Manager for Smart Factory ,Guangzhou MediaComm Technology Co., Ltd.
广州美凯信息技术股份有限公司,智慧工厂行业经理
   
13:30-13:45 TBD
Pfeiffer Vacuum (Shanghai) Co., Ltd
普发真空技术(上海)有限公司
   
13:45-14:00 NAURA ( to be confirmed )
   
14:00-14:15 Lam ( to be confirmed )
   
14:15-14:30 TBD
   
* Agenda and guests may be updated without notice.
* 议程变化恕不另行通知

关于论坛更多信息及市场推广,烦请联络:
Caroline Zhu
Tel: 86-21-60278556
Email: czhu@semi.org