Heterogeneous Integration (Advanced Packaging) International Conference (HIIC)


Date: Tuesday, March 25, 2025
Time: 09:30-17:40
Venue: Pudong Ballroom 1, Kerry Hotel Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

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As the exponential growth of Generative AI and HPC applications, the transistor scaling is not enough to meet the demand for huge computing power, high transmission speed, memory capacity, and low power consumption for chips. This led to a technological shift toward system-level scaling approaches, such as heterogeneous integration. Heterogeneous Integration technology integrates Chiplet in 2D, 2.5D, 3DIC process, combine Hybrid bonding, TGV and HBM, integrated modules/subsystems or complete functional systems, provide fuel for the future of AI+.

♦ What’s the current situation of advanced packaging?
♦ What’s the challenges for Heterogeneous integration and Chiplet?
♦ What’s the most likely solutions?

HIIC 2025 invite global industry leaders and experts to share insights of above questions, attracts professional audiences from every segment of the semiconductor packaging industry.

KEY TOPICS:
♦ Heterogeneous Integration Roadmap (HIR)
♦ SiP, Chiplet for AI/HPC
♦ HBM, Hybrid bonding, TGV technologies
♦ Advanced packaging materials, equipment and ecosystem
♦ Technology and market trends

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Agenda / 议程
   
09:00-09:30 Registration 来宾登记
   
09:30-09:40
 Moderator 主持人
Feng Ling, Founder and CEO, Xpeedic Co. Ltd
凌峰，芯和半导体科技（上海）股份有限公司，创始人及CEO
   
09:40-10:00
 Welcome speech 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁，中国区总裁
   
     Keynote Session：Heterogeneous integration and Chiplet technology
     主旨演讲：异构集成和Chiplet技术
   
10:00-10:30
Multi-Chiplet Heterogeneous Integration Packaging for AI and High Performance Computing
面向人工智能与高性能计算的多芯粒异构集成封装
Dr. Surya Bhattacharya, Director, System in Package (SiP) A*Star Institute of Microelectronics (IME)
Dr. Surya Bhattacharya，新加坡科技研究局微电子研究院，系统封装部主任
   
10:30-11:00
Heterogeneous Integration technology and Package solution
异构整合技术与封装解决方案
Scott Chen, Sr. VP of Central Developing Engineering, ASE Group, ChungLi
陈光雄，日月光中坜厂，工程发展中心资深副总
   
11:00-11:30
Development of Advanced Packaging and Heterogeneous Integration
先进封装和异构集成的发展
Li Yao, Head of Packaging Design Engineering Department, Unisoc
姚力，封装设计工程部部长，紫光展锐
   
11:30-12:00
 UCIe 2.0 : Innovation for an Open Chiplet Ecosystem
UCIe 2.0: 推动开放芯粒生态创新
Jian Chen, Chief Architect of Cloud Server Infrastructure, Senior Director of Engineering, Alibaba Cloud
陈健，阿里云智能首席云服务器架构师，高级工程总监
   
13:30-13:40
Moderator 主持人
Jerry Wu, General Manager, Assembly & Test Business Group, China Resources Microelectronics Limited
吴建忠，华润微电子有限公司，封测事业群总经理
   
     Session 1：Challenges and Solutions in processes
     专题1：工艺的挑战及解决方案
   
13:40-14:00
Advanced Packaging Equipment: Enabling the Future of Heterogeneous Integration
芯之所向，器之所成：先进封装设备赋能异构集成新生态
Wanguo Guo, General Manager of Advanced Packaging Industry, Beijing NAURA Microelectronics Equipment Co., Ltd.
郭万国，北京北方华创微电子装备有限公司，先进封装行业总经理
   
14:00-14:20
Enable endless possibilities of Heterogenous Integration by exploring PLP (Panel Level Packaging)
探索 PLP（面板级封装）实现异构集成的无限可能
Frank Su, Sr. Director, Business Development, Panel product line WETS, Lam Research
苏泳桦，泛林集团，全球湿法制程面板产品线业务开发资深总监
   
14:20-14:40
Precision × Efficiency × Reliability: Empowering semiconduct R&D and Failure Analysis with Electron Microscopy
精度×效率×可靠性——电子显微镜在半导体研发与失效分析中的应用
Erwan Sourty, Global Application Director, Thermo Fisher Scientific
Erwan Sourty，赛默飞世尔科技，全球应用总监
   
14:40-15:00
PVD Systems Applied to 3D Packaging
应用于三维封装的PVD系统
Dr. Xiaojun Zhang, Chairman and founding partner, Arrayed Materials
张晓军，深圳市矩阵多元科技有限公司，董事长、创始合伙人
   
15:00-15:20
Global Semiconductor and Packaging Market Trend
全球半导体市场与封装趋势
Dr. Shiuh-Kao Chiang, MANAGING PARTNE, Prismark LCC
姜旭高，Prismark合伙人
   
     Session 2：Ecosystem adapts to AI development
     专题2：AI发展下的产业生态
   
15:20-15:40
Multi-physics Co-simulation Accelerates AI Hardware System Design
多物理场协同仿真加速AI硬件集成系统设计
Wenliang Dai, Founder&CEO, Xpeedic Co. Ltd
代文亮，芯和半导体科技（上海）股份有限公司，创始人&总裁
   
15:40-16:00
Advanced Packaging for Future Computing Systems
面向未来计算系统的先进封装
Dr. Terry Wu, Deputy General Manager, Payton Technology
吴政达，沛顿科技，副总经理
   
16:00-16:20
Advanced Bonding Integration Technology in Semiconductors: Application Breakthroughs and Industrial Upgrades Driven by Innovation
半导体先进键合集成技术：创新驱动下的应用突破与产业升级
Fengwen Mu, Chairman& CEO, iSABers Group Co., Ltd.
母凤文，青禾晶元半导体科技(集团)有限责任公司，董事长兼总经理
   
16:20-16:40
Solutions for wafer edge problems——Bevel Polish
晶圆边缘问题的解决方案—Bevel Polish
Dr. Guo Lei, VP of Product, Hwatsing Technology Co., Ltd.
郭垒，华海清科股份有限公司，产品副总
   
16:40-17:00
Markets and Applications for Chiplets: Enabling High Performance Packaging
Chiplet的市场与应用：赋能高性能封装
E. Jan Vardaman, President of TechSearch International, Inc.
E. Jan Vardaman, TechSearch International, Inc. 总裁
   
17:00-17:10 Closing remark
   
* 议程以最终版为准
* Please refer to the final version of Agenda.
   

CONTACT US:
Hannah zhao
021-60278571
hzhao@semi.org