Heterogeneous Integration (Advanced Packaging) International Conference (HIIC)
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Date:
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Tuesday, March 25, 2025
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Time:
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09:30-17:00
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Venue:
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Pudong Ballroom 1, Kerry Hotel Pudong, Shanghai
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Chinese and English Simultaneous Interpretation will be provided
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Attendee Registration Previous Review
As the exponential growth of Generative AI and HPC applications, the transistor scaling is not enough to meet the demand for huge computing power, high transmission speed, memory capacity, and low power consumption for chips. This led to a technological shift toward system-level scaling approaches, such as heterogeneous integration. Heterogeneous Integration technology integrates Chiplet in 2D, 2.5D, 3DIC process, combine Hybrid bonding, TGV and HBM, integrated modules/subsystems or complete functional systems, provide fuel for the future of AI+.
♦ What’s the current situation of advanced packaging?
♦ What’s the challenges for Heterogeneous integration and Chiplet?
♦ What’s the most likely solutions?
HIIC 2025 invite global industry leaders and experts to share insights of above questions, attracts professional audiences from every segment of the semiconductor packaging industry.
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Organizer:
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KEY TOPICS:
♦ Heterogeneous Integration Roadmap (HIR)
♦ SiP, Chiplet for AI/HPC
♦ HBM, Hybrid bonding, TGV technologies
♦ Advanced packaging materials, equipment and ecosystem
♦ Technology and market trends
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Agenda / 议程
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09:00-09:30
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Registration 来宾登记
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09:30-10:00
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Welcome speech 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁，中国区总裁
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Keynote Session：Heterogeneous integration and Chiplet technology
主旨演讲：异构集成和Chiplet技术
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10:00-10:25
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Multi-field and Cross-scale Co-design for Chiplet Integration and Packaging
集成芯片与封装多场跨尺度协同设计
Dr. Sheng Liu, Academician, Chinese Academy of Sciences
Executive Dean of the Industrial Science Research Institute, Dean of the School of Power and Machinery, and Vice Dean of the School of Microelectronics at Wuhan University
刘胜 中国科学院院士
武汉大学工业科学研究院执行院长，动力与机械学院院长，微电子学院副院长
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10:25-10:50
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CHOON HEUNG LEE, SVP, Intel
李春兴，英特尔高级副总裁（TBD）
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10:50-11:15
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ASE/SPIL
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11:15-11:40
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Reserved
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11:40-12:05
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UCIe 2.0 : Innovation for an Open Chiplet Ecosystem
UCIe 2.0: 推动开放芯粒生态创新
Jian Chen, Chief Architect of Cloud Server Infrastructure, Senior Director of Engineering, Alibaba Cloud
陈健，阿里云智能首席云服务器架构师，高级工程总监
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12:05-13:35
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Lunch break 午餐
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13:35-14:00
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Keynote ：Heterogeneous Integration Roadmap
主旨演讲：异构集成路线图
Dr. Surya Bhattacharya, Director, System in Package (SiP) A*Star Institute of Microelectronics (IME)
Dr. Surya Bhattacharya，新加坡科技研究局微电子研究院，系统封装部主任
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Session 1：Challenges and Solutions in processes and materials
专题1：工艺和材料的挑战及解决方案
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14:00-14:20
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通富微电
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14:20-14:40
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北方华创
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14:40-15:00
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Lam
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15:00-15:20
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Erwan Sourty, Global Application Director, Thermo Fisher Scientific
Erwan Sourty，赛默飞世尔科技，全球应用总监
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15:20-15:30
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Break
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Session 2：Ecosystem adapts to AI development
专题2：AI发展下的产业生态
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15:30-15:50
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Li Yao, Head of Packaging Design Engineering Department, Unisoc
姚力，封装设计工程部部长，紫光展锐
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15:50-16:10
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Advanced Packaging for Future Computing Systems
面向未来计算系统的先进封装
Dr. Terry Wu, Deputy General Manager, Payton Technology
吴政达，沛顿科技，副总经理
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16:10-16:30
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TBD
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16:30-16:50
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E. Jan Vardaman, President of TechSearch International, Inc.
E. Jan Vardaman, TechSearch International, Inc. 总裁
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16:50-17:00
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Closing remark
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* 议程以最终版为准
* Please refer to the final version of Agenda.
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CONTACT US:
Hannah zhao
021-60278571
hzhao@semi.org
