Advanced Material Conference(AMC)
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Date:
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Wednesday, March 26, 2025
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Time:
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09:30-12:20
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Venue:
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Pudong Ballroom 5, Kerry Hotel Pudong, Shanghai
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Simultaneous Interpretation will be provided.
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Attendee Registration Previous Review
The Advanced Material Conference-AMC is a valuable, productive blend of learning, and networking with global industry leaders, experts, and colleagues.
As the cornerstone of electronics and AI revolution, semiconductor material industry has gained a lot of investments and achieved rapid development in the past decade. The global semiconductor material market size is expected to reach $70 billion in 2024, mainland China is the second-largest semiconductor materials market in the world.
What's the development status for fab and packaging materials? How about the upstream supply chain? How to adapt to the uncertainties in the following years and seize the opportunity? Join us in this years' AMC to get insights on current developments and future industrial trends in advanced materials.
Key topics：
♦ Advanced semiconductor material
♦ Packaging material development
♦ Demands from AI and HBM
♦ Market and Economic Trends
Sponsors & Supports
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Agenda / 议程
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09:00-09:30
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Registration 来宾登记
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09:30-09:45
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Opening Remark 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁，中国区总裁
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09:45-10:10
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Keynote Speech 主题演讲
Gallium Nitride (GaN): Ushering in the Era of High-Efficiency Power Semiconductors
氮化镓：开启功率半导体的高效能时代
Dr. Jeffrey Wang, CEO, Advanced Micro Semiconductors Co., Ltd.
王庆宇，新微半导体CEO
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10:10-10:35
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Keynote Speech 主题演讲
Breakthrough in core technologies, build core competitiveness, Provide certainty for the global industrial chain
突破核心技术，打造核心竞争力，为全球产业链提供确定性
Dr. Lijun Yao, President and CTO, KFMI
姚力军，宁波江丰电子材料股份有限公司董事长兼首席技术官
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10:35-11:00
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Development status and trends of semiconductor gas materials
半导体气体材料发展现状及趋势
Zhuhong Fu, GM, Guangdong Huate Gas Co., Ltd.
傅铸红，广东华特气体股份有限公司总经理
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11:00-11:25
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Development Trends of Semiconductor Packaging Materials
半导体封装材料发展趋势
Dr. Tim Chen, CEO, Darbond Technology Co.,Ltd.
陈田安，烟台德邦科技总经理
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11:25-11:50
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Albert Chen, Advanced Technology Engagements Senior Director, Entegris
陈柏嘉，应特格资深先进技术应用处长
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11:50-12:15
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Market and Technology Trends of Semiconductor Process Materials
半导体工艺材料的市场与技术趋势
Michel Walden, Head of Market Research & Analytics, TECHCET LLC
Michel Walden, TECHCET LLC市场研究首席分析师
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12:15-12:20
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Closing remark 闭幕致辞
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* 议程以最终版为准
* Please refer to the final version of Agenda.
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Agenda / 议程
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|
|
|
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09:00-09:30
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Registration 来宾登记
|
|
|
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09:30-09:45
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Opening Remark 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁，中国区总裁
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|
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09:45-10:10
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Gallium Nitride (GaN): Ushering in the Era of High-Efficiency Power Semiconductors
氮化镓：开启功率半导体的高效能时代
Dr. Jeffrey Wang, CEO, Advanced Micro Semiconductors Co., Ltd.
王庆宇，新微半导体CEO
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10:10-10:35
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Breakthrough in core technologies, build core competitiveness, Provide certainty for the global industrial chain
突破核心技术，打造核心竞争力，为全球产业链提供确定性
Dr. Lijun Yao, President and CTO, KFMI
姚力军，宁波江丰电子材料股份有限公司董事长兼首席技术官
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10:35-11:00
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Development status and trends of semiconductor gas materials
半导体气体材料发展现状及趋势
Zhuhong Fu, GM, Guangdong Huate Gas Co., Ltd.
傅铸红，广东华特气体股份有限公司总经理
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11:00-11:25
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Development Trends of Semiconductor Packaging Materials
半导体封装材料发展趋势
Dr. Tim Chen, CEO, Darbond Technology Co.,Ltd.
陈田安，烟台德邦科技总经理
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11:25-11:50
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TBD
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11:50-12:15
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Market and Technology Trends of Semiconductor Process Materials
半导体工艺材料的市场与技术趋势
Michel Walden, Head of Market Research & Analytics, TECHCET LLC
Michel Walden, TECHCET LLC市场研究首席分析师
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12:15-12:20
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Closing remark 闭幕致辞
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* 议程以最终版为准
* Please refer to the final version of Agenda.
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CONTACT US:
Hannah zhao 021-60278571
hzhao@semi.org
