IC Manufacturing Supply Chain International Conference – Equipment and Process


Date: Thursday, March 27, 2025
Time: 09:00-12:00
Venue: Pudong Ballroom 5, Kerry Hotel Pudong, Shanghai
Simultaneous Interpretation will be provided.

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In the field of IC manufacturing, the performance of equipment and processes directly determine efficiency and product quality. This forum will showcase innovative manufacturing equipment technologies and explore how equipments bring revolutionary changes to IC manufacturing through optimized design, increased production efficiency, enhanced defect detection and routine maintenance, among other means. At the same time, the forum will also focus on how equipment can better adapt to process requirements to achieve higher production efficiency and product quality. With equipment and processes as its main content, this forum aims to promote the intelligent, efficient, and collaborative development of the IC manufacturing supply chain.

Furthermore, the forum will invite leading companies and experts from various segments of the IC manufacturing supply chain to share their latest research findings and practical experiences in the field of equipment and processes. These presentations will cover various aspects, ranging from component supply, equipment manufacturing, system upgrades, to process optimization, providing participants with a comprehensive understanding of the IC manufacturing supply chain.

As one of the largest semiconductor exhibitions globally, SEMICON China's IC manufacturing forum boasts a rich history and extensive influence. Over the years, the forum has attracted a diverse audience from FAB representatives, process and equipment experts, scientific research institution personnel, and investment experts from around the world. The "International Forum on IC Manufacturing Supply Chain - Focus on Equipment and Processes" in 2025 is expected to attract over 500 professional attendees to jointly discuss the future development of the IC manufacturing supply chain.

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Agenda / 议程
   
09:00-09:25 Registration 来宾登记
   
09:25-09:30
Welcome Remark / 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙,SEMI全球副总裁,中国区总裁
   
Moderator / 主持人:
秦宏志博士
中芯国际深圳厂前厂长,北京大学集成电路学院,广东省纳米研究院运营副总
   
09:30-09:50 Beijing NAURA Microelectronics Equipment Co., Ltd.
北京北方华创微电子装备有限公司
   
09:50-10:20 INTEL
   
10:20-10:40 Lam Research
泛林集团
   
10:40-11:00
以人工智能和先进光学优势打造高端装备 赋能集成电路制造良率管理
Build high-end equipment with artificial intelligence and advanced optics Empowering yield management of integrated circuit manufacturing

Li Bo 李博
VP of Strategy, MEGAROBO Technologies
战略副总裁,镁伽科技
   
11:00-11:20
Dr. Tian Wei 田伟 博士
Chief Expert of Plasma Simulation,Shenzhen SiCARRIER Industry Machines Co., Ltd.
等离子体仿真首席专家,深圳市新凯来工业机器有限公司
   
11:20-11:40
半导体方向性工艺的“矛” 与“盾”—— 离子束微纳加工技术综述
Ion Beam Processing Techniques of Semiconductor Manufacturing – A Directional Approach

Xu Kaidong 许开东 博士
Chairman&CEO, Jiangsu Leuven Instruments Co., Ltd
董事长兼CEO,江苏鲁汶仪器股份有限公司
   
11:40-12:00
热塑性塑料及管路应力分析(PSA)以及在先进FAB的最佳实践案例
Thermoplastic Piping and Pipe Stress Analysis (PSA) with Best Practice Cases in Advanced FABs

Wan Feng, Head of PM Piping Systems, GF Piping Systems
上海乔治费歇尔管路系统有限公司
   
* 议程以最终版为准
* Please refer to the final version of Agenda.