Design Innovation Forum: AI Intelligent Applications and Automotive IC's


Date: Thursday, March 27, 2025
Time: 15:30-17:30
Venue: Grand Shanghai Ballroom 3, Kerry Hotel Pudong, Shanghai
Simultaneous Interpretation will be provided.

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According to the China Association of Automobile Manufacturers, the sales volume of new energy vehicles reaches about 11.50 million, with a year-on-year growth of 20% and a penetration rate of 37.1%. With the advancement of electrification and intelligence in the automotive industry, the number of chips per new-energy vehicle or those equipped with driver-assistance features exceeds 1000. For vehicles with high-level autonomous driving capabilities, the demand for chips per vehicle is over 3,000. Automotive IC is undoubtedly one of the promising market in the coming decade that we can’t afford to miss.

Global heavyweights from automotive IC industry will be invited in this year’s Design Innovation Forum - Automotive IC to share insights in emerging technology, auto revolution trends, and explore the opportunities and reveal the challenges evolving with it

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Sponsors
         
     
         

Agenda / 议程
   
15:00-15:30 Registration 注册
   
15:30-15:35
Welcome Speech 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁，中国区总裁
   
15:35-15:50
Opening Remark 开幕致辞
Moderator / 主持人
Danny Perng, Senior Vice President PacRim, Siemens EDA
彭启煌，西门子EDA，全球资深副总裁、亚太区总裁
   
15:50-16:15
VIP Keynote Speech 主题演讲
About AI: 3 Predictions and 2 Traps
关于AI：3个预测和2个陷阱
Qing Chu, Chairman/CEO, NPC Tech
楚庆，智识神工董事长、首席执行官
   
16:15-16:40
Firmware, Hardware and Software, Positioning CPU
心件 硬软件 定位CPU
Rosemary W.Ho, Founder, Chairman & CEO, CIP United Co.
何薇玲，上海芯联芯智能科技有限公司创始人、董事长兼首席执行官
   
16:40-17:05
DevOpsForTest: embrace the chip quality for ADAS chips with automated flow and continuously integration
DevOpsForTest：利用自动化流程和持续集成提升车用芯片的质量
Fisher Zhang, General Manager, Complex SOC BU, Asia, Teradyne
张震宇，泰瑞达Complex SOC 事业部亚太区总经理
   
17:05-17:30
Boosting the Development of Large-Scale Digital Chip Design
合见工软助力数字大芯片设计发展
Sherry Xu, President, Shanghai UniVista lndustrial Software Group Co., Ltd.
徐昀，上海合见工业软件集团总经理
   
* 议程以最终版为准
* The agenda is subject to being updated.
   

CONTACT US:
Hannah Zhao 021-60278571 [email protected]