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CS Asia Conference - Opening Keynote / 亚洲化合物半导体大会 - 开幕主题演讲
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Day 1- Mar.25th, 2025 Shanghai Ballroom 3 / 上海厅 3
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13:15-13:30
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Welcome Remark / 欢迎致辞
Lung Chu 居龙
Vice President, SEMI; President, SEMI China
SEMI全球副总裁、中国区总裁
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Moderator / 主持人：
David Xiao, Board Chair of AscenPower
肖国伟，董事长，广东芯粤能半导体有限公司
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13:30-14:00
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Compound Semiconductor - Age of Maturity
*化合物半导体-成熟"芯"时代
Dr. Felix J. Grawert
Chairman of the Executive Board, CEO & President, AIXTRON SE
执行董事会主席、首席执行官兼总裁，德国爱思强公司
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14:00-14:30
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Next Generation Power Semiconductors (SiC and GaN) Enabling A World of Decarbonization and Digitalization
*下一代功率半导体（SiC 和 GaN），实现脱碳和数字化世界
SCHOISWOHL Johannes
Senior Vice President and General Manager, Infineon Technologies Austria AG
高级副总裁兼总经理，英飞凌技术奥地利股份公司
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14:30-15:00
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Innovation in Ion Implanation for Power and Compound Semiconductor Devices
*功率及化合物半导体器件中的离子注入技术革新
Russell Low
President & CEO, Axcelis Technologies
总裁兼首席执行官，亚舍立科技
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15:00-15:30
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MicroLED Display Technology Mass Production Strategy
MicroLED 前瞻顯示技術量產策略
Dr. Yun-Li (Charles) LI 李允立
Chairman, PlayNitride Inc.
董事长，錼創科技
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15:30-16:00
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Next Generation GaN Platform for High-Density DC-DC Converters
*用于高密度 DC-DC 转换的下一代 GaN 平台
Jianjun (Joe) CAO 曹建军
Co-founder, Efficient Power Conversion (EPC) Corporation
联合创始人，宜普电源
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16:00-16:30
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200mm SiC Substrate Development and 300mm SiC Opportunities & Challenges
200mm SiC衬底进展和300mm SiC衬底的机遇与挑战
Chao GAO 高超
CTO, SICC CO., LTD.
首席技术官，山东天岳
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Session 1: Ultra-wide Bandgap Semiconductors Materials / 分会1：超宽禁带半导体材料
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Day 2- Mar.26th, 2025 Shanghai Ballroom 3 / 上海厅 3
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Moderator / 主持人：
Yi PEI, VP of Technology, Dynax Semiconductor
裴轶，技术副总裁，苏州能讯高能半导体有限公司
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09:15-09:45
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Recent Progress and Device Prospects on Bulk AlN Crystals Grown by PVT Method
*PVT方法生长的氮化铝单晶最新进展及器件展望
Liang WU 吴亮
CEO, Ultratrend Technologies
首席执行官，奥趋光电
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09:45-10:15
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Advanced CVD Diamond Solutions for Next-generation Semiconductor Device Performance
*用于下一代半导体器件的先进CVD金刚石解决方案
Ian Friel
Chief Scientist, Element Six
首席科学家，元素六
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10:15-10:40
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The Current Industrial Situation and Prospects of The Development of The 4th Generation Semiconductor Ga2O3
第四代半导体氧化镓的产业发展现状与前景
Zhengwei CHEN 陈政委
CEO, Beijing MIG Semiconductor Co., Ltd.
首席执行官，北京铭镓半导体有限公司
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10:40-11:05
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Progress of Ultra-Wideband Diamond Semiconductor Material and Devices Research
超宽禁带金刚石半导体材料和器件研究进展
Xing ZHANG 张星
CEO, Compound Semiconductor (Xiamen) Technology Co., Ltd.
首席执行官，化合积电（厦门）半导体科技有限公司
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11:05-11:30
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Research Progress on Precision Polishing of Diamond Materials
金刚石材料精密抛光技术的研究进展
Jile JIANG 蒋继乐
VP, Beijing TSD Semiconductor Co.,Ltd.
副总裁，北京特思迪半导体设备有限公司
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Session 2: Innovative Technologies for Compound Semiconductors / 分会2：化合物半导体的革新技术
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Day 2- Mar.26th, 2025 Shanghai Ballroom 3 / 上海厅 3
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Moderator / 主持人：
Dr. Wang Ronghua, Vice President of Technology, Runxin Microelectronics
王荣华，技术副总经理，润新微电子（大连）有限公司
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13:00-13:30
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Overview of Compound Semiconductors and The Outlook for Innovation in WBG and UWBG Technologies
*化合物半导体概述及宽禁带和超宽禁带技术的创新展望
Poshun CHIU
Senior Analyst, Yole Group
高级分析师，Yole集团
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13:30-14:00
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Progress of Large-scale and High-quality Gallium Oxide Single Crystal Semiconductor Materials
大尺寸高质量第四代半导体氧化镓单晶衬底材料新进展
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Jiwei JIANG 江继伟
Co-Founder, Hangzhou Garen Semiconductor Co., Ltd
联合创始人，杭州镓仁半导体有限公司
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14:00-14:25
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Promoting The Thriving Development of The Third-generation Semiconductor Industry through Equipment Innovation
同芯共赢 以装备创新推动第三代半导体产业蓬勃发展
Shiqun LI 李仕群
GM of Compound Semiconductor Industry, Beijing NAURA Microelectronics Equipment Co., Ltd.
化合物半导体行业总经理，北京北方华创微电子装备有限公司
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14:25-14:50
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Compound Semiconductor XRF Mesurement Technology & Equipment
化合物半导体XRF测量技术与设备
Jie REN 任杰
General Manager, Chief Executive Officer, Gazer Semiconductor Tech Co., Ltd.
总经理兼首席执行官，盖泽半导体
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14:50-15:15
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Novel Techniques for Production Molecular Beam Epitaxy
*分子束外延制造新技术
Matthew Marek
Sr. Director of Product Line Management, Veeco Instruments Inc.
产品线管理高级总监，维易科精密仪器公司
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15:15-15:40
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Precise Strain-engineering of 300 mm GaN-on-Si Micro LED Epiwafer to Open The Path to Silicon Industry Fabs
*300 mm 硅基氮化镓 Micro LED 外延片的精确应变工程，打开通向硅晶圆制造之路
Nishikawa Atsushi
CTO, ALLOS SEMICONDUCTOR
首席技术官，日本ALLOS半导体
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15:40-16:05
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CMP Solutions for High Quality SiC Substrate and Device Fabrication
*用于高质量SiC衬底和器件制造的化学机械抛光（CMP）解决方案
Hongming PAN 潘宏明
CMP Technology Application and Development Manager, GEGV Technology Co., Ltd.
CMP技术应用与开发经理，北京晶亦精微科技股份有限公司
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16:05-16:30
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Production Processing of 300mm BTO Films on Silicon, For Photonic Applications
*用于光子应用的300mm硅基BTO薄膜的生产工艺
Dr. Martyn Green
Director of Sales – Asia, DCA Instruments Oy
亚洲区销售总监，迪希埃精密仪器公司
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Session 3: III-V Compound Semiconductors / 分会3：III-V 化合物半导体
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Day 3- Mar.27th, 2025 Pudong Ballroom 1 / 浦东厅 1
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Moderator / 主持人：
Jiangbo WANG, CTO, BOE HC SEMITEK CORPORATION
王江波，首席技术官，京东方华灿光电股份有限公司
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09:15-09:45
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Journey through The Frequency Domain-Compound Semiconductor
*频域化合物半导体之旅
Dr. BARRY JIA-FU LIN 林嘉孚
CTO, Wavetek Microelectronics
技術長，聯穎光電股份有限公司
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09:45-10:15
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Research and Development on High Power Semiconductor Edge and Surface Emitting Lasers
*高功率半导体边缘及表面发射激光器的研究与开发
Shunfeng LI 李顺峰
Executive Director, Suzhou Everbright Institute of Semiconductor Lasers
执行总监，苏州长光华芯光电技术股份有限公司
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10:15-10:40
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An Introduction to The Reliability Test & Verification Technology for Compound Semiconductor and Integrated Circuit
*化合物半导体及集成电路可靠性测试与验证技术简介
Yinfei XUE
VP, Shanghai FeedliTech Co.,Ltd.
副总裁，上海菲莱测试技术有限公司
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10:40-11:05
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Scaling Compound Semiconductor Materials for Future Markets
*面向未来市场的化合物半导体材料
Tim Bettles
VP of Business Development, AXT, Inc
业务发展副总裁，美国AXT公司
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11:05-11:30
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Research Progress on Antimonide Lasers
*锑化物激光器的研究进展
Yu ZHANG 张宇
Professor, IOS, CAS
教授，中科院半导体所
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Session 4: GaN, SiC Materials, Equipment and Power Device / 分会4：氮化镓，碳化硅材料、设备及功率器件应用
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Day 3- Mar.27th, 2025 Pudong Ballroom 1 / 浦东厅 1
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Moderator / 主持人：
Aris MA, CEO of AK Optics Technology Co., Ltd.
马铁中，首席执行官，昂坤视觉（北京）科技有限公司
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13:00-13:30
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Reserved
Qingdao SRI I Intellectual Technology Co., Ltd
青岛思锐智能科技股份有限公司
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13:30-14:00
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The Enabling Impact of Silicon Carbide Today and Tomorrows New Horizons
*碳化硅在当前的影响及未来的新视野
Guy Moxey
VP of Power Development, Wolfspeed
功率发展副总裁，美国科锐公司
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14:00-14:25
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High Sensitivity & Throughput Defect Inspection Technologies for SiC and GaN Power Technologies
*用于SiC和GaN功率技术的高灵敏度与高产能缺陷检测技术
Mike Rosa
Chief Marketing Officer & SVP Strategy, Onto Innovation,Inc.
首席营销官兼战略高级副总裁，美国昂托创新公司
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14:25-14:50
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Will Super-High-Voltage GaN Be the End of SiC?
*超高压氮化镓会成为碳化硅的终结者吗？
Doug Bailey
VP of Marketing, Power Integrations
市场副总裁，荷兰帕沃英蒂格盛有限公司
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14:50-15:15
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TBD
David Haynes
Vice President of Specialty Technologies and Strategic Marketing, Lam Research Corporation
特殊制程及战略营销副总裁，泛林集团
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15:15-15:40
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Innovative Semiconductors: The Key to Power-Efficient and Cost-Effective Solutions
创新半导体：实现高能效和高性价比解决方案的关键
Francesco MUGGERI
Vice President for Power Discrete and Analog Products, China, STMicroelectronics
亚太区功率分立和模拟产品器件部市场和应用副总裁，意法半导体
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15:40-16:05
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Proposal for Solving Problems Using 4H-SiC Bonded Substrate
*解决 4H-SiC 键合衬底的使用问题的建议
Koya Shimizu
President, SICOXS CORPORATION
总裁，日本SICOXS有限公司
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16:05-16:35
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Closing Keynote：Recent Progress of 200 mm SiC Crystal Growth and Homoepitaxy
*闭幕演讲：8寸碳化硅晶体生长及同质外延最新进展
Chunjun LIU 刘春俊
CTO, Beijing Tankeblue Semiconductor Company
首席技术官，北京天科合达半导体股份有限公司
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16:35-16:45
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Lucky Draw 幸运抽奖
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